- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
Attribute column
Manufacturer
Microchip Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening |
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 AX2000-1FG1152I Microchip | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 1152 | - | 400.011771 mg | 1152 | - | 763 MHz | MICROSEMI CORP | Microsemi Corporation | AX2000-1FG1152I | - | 3 | 684 | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 20 | 5.3 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | - | - | - | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | - | BOTTOM | BALL | 225 | 1 mm | unknown | 763 MHz | - | S-PBGA-B1152 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 36 kB | 850 ps | 850 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | - | 2e+06 | 763 MHz | 21504 | 1 | 21504 | 0.84 ns | 21504 | 32256 | 2000000 | 1.73 mm | 35 mm | 35 mm | No | ||
A42MX16-3PQ160I Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 160-BQFP | YES | 160 | 160-PQFP (28x28) | 5.566797 g | 160 | A42MX16 | 129 MHz | MICROSEMI CORP | Microsemi Corporation | A42MX16-3PQ160I | Microchip Technology | 3 | 125 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | - | SQUARE | FLATPACK | Obsolete | QFP | Obsolete | 30 | 5.24 | Compliant | No | 3.6 V | 3 V | 3.3 V | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | - | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 225 | 0.65 mm | compliant | - | 160 | S-PQFP-G160 | - | Not Qualified | 5 V | - | INDUSTRIAL | 5.5 V | 3 V | - | - | - | - | 1232 CLBS, 24000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 608 | - | 24000 | 237 MHz | 608 | 3 | 928 | 1.9 ns | 1232 | - | 24000 | 3.4 mm | 28 mm | 28 mm | No | ||
RT4G150L-CGG1657PROTO Microchip | In Stock | - | - | - | - | Through Hole | 1657-BFCPGA | - | - | 1657-CCGA (42.5x42.5) | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | -55°C ~ 125°C (TJ) | RTG4™ | - | - | - | - | - | - | - | - | 1.14V ~ 1.26V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 151824 | 5325 | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
RT4G150-CQG352B Microchip | In Stock | - | - | - | - | Surface Mount | 352-BFCQFP Exposed Pad | - | - | 352-QFP (48x48) | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | -55°C ~ 125°C (TJ) | RTG4™ | - | - | - | - | - | - | - | - | 1.14V ~ 1.26V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 151824 | 5325 | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
RT4G150-1LGG1657B Microchip | In Stock | - | - | - | - | Surface Mount | 1657-BCLGA | - | - | 1657-CLGA (42.5x42.5) | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | -55°C ~ 125°C (TJ) | RTG4™ | - | - | - | - | - | - | - | - | 1.14V ~ 1.26V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 151824 | 5325 | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
AX1000-1FG896I Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 896 | - | 400.011771 mg | 896 | - | 763 MHz | MICROSEMI CORP | Microsemi Corporation | AX1000-1FG896I | - | 3 | 516 | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 30 | 5.31 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | - | - | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | - | BOTTOM | BALL | 225 | 1 mm | unknown | 763 MHz | - | S-PBGA-B896 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | - | 1e+06 | 763 MHz | 12096 | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 31 mm | 31 mm | No | ||
RT4G150L-CQG352PROTO Microchip | In Stock | - | - | - | - | Surface Mount | 352-BFCQFP Exposed Pad | - | - | 352-QFP (48x48) | - | - | - | - | - | - | - | Microchip Technology | - | 166 | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | -55°C ~ 125°C | RTG4™ | - | - | - | - | - | - | - | - | 1.2V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 151824 | 5200000 | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
M1A3P600L-1PQ208I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | 350 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3P600L-1PQ208I | - | 3 | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | - | 30 | 5.25 | - | No | 1.575 V | 1.14 V | 1.2 V | - | - | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | - | QUAD | GULL WING | 225 | 0.5 mm | compliant | - | - | S-PQFP-G208 | 154 | Not Qualified | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | 13824 | 13824 | 600000 | - | 28 mm | 28 mm | - | ||
M1A3P400-2FG484 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | 350 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3P400-2FG484 | - | 3 | - | 85 °C | - | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | - | 30 | 5.25 | - | No | 1.575 V | 1.425 V | 1.5 V | - | - | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | CMOS | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B484 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | 9216 | - | 400000 | - | 23 mm | 23 mm | - | ||
M1AFS600-2PQ208 Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 208 | - | - | 208 | - | - | MICROSEMI CORP | Microsemi Corporation | M1AFS600-2PQ208 | - | 3 | 95 | 85 °C | - | - | PLASTIC/EPOXY | QFF | QFF, | - | RECTANGULAR | FLATPACK | Obsolete | - | - | 30 | 5.88 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | - | - | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | - | 8542.39.00.01 | - | CMOS | - | QUAD | FLAT | 225 | 0.5 mm | compliant | - | - | R-PQFP-F208 | - | Not Qualified | 1.5 V | - | OTHER | 1.575 V | 1.425 V | 13.5 kB | - | - | - | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 600000 | 1.47059 GHz | - | 2 | 13824 | - | 13824 | - | 600000 | 3.4 mm | 28 mm | 28 mm | No | ||
M7AFS600-PQG208 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | - | MICROSEMI CORP | Microsemi Corporation | M7AFS600-PQG208 | - | 3 | - | 70 °C | - | - | PLASTIC/EPOXY | FQFP | FQFP, | - | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | - | 40 | 5.8 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | e3 | MATTE TIN | - | - | - | 8542.39.00.01 | - | CMOS | - | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | - | S-PQFP-G208 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 600000 | - | 28 mm | 28 mm | - | ||
M2GL010-1TQ144I Microchip | In Stock | - | - | - | - | Surface Mount | 144-LQFP | YES | - | 144-TQFP (20x20) | - | 144 | - | - | MICROSEMI CORP | Microsemi Corporation | M2GL010-1TQ144I | Microchip Technology | 3 | 84 | - | - | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | - | Obsolete | 20 | 5.57 | - | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | - | - | - | - | - | 8542.39.00.01 | - | - | 1.14V ~ 2.625V | QUAD | GULL WING | 240 | 0.5 mm | compliant | - | - | S-PQFP-G144 | - | - | - | - | - | - | - | - | - | - | - | - | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | - | - | - | - | - | - | - | - | - | - | 20 mm | 20 mm | - | ||
M1A3P1000L-PQG208 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | 350 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3P1000L-PQG208 | - | 3 | - | 70 °C | - | - | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | - | 40 | 5.27 | - | Yes | 1.575 V | 1.14 V | 1.2 V | - | - | e3 | MATTE TIN | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | - | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | - | S-PQFP-G208 | 154 | Not Qualified | - | 1.5/3.3 V | COMMERCIAL | - | - | - | - | - | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | 24576 | 24576 | 1000000 | - | 28 mm | 28 mm | - | ||
M1AGL600V2-FG484 Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | - | - | 400.011771 mg | 484 | - | 108 MHz | MICROSEMI CORP | Microsemi Corporation | M1AGL600V2-FG484 | - | 3 | 235 | 85 °C | - | - | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | - | SQUARE | GRID ARRAY | Obsolete | - | - | 30 | 5.86 | Non-Compliant | No | 1.575 V | 1.14 V | 1.2 V | - | - | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | - | 8542.39.00.01 | - | CMOS | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B484 | - | Not Qualified | 1.5 V | - | OTHER | 1.575 V | 1.14 V | 13.5 kB | - | - | - | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | - | 600000 | - | - | - | - | - | 13824 | - | 600000 | 1.73 mm | 23 mm | 23 mm | - | ||
M1A3P400-2FGG484 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | 350 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3P400-2FGG484 | - | 3 | - | 85 °C | - | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | - | 40 | 5.25 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | CMOS | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | 9216 | - | 400000 | - | 23 mm | 23 mm | - | ||
M1A3P600L-FG256I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 256 | - | 350 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3P600L-FG256I | - | 3 | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 30 | 5.25 | - | No | 1.575 V | 1.14 V | 1.2 V | - | - | - | TIN LEAD/TIN LEAD SILVER | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B256 | 177 | Not Qualified | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | 13824 | 13824 | 600000 | - | 17 mm | 17 mm | - | ||
M1AFS250-1PQG208 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | - | MICROSEMI CORP | Microsemi Corporation | M1AFS250-1PQG208 | - | 3 | - | 85 °C | - | - | PLASTIC/EPOXY | QFF | QFF, | - | RECTANGULAR | FLATPACK | Obsolete | - | - | 40 | 5.82 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | e3 | MATTE TIN | - | - | - | 8542.39.00.01 | - | CMOS | - | QUAD | FLAT | 245 | 0.5 mm | compliant | - | - | R-PQFP-F208 | - | Not Qualified | - | - | OTHER | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | 6144 | - | 250000 | - | 30.6 mm | 28 mm | - | ||
M7AFS600-2PQG208 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | - | MICROSEMI CORP | Microsemi Corporation | M7AFS600-2PQG208 | - | 3 | - | 70 °C | - | - | PLASTIC/EPOXY | FQFP | FQFP, | - | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | - | 40 | 5.8 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | e3 | MATTE TIN | - | - | - | 8542.39.00.01 | - | CMOS | - | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | - | S-PQFP-G208 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 600000 | - | 28 mm | 28 mm | - | ||
M1AGLE3000V2-FG896I Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 896 | - | 400.011771 mg | 896 | - | - | MICROSEMI CORP | Microsemi Corporation | M1AGLE3000V2-FG896I | - | 3 | 620 | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | FBGA-896 | - | SQUARE | GRID ARRAY | Obsolete | - | - | 20 | 5.88 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | - | - | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | - | 8542.39.00.01 | - | CMOS | - | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B896 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | 1.575 V | 1.14 V | 63 kB | - | - | - | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 75264 | - | 3e+06 | 892.86 MHz | - | - | 75264 | - | 75264 | - | 3000000 | 1.73 mm | 31 mm | 31 mm | No | ||
A54SX16A-FG256I Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |