- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
Attribute column
Manufacturer
Microchip Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Logic Cells | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Propagation Delay | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() A42MX24-PQG160A Microchip Technology | 2177 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | PQFP-160 | YES | 160 | 160-PQFP (28x28) | 5.566797 g | 160 | - | - | A42MX24 | 124 MHz | - | 24 | - | MICROSEMI CORP | - | A42MX24-PQG160A | 135 MHz | - | + 125 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | 125 I/O | - | - | - | - | - | - | - | - | - | - | - | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | - | SQUARE | FLATPACK | - | Active | - | Active | - | - | 40 | 5.6 | Details | Yes | - | - | 5.25 V | 4.75 V | 5 V | - | Actel | - | 0.196363 oz | -40°C ~ 125°C (TA) | Tray | A42MX24 | e3 | - | Matte Tin (Sn) | 125 °C | -40 °C | CAN ALSO BE OPERATED AT 5.0V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.65 mm | compliant | - | - | S-PQFP-G160 | - | Not Qualified | 5 V | - | AUTOMOTIVE | 5.25 V | 4.75 V | - | - | 2 ns | - | - | 1890 CLBS, 36000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 36000 | 135 MHz | - | - | STD | - | 1410 | 2 ns | 1890 | - | 36000 | 3.4 mm | 28 mm | 28 mm | No | - | ||
![]() AGLP060V5-CSG289I Microchip Technology | 50 |
| - | - | - | Surface Mount | CSP-289 | YES | - | 289-CSP (14x14) | - | 289 | - | - | AGLP060 | 250 MHz | - | 119 | - | MICROSEMI CORP | - | AGLP060V5-CSG289I | 892.86 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | 157 I/O | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA289,17X17,32 | BGA289,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | - | Active | - | Obsolete | - | - | NOT SPECIFIED | 1.43 | Details | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | IGLOO PLUS | - | - | -40°C ~ 100°C (TJ) | Tray | AGLP060V5 | - | - | - | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | - | - | S-PBGA-B289 | 157 | Not Qualified | 1.5 V | 1.5 V | INDUSTRIAL | - | - | - | - | - | - | 157 | 1584 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 1584 | 18432 | 60000 | - | - | - | - | - | - | - | 1584 | 1584 | 60000 | 0.81 mm | 14 mm | 14 mm | - | - | ||
![]() A54SX16A-TQG100 Microchip Technology | 415 |
| - | - | - | Surface Mount | TQFP-100 | - | - | 100-TQFP (14x14) | - | - | 81 | 990 | A54SX16 | - | 24000 | 90 | SX-A | - | 924 | - | 227 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | - | Surface Mount | SMD/SMT | 81 I/O | - | 1452 | - | 16000 | 2.75(V) | 2.25(V) | 2.5(V) | 0C to 70C | 70C | 0C | Commercial | - | - | Tray | - | - | - | - | - | - | TQFP | - | 0.25um | Active | Yes | No | - | - | Details | - | - | - | 2.75 V | 2.25 V | - | - | Actel | - | 0.023175 oz | 0°C ~ 70°C (TA) | Tray | A54SX16A | - | - | - | - | - | - | - | - | 2.25V ~ 5.25V | - | - | - | - | - | 227(MHz) | 100 | - | - | - | 2.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 24000 | - | 1452 | - | - | - | - | - | - | - | - | 1.4 mm | 14 mm | 14 mm | - | - | ||
![]() A3PE3000L-1FGG484 Microchip Technology | 628 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | - | - | A3PE3000 | 250 MHz | - | 60 | - | MICROSEMI CORP | - | A3PE3000L-1FGG484 | 892.86 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | - | SMD/SMT | 341 I/O | - | - | - | - | - | - | - | - | - | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 40 | 5.3 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | A3PE3000L | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | - | 63 kB | - | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 516096 | 3000000 | 892.86 MHz | - | - | 1 | - | 75264 | - | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | No | - | ||
![]() A3P1000-1FG144I Microchip Technology | 2195 |
| - | - | - | Surface Mount | FBGA | YES | - | 144-FPBGA (13x13) | - | 144 | - | - | A3P1000 | 350 MHz | - | 160 | - | MICROSEMI CORP | - | A3P1000-1FG144I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | - | SMD/SMT | 97 I/O | - | - | 11000 LE | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | - | Active | - | Active | - | - | 30 | 5.23 | N | No | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P1000 | e0 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 147456 | 1000000 | - | - | - | 1 | - | - | - | 24576 | - | 1000000 | - | 13 mm | 13 mm | - | - | ||
![]() A3PE3000L-FGG484I Microchip Technology | 703 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | - | - | A3PE3000 | 250 MHz | - | 60 | - | MICROSEMI CORP | - | A3PE3000L-FGG484I | 781.25 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | - | SMD/SMT | 341 I/O | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 40 | 5.3 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE3000L | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | - | 63 kB | - | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 516096 | 3000000 | 781.25 MHz | - | - | STD | - | 75264 | - | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | No | Lead Free | ||
![]() A3P250-PQ208I Microchip Technology | In Stock | - | - | - | - | Surface Mount | PQFP-208 | - | - | 208-PQFP (28x28) | - | - | - | - | A3P250 | - | - | 24 | - | - | - | - | 231 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | - | - | SMD/SMT | 151 I/O | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Obsolete | - | - | - | - | N | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | - | - | ProASIC3 | - | 0.183425 oz | -40°C ~ 100°C (TJ) | Tray | A3P250 | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | 36864 | 250000 | - | - | - | - | - | - | - | - | - | - | 3.4 mm | 28 mm | 28 mm | - | - | ||
![]() A42MX24-TQG176I Microchip Technology | 2755 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | TQFP-176 | YES | 176 | 176-TQFP (24x24) | - | 176 | 150 | 1410 | A42MX24 | 91.8 MHz | 36000 | 40 | 42MX | MICROSEMI CORP | 912 | A42MX24-TQG176I | - | 5.5 V | + 85 C | Microchip Technology | 3 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 150 I/O | - | 912 | 912 LE | 36000 | 5.5(V) | 3(V) | 3.3/5(V) | -40C to 85C | 85C | -40C | Industrial | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | TQFP | Active | 0.45UM | Active | Yes | No | 40 | 5.29 | Details | Yes | 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000 | - | 5.5 V | 3 V | 3.3 V | - | Actel | 3.3, 5 V | - | -40 to 85 °C | Tray | A42MX24 | e3 | - | Matte Tin (Sn) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | 176 | S-PQFP-G176 | - | Not Qualified | 3.3 V, 5 V | - | INDUSTRIAL | 5.5 V | 3 V | - | - | - | - | - | 1890 CLBS, 36000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 912 | - | 36000 | 250 MHz | - | 912 | STD | - | 1410 | 2.5 ns | 1890 | - | 36000 | 1.4 mm | 24 mm | 24 mm | No | Lead Free | ||
![]() A3P400-1PQG208I Microchip Technology | 30 |
| - | - | - | Surface Mount | PQFP-208 | YES | - | 208-PQFP (28x28) | - | 208 | - | - | A3P400 | 350 MHz | - | 24 | - | MICROSEMI CORP | - | A3P400-1PQG208I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | - | SMD/SMT | 151 I/O | - | - | 4500 LE | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | - | SQUARE | FLATPACK, FINE PITCH | - | Active | - | Active | - | - | 40 | 5.24 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | 55296 bit | ProASIC3 | 1.5000 V | - | -40 to 85 °C | Tray | A3P400 | e3 | - | Matte Tin (Sn) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | - | S-PQFP-G208 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | 30 mA | - | - | - | - | 9216 CLBS, 400000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 55296 | 400000 | - | - | - | 1 | - | - | - | 9216 | - | 400000 | 3.4 mm | 28 mm | 28 mm | - | - | ||
![]() APA600-FG256I Microchip Technology | 637 |
| - | - | - | Surface Mount | FBGA | - | - | 256-FPBGA (17x17) | - | - | - | - | APA600 | - | - | 90 | - | - | - | - | 180 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | - | - | SMD/SMT | 186 I/O | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | N | - | - | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | - | - | Actel | - | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA600 | - | - | - | - | - | - | - | - | 2.3V ~ 2.7V | - | - | - | - | - | - | - | - | - | - | 2.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | 129024 | 600000 | - | - | - | STD | - | - | - | - | - | - | 1.2 mm | 17 mm | 17 mm | - | - | ||
![]() A3P1000-1PQ208M Microchip Technology | 300 | - | - | - | - | Surface Mount | PQFP-208 | YES | - | 208-PQFP (28x28) | - | 208 | - | - | A3P1000 | 350 MHz | - | 24 | - | MICROSEMI CORP | - | A3P1000-1PQ208M | 350 MHz | - | + 125 C | Microchip Technology | - | - 55 C | Yes | 3 | - | SMD/SMT | 154 I/O | - | - | 11000 LE | - | - | - | - | - | - | - | - | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | 0.50 MM PITCH, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | - | Obsolete | - | Obsolete | - | - | 30 | 5.24 | N | No | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | - | - | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | - | - | S-PQFP-G208 | 154 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | - | - | 8 mA | - | - | - | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 147456 | 1000000 | - | - | - | - | - | - | - | 24576 | 24576 | 1000000 | - | 28 mm | 28 mm | - | - | ||
![]() EX128-TQG100A Microchip Technology | 9 |
| - | - | - | Surface Mount | TQFP-100 | YES | - | 100-TQFP (14x14) | - | 100 | - | - | EX128 | 250 MHz | - | 90 | - | MICROSEMI CORP | - | EX128-TQG100A | 250 MHz | - | + 125 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | 70 I/O | - | - | - | - | - | - | - | - | - | - | - | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | - | Active | - | Active | - | - | 40 | 5.59 | Details | Yes | - | - | 2.7 V | 2.3 V | - | - | Actel | - | 0.023175 oz | -40°C ~ 125°C (TA) | Tray | eX128 | e3 | - | Matte Tin (Sn) | - | - | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | - | S-PQFP-G100 | - | - | 2.5 V | - | AUTOMOTIVE | - | - | - | - | - | - | - | 6000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 256 | - | 6000 | - | - | - | STD | - | - | 1 ns | - | - | 6000 | 1.4 mm | 14 mm | 14 mm | - | - | ||
![]() AGL250V5-CSG196I Microchip Technology | 17 |
| - | - | - | Surface Mount | CSP-196 | YES | - | 196-CSP (8x8) | - | 196 | - | - | AGL250 | 108 MHz | - | 348 | - | MICROSEMI CORP | - | AGL250V5-CSG196I | 250 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | - | SMD/SMT | 143 I/O | - | - | 3000 LE | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | - | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | - | Active | - | Active | - | - | NOT SPECIFIED | 5.29 | Details | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | IGLOOe | 1.5000 V | - | -40 to 85 °C | Tray | AGL250V5 | - | - | - | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PBGA-B196 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | 20 uA | - | - | - | - | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | 36864 | 250000 | - | - | - | STD | - | - | - | 6144 | - | 250000 | 1.2 mm | 8 mm | 8 mm | - | - | ||
![]() A3PE600-FG484I Microchip Technology | 2595 |
| - | - | - | Surface Mount | FBGA | YES | - | 484-FPBGA (23x23) | - | 484 | - | - | A3PE600 | 350 MHz | - | 60 | - | MICROSEMI CORP | - | A3PE600-FG484I | 231 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | - | SMD/SMT | 270 I/O | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 30 | 1.76 | N | No | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE600 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B484 | 270 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | - | - | - | STD | - | - | - | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | - | - | ||
![]() AGL250V2-FG144I Microchip Technology | 47 |
| - | - | - | Surface Mount | FBGA-144 | YES | - | 144-FPBGA (13x13) | - | 144 | - | - | AGL250 | 108 MHz | - | 160 | - | MICROSEMI CORP | - | AGL250V2-FG144I | 526.32 MHz, 892.86 MHz | 1.575 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | - | SMD/SMT | 97 I/O | - | - | 3000 LE | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | - | Active | - | Active | - | - | 30 | 1.52 | N | No | - | - | 1.575 V | 1.14 V | 1.2 V | - | IGLOOe | 1.2, 1.5 V | 0.014110 oz | -40 to 85 °C | Tray | AGL250V2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | - | - | S-PBGA-B144 | - | Not Qualified | 1.2 V to 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | 36864 | 250000 | - | - | - | STD | - | - | - | 6144 | - | 250000 | 1.05 mm | 13 mm | 13 mm | - | - | ||
![]() AGL250V5-FGG144I Microchip Technology | 1260 | - | - | - | - | Surface Mount | FBGA-144 | YES | - | 144-FPBGA (13x13) | - | 144 | - | - | AGL250 | 108 MHz | - | 160 | - | MICROSEMI CORP | - | AGL250V5-FGG144I | 892.86 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | - | SMD/SMT | 97 I/O | - | - | 3000 LE | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | - | Active | - | Active | - | - | 40 | 1.35 | Details | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | 36864 bit | IGLOOe | - | 0.013369 oz | -40°C ~ 85°C (TA) | Tray | AGL250V5 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | 36864 | 250000 | - | - | - | STD | - | - | - | 6144 | - | 250000 | 1.05 mm | 13 mm | 13 mm | - | - | ||
![]() AFS1500-FGG256 Microchip Technology | 2926 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | - | 256 | 256-FPBGA (17x17) | 400.011771 mg | - | - | - | AFS1500 | - | - | 90 | - | - | - | - | 1098.9 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | - | - | SMD/SMT | 119 I/O | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | Details | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | - | - | Fusion | - | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | - | - | - | 70 °C | 0 °C | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | 1.0989 GHz | - | - | - | - | 1.5 V | - | - | 1.575 V | 1.425 V | - | 33.8 kB | - | - | - | - | - | - | - | 276480 | 1500000 | 1.0989 GHz | - | - | STD | - | 38400 | - | - | - | - | 1.2 mm | 17 mm | 17 mm | No | Lead Free | ||
![]() M7A3P1000-2FGG484 Microchip Technology | 2221 |
| - | - | Surface Mount | Surface Mount | FBGA | - | 484 | 484-FPBGA (23x23) | 400.011771 mg | - | - | - | M7A3P1000 | - | - | 60 | - | - | - | - | 310 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | - | - | SMD/SMT | 300 I/O | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | Details | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | - | - | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M7A3P1000 | - | - | - | 70 °C | 0 °C | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | 310 MHz | - | - | - | - | 1.5 V | - | - | 1.575 V | 1.425 V | - | 18 kB | - | - | - | - | - | - | - | 147456 | 1000000 | 310 MHz | - | - | 2 | - | 24576 | - | - | - | - | 1.73 mm | 23 mm | 23 mm | No | - | ||
![]() APA150-TQG100A Microchip Technology | 2124 |
| - | - | - | Surface Mount | TQFP-100 | - | - | 100-TQFP (14x14) | - | - | - | - | APA150 | - | - | 90 | - | - | - | - | 180 MHz | - | + 125 C | Microchip Technology | - | - 40 C | Yes | - | - | SMD/SMT | 66 I/O | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | Details | - | - | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | - | - | Actel | - | 0.023175 oz | -40°C ~ 125°C (TJ) | Tray | APA150 | - | - | - | - | - | - | - | - | 2.375V ~ 2.625V | - | - | - | - | - | - | - | - | - | - | 2.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | 36864 | 150000 | - | - | - | - | - | - | - | - | - | - | 1.4 mm | 14 mm | 14 mm | - | - | ||
![]() APA300-FG256I Microchip Technology | 2918 |
| - | - | - | Surface Mount | FBGA | YES | - | 256-FPBGA (17x17) | - | 256 | - | - | APA300 | 180 MHz | - | 90 | - | MICROSEMI CORP | - | APA300-FG256I | 180 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | 186 I/O | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | NOT SPECIFIED | 1.62 | N | No | - | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | - | Actel | - | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA300 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | unknown | - | - | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | 186 | 300000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 73728 | 300000 | - | - | - | - | - | - | - | - | 8192 | 300000 | 1.2 mm | 17 mm | 17 mm | - | - |