- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
Attribute column
Manufacturer
Microchip Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Logic Cells | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() A3P400-2FGG256I Microchip Technology | 30 |
| - | - | - | - | Surface Mount | FBGA | - | - | 256-FPBGA (17x17) | - | - | - | - | A3P400 | - | - | 90 | - | - | - | - | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | - | - | SMD/SMT | - | 178 I/O | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | Details | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P400 | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 55296 | 400000 | - | - | - | 2 | - | - | - | - | - | - | 1.2 mm | 17 mm | 17 mm | - | - | ||
![]() APA300-FG144I Microchip Technology | 2040 | - | - | - | - | - | Surface Mount | FBGA | YES | - | 144-FPBGA (13x13) | - | 144 | - | - | APA300 | 180 MHz | - | 160 | - | MICROSEMI CORP | - | APA300-FG144I | 180 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | - | 100 I/O | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | - | Active | - | Active | - | - | 30 | 1.62 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | - | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA300 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | 100 | 300000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 73728 | 300000 | - | - | - | - | - | - | - | - | 8192 | 300000 | 1.05 mm | 13 mm | 13 mm | - | - | ||
![]() A3P600-1FGG256 Microchip Technology | 31 |
| - | - | - | - | Surface Mount | FBGA | YES | - | 256-FPBGA (17x17) | - | 256 | - | - | A3P600 | 350 MHz | - | 90 | - | MICROSEMI CORP | - | A3P600-1FGG256 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | - | SMD/SMT | - | 177 I/O | - | - | - | - | - | - | - | - | - | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P600 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | - | - | - | 1 | - | - | - | 13824 | - | 600000 | 1.2 mm | 17 mm | 17 mm | - | - | ||
![]() AFS1500-FG484I Microchip Technology | 666 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | - | - | AFS1500 | - | - | 60 | - | MICROSEMI CORP | - | AFS1500-FG484I | 1098.9 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | - | 223 I/O | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 30 | 5.29 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | - | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | AFS1500 | e0 | - | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 1.0989 GHz | - | S-PBGA-B484 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | 1.575 V | 1.425 V | - | 33.8 kB | - | - | - | - | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 276480 | 1500000 | 1.0989 GHz | - | - | STD | - | 38400 | - | 38400 | - | 1500000 | 1.73 mm | 23 mm | 23 mm | No | Contains Lead | ||
![]() AGLN010V5-UCG36 Microchip Technology | 15234 | - | - | - | - | - | Surface Mount | UCSP-36 | YES | - | 36-UCSP (3x3) | - | 36 | - | - | AGLN010 | - | - | 490 | - | MICROSEMI CORP | - | AGLN010V5-UCG36 | 250 MHz | - | + 85 C | Microchip Technology | - | - 20 C | Yes | - | - | SMD/SMT | - | 23 I/O | - | - | 100 LE | - | - | - | - | - | - | - | - | 70 °C | -20 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | Active | - | Active | - | - | NOT SPECIFIED | 2.07 | Details | Yes | - | 1.575 V | 1.425 V | 1.5 V | IGLOO nano | - | 0.000547 oz | -20°C ~ 85°C (TJ) | Tray | AGLN010V5 | - | - | - | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.4 mm | compliant | - | - | S-PBGA-B36 | - | Not Qualified | 1.5 V | - | OTHER | - | - | - | - | - | - | - | - | 260 CLBS, 10000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 260 | - | 10000 | - | - | - | STD | - | - | - | 260 | - | 10000 | - | 3 mm | 3 mm | - | - | ||
![]() AX2000-1FG896 Microchip Technology | 558 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | - | - | AX2000 | 763 MHz | - | 27 | - | MICROSEMI CORP | - | AX2000-1FG896 | 763 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | - | SMD/SMT | - | 586 I/O | - | - | 21504 LE | - | - | - | - | - | - | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | - | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX2000 | e0 | - | TIN LEAD | 70 °C | 0 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 763 MHz | - | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | - | 36 kB | 850 ps | 850 ps | - | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 763 MHz | 32256 | 21504 | 1 | - | 21504 | 0.84 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | Contains Lead | ||
![]() A3PE3000-2FGG324I Microchip Technology | 993 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | Surface Mount | FBGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | - | - | A3PE3000 | - | - | 84 | - | MICROSEMI CORP | - | A3PE3000-2FGG324I | 310 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | - | 221 I/O | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | - | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3PE3000 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B324 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | 1.575 V | 1.425 V | 25 mA | 63 kB | - | - | - | - | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 516096 | 3000000 | 310 MHz | - | - | 2 | - | 75264 | - | 75264 | - | 3000000 | 1.25 mm | 19 mm | 19 mm | No | - | ||
![]() AGL030V2-VQ100I Microchip Technology | 14 |
| - | - | - | - | Surface Mount | VQFP | YES | - | 100-VQFP (14x14) | - | 100 | - | - | AGL030 | 108 MHz | - | 90 | - | MICROSEMI CORP | - | AGL030V2-VQ100I | 526.32 MHz, 892.86 MHz | 1.575 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | - | SMD/SMT | - | 77 I/O | - | - | 330 LE | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | - | Active | - | Active | - | - | 30 | 5.24 | N | No | - | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | - | -40 to 85 °C | Tray | AGL030V2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | GULL WING | 230 | 0.5 mm | unknown | - | - | S-PQFP-G100 | - | Not Qualified | 1.2 V to 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | - | 768 CLBS, 30000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | - | 30000 | - | - | - | STD | - | - | - | 768 | - | 30000 | 1 mm | 14 mm | 14 mm | - | - | ||
![]() A3P125-PQ208I Microchip Technology | In Stock | - | - | - | - | - | Surface Mount | PQFP-208 | YES | - | 208-PQFP (28x28) | - | 208 | 133 | 3072 | A3P125 | 350 MHz | 125000 | 24 | ProASIC®3 | MICROSEMI CORP | - | A3P125-PQ208I | 231 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | - | 133 I/O | - | - | - | 125000 | 1.575(V) | 1.425(V) | 1.5(V) | -40C to 100C | 100C | -40C | Industrial | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | - | SQUARE | FLATPACK, FINE PITCH | PQFP | Obsolete | 130NM | Obsolete | Yes | No | 30 | 5.25 | N | No | - | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | - | - | -40°C ~ 100°C (TJ) | Tray | A3P125 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | 231(MHz) | 208 | S-PQFP-G208 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | - | 3072 CLBS, 125000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 125000 | - | - | - | - | - | - | - | 3072 | - | 125000 | 3.4 mm | 28 mm | 28 mm | - | - | ||
![]() A42MX24-PLG84I Microchip Technology | 2328 |
| - | Production (Last Updated: 2 months ago) | Tin | Surface Mount | Surface Mount | PLCC-84 | YES | 84 | 84-PLCC (29.31x29.31) | 6.777889 g | 84 | - | - | A42MX24 | 91.8 MHz | - | 16 | - | MICROSEMI CORP | - | A42MX24-PLG84I | 250 MHz | 5.5 V | + 85 C | Microchip Technology | 3 V | - 40 C | Yes | 3 | - | SMD/SMT | - | 72 I/O | - | - | 912 LE | - | - | - | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | - | Active | - | Active | - | - | 40 | 5.29 | Details | Yes | - | 5.5 V | 3 V | 3.3 V | Actel | 3.3, 5 V | 0.239083 oz | -40 to 85 °C | Tube | A42MX24 | e3 | - | Matte Tin (Sn) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | - | - | S-PQCC-J84 | - | Not Qualified | 3.3 V, 5 V | - | INDUSTRIAL | 5.5 V | 3 V | - | - | - | - | - | - | 1890 CLBS, 36000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 912 | - | 36000 | 250 MHz | - | 912 | STD | - | 1410 | 2.5 ns | 1890 | - | 36000 | 3.68 mm | 29.31 mm | 29.31 mm | No | - | ||
![]() A40MX02-PLG44I Microchip Technology | 113 |
| - | - | - | - | Surface Mount | PLCC-44 | YES | - | 44-PLCC (16.59x16.59) | - | 44 | - | - | A40MX02 | 80 MHz | - | 27 | - | MICROSEMI CORP | - | A40MX02-PLG44I | 139 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | - | 34 I/O | 295 LAB | - | 295 LE | - | - | - | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | ROHS COMPLIANT, PLASTIC, LCC-44 | - | SQUARE | CHIP CARRIER | - | Active | - | Active | - | - | NOT SPECIFIED | 5.28 | Details | Yes | - | 5.5 V | 3 V | 3.3 V | Actel | 3.3, 5 V | 0.084185 oz | -40 to 85 °C | Tube | A40MX02 | e3 | - | Tin (Sn) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | NOT SPECIFIED | 1.27 mm | compliant | - | - | S-PQCC-J44 | - | Not Qualified | 3.3 V, 5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | - | 295 CLBS, 3000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 3000 | - | - | - | STD | - | - | 2.7 ns | 295 | - | 3000 | 3.68 mm | 16.59 mm | 16.59 mm | - | - | ||
![]() APA1000-BG456 Microchip Technology | 795 |
| - | - | - | - | Surface Mount | BGA-456 | YES | - | 456-PBGA (35x35) | - | 456 | - | - | APA1000 | 180 MHz | - | 24 | - | MICROSEMI CORP | - | APA1000-BG456 | 180 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | 3 | - | SMD/SMT | - | 356 I/O | - | - | - | - | - | - | - | - | - | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | - | - | 0°C ~ 70°C (TA) | Tray | APA1000 | - | - | TIN LEAD/TIN LEAD SILVER | - | - | - | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | - | - | S-PBGA-B456 | 356 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | - | - | - | - | - | - | - | 356 | 1000000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 202752 | 1000000 | - | - | - | STD | - | - | - | - | 56320 | 1000000 | 1.73 mm | 35 mm | 35 mm | - | - | ||
![]() A54SX08A-FTQG144 Microchip Technology | 30 |
| - | - | - | - | Surface Mount | TQFP-144 | YES | - | 144-TQFP (20x20) | - | 144 | - | - | A54SX08 | 172 MHz | - | 60 | - | MICROSEMI CORP | - | A54SX08A-FTQG144 | 172 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | 3 | - | SMD/SMT | - | 113 I/O | 768 LAB | - | - | - | - | - | - | - | - | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | LFQFP | 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | - | Active | - | Active | - | - | 40 | 5.23 | Details | Yes | - | 2.75 V | 2.25 V | 2.5 V | Actel | - | 0.046530 oz | 0°C ~ 70°C (TA) | Tray | A54SX08A | e3 | - | Matte Tin (Sn) | - | - | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | - | S-PQFP-G144 | 113 | Not Qualified | 2.25 V to 5.25 V | 2.5,3.3/5 V | COMMERCIAL | - | - | - | - | - | - | - | 113 | 768 CLBS, 12000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 12000 | - | 768 | - | - | - | - | 1.7 ns | 768 | 768 | 12000 | 1.4 mm | 20 mm | 20 mm | - | - | ||
![]() A3P250-1FGG144I Microchip Technology | 9 |
| - | - | - | - | Surface Mount | FBGA-144 | YES | - | 144-FPBGA (13x13) | - | 144 | - | - | A3P250 | 350 MHz | - | 160 | - | MICROSEMI CORP | - | A3P250-1FGG144I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | - | SMD/SMT | - | 97 I/O | - | - | - | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | - | SQUARE | GRID ARRAY, LOW PROFILE | - | Active | - | Active | - | - | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P250 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 250000 | - | - | - | 1 | - | - | - | 6144 | - | 250000 | 1.05 mm | 13 mm | 13 mm | - | - | ||
![]() A54SX16A-TQG144 Microchip Technology | 75 |
| - | - | - | - | Surface Mount | TQFP-144 | - | - | 144-TQFP (20x20) | - | - | 113 | 990 | A54SX16 | - | 24000 | 60 | SX-A | - | 924 | - | 227 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | - | Surface Mount | SMD/SMT | - | 113 I/O | - | 1452 | - | 16000 | 2.75(V) | 2.25(V) | 2.5(V) | 0C to 70C | 70C | 0C | Commercial | - | - | Tray | - | - | - | - | - | - | TQFP | - | 0.25um | Active | Yes | No | - | - | Details | - | - | 2.75 V | 2.25 V | - | Actel | - | 0.046530 oz | 0°C ~ 70°C (TA) | Tray | A54SX16A | - | - | - | - | - | - | - | - | 2.25V ~ 5.25V | - | - | - | - | - | 227(MHz) | 144 | - | - | - | 2.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 24000 | - | 1452 | - | - | - | - | - | - | - | - | 1.4 mm | 20 mm | 20 mm | - | - | ||
![]() A40MX04-PLG44 Microchip Technology | 327 |
| - | - | - | - | Surface Mount | PLCC-44 | YES | - | 44-PLCC (16.59x16.59) | - | 44 | 34 | 273 | A40MX04 | 80 MHz | 6000 | 27 | 40MX | MICROSEMI CORP | 547 | A40MX04-PLG44 | 139 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | 3 | Surface Mount | SMD/SMT | MSL 3 - 168 hours | 34 I/O | - | 547 | 547 LE | 6000 | 5.25(V) | 3(V) | 3.3/5(V) | 0C to 70C | 70C | 0C | COMMERCIALC | 70 °C | - | Tube | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | PLCC | Active | 0.45UM | Active | Yes | No | 40 | 1.51 | Details | Yes | - | 5.25 V | 3 V | 3.3 V | Actel | - | 0.084185 oz | 0°C ~ 70°C (TA) | Tube | A40MX04 | e3 | - | Matte Tin (Sn) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | 83/139(MHz) | 44 | S-PQCC-J44 | - | Not Qualified | 3.3 V, 5 V | - | COMMERCIAL | - | - | - | - | - | - | - | - | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 6000 | - | - | - | STD | - | - | 2.7 ns | 547 | - | 6000 | 3.68 mm | 16.59 mm | 16.59 mm | - | - | ||
![]() M1AGL600V2-FGG256I Microchip Technology | 2457 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | - | - | M1AGL600 | 108 MHz | - | 90 | - | MICROSEMI CORP | - | M1AGL600V2-FGG256I | - | 1.575 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | - | SMD/SMT | - | 177 I/O | - | - | - | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256 | - | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | -40 to 85 °C | Tray | M1AGL600V2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B256 | - | Not Qualified | 1.2 V to 1.5 V | - | INDUSTRIAL | 1.575 V | 1.14 V | - | 13.5 kB | - | - | - | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | - | - | - | STD | - | - | - | 13824 | - | 600000 | 1.2 mm | 17 mm | 17 mm | - | - | ||
![]() APA450-FG484 Microchip Technology | 2066 |
| - | Production (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | FBGA | - | 484 | 484-FPBGA (23x23) | 400.011771 mg | - | - | - | APA450 | - | - | 60 | - | - | - | - | 180 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | - | - | SMD/SMT | - | 344 I/O | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | N | - | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | - | Actel | - | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA450 | - | - | - | 70 °C | 0 °C | - | - | - | 2.3V ~ 2.7V | - | - | - | - | - | 180 MHz | - | - | - | - | 2.5 V | - | - | 2.7 V | 2.3 V | - | 13.5 kB | - | - | - | - | - | - | - | - | 110592 | 450000 | 180 MHz | - | - | STD | - | 12288 | - | - | - | - | 1.73 mm | 23 mm | 23 mm | No | - | ||
![]() AGL1000V2-FG256I Microchip Technology | 2293 |
| - | - | - | - | Surface Mount | FBGA | YES | - | 256-FPBGA (17x17) | - | 256 | - | - | AGL1000 | 108 MHz | - | 90 | - | MICROSEMI CORP | - | AGL1000V2-FG256I | 526.32 MHz, 892.86 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | - | 177 I/O | - | - | 11000 LE | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | - | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AGL1000V2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | - | - | S-PBGA-B256 | - | Not Qualified | 1.2 V to 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | - | - | - | STD | - | - | - | 24576 | - | 1000000 | 1.2 mm | 17 mm | 17 mm | - | - | ||
![]() A54SX32A-2BG329 Microchip Technology | 543 |
| - | - | - | - | Surface Mount | BGA-329 | YES | - | 329-PBGA (31x31) | - | 329 | - | - | A54SX32 | 313 MHz | - | 27 | - | MICROSEMI CORP | - | A54SX32A-2BG329 | 313 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | 3 | - | SMD/SMT | - | 249 I/O | - | - | - | - | - | - | - | - | - | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA329,23X23,50 | BGA329,23X23,50 | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 30 | 5.25 | N | No | - | 2.75 V | 2.25 V | 2.5 V | Actel | - | - | 0°C ~ 70°C (TA) | Tray | A54SX32A | e0 | - | TIN LEAD | - | - | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1.27 mm | unknown | - | - | S-PBGA-B329 | 249 | Not Qualified | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | - | - | - | - | - | - | - | 249 | 2880 CLBS, 48000 GATES | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 48000 | - | 2880 | - | - | - | - | 0.9 ns | 2880 | 2880 | 48000 | 1.8 mm | 31 mm | 31 mm | - | - |