- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
Attribute column
Manufacturer
Microchip Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Part Package Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() A40MX04-PLG44I Microchip Technology | 300 |
| - | - | - | - | Surface Mount | PLCC-44 | YES | - | 44-PLCC (16.59x16.59) | - | 44 | - | - | A40MX04 | 80 MHz | - | 27 | - | MICROSEMI CORP | A40MX04-PLG44I | 139 MHz | 5.5 V | + 85 C | Microchip Technology | 3 V | - 40 C | Yes | 3 | - | SMD/SMT | 34 I/O | - | 547 LE | - | - | - | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | - | Active | - | - | Active | - | - | 40 | 5.28 | Details | Yes | - | - | - | 5.5 V | 3 V | 3.3 V | Actel | 3.3, 5 V | 0.084185 oz | - | -40 to 85 °C | Tube | A40MX04 | e3 | - | Matte Tin (Sn) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | - | - | S-PQCC-J44 | - | Not Qualified | 3.3 V, 5 V | - | INDUSTRIAL | - | - | - | - | - | - | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 6000 | - | - | - | - | STD | - | - | 2.7 ns | 547 | - | 6000 | 3.68 mm | 16.59 mm | 16.59 mm | - | - | ||
![]() A42MX36-1CQ256 Microchip Technology | 891 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | Surface Mount | CQFP-256 | YES | 256 | 256-CQFP (75x75) | - | 256 | - | - | A42MX36 | 83 MHz | - | 1 | - | MICROSEMI CORP | A42MX36-1CQ256 | - | - | + 70 C | Microchip Technology | - | 0 C | Yes | - | - | SMD/SMT | 202 I/O | - | - | - | - | - | - | - | - | - | - | 70 °C | - | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | CERAMIC, QFP-256 | - | SQUARE | FLATPACK, GUARD RING | - | Active | QFP | - | Active | - | - | - | 5.19 | N | No | - | - | - | 3.3 V | 3.3 V | 3.3 V | Actel | - | - | - | 0°C ~ 70°C (TA) | - | A42MX36 | - | - | - | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | FLAT | - | 0.5 mm | compliant | - | 256 | S-CQFP-F256 | - | Not Qualified | 3.3 V | - | COMMERCIAL | 5.25 V | 3 V | - | 320 B | - | - | 2438 CLBS, 54000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | - | - | - | 1184 | 1 | - | 1822 | 2.3 ns | 2438 | - | 54000 | - | 36 mm | 36 mm | No | - | ||
![]() A3PE3000-2FGG896 Microchip Technology | 837 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | - | - | A3PE3000 | - | - | 27 | - | MICROSEMI CORP | A3PE3000-2FGG896 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | - | SMD/SMT | 620 I/O | - | - | - | - | - | - | - | - | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896 | - | SQUARE | GRID ARRAY | - | Active | - | - | Active | - | - | 40 | 5.3 | Details | Yes | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | - | 0.014110 oz | - | 0°C ~ 85°C (TJ) | Tray | A3PE3000 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B896 | - | Not Qualified | 1.5 V | - | COMMERCIAL | 1.575 V | 1.425 V | - | 63 kB | - | - | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 516096 | 3000000 | 310 MHz | - | - | - | 2 | - | 75264 | - | 75264 | - | 3000000 | 1.73 mm | 31 mm | 31 mm | No | - | ||
![]() AGL600V2-FGG256I Microchip Technology | 2621 |
| - | - | - | - | Surface Mount | FBGA-256 | YES | - | 256-FPBGA (17x17) | - | 256 | - | - | AGL600 | 108 MHz | - | 90 | - | MICROSEMI CORP | AGL600V2-FGG256I | 526.32 MHz, 892.86 MHz | 1.575 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | - | SMD/SMT | 177 I/O | - | 7000 LE | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | - | Active | - | - | Active | - | - | 40 | 1.42 | Details | Yes | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | - | -40 to 85 °C | Tray | AGL600V2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B256 | - | Not Qualified | 1.2 V to 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | - | - | - | - | STD | - | - | - | 13824 | - | 600000 | 1.2 mm | 17 mm | 17 mm | - | - | ||
![]() M1A3P1000-FGG484 Microchip Technology | 2437 |
| - | - | - | - | Surface Mount | FBGA | YES | - | 484-FPBGA (23x23) | - | 484 | - | - | M1A3P1000 | 350 MHz | - | 60 | - | MICROSEMI CORP | M1A3P1000-FGG484 | 231 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | 3 | - | SMD/SMT | 300 I/O | - | - | - | - | - | - | - | - | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | - | SQUARE | GRID ARRAY | - | Active | - | - | Active | - | - | 40 | 5.23 | Details | Yes | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | - | 0.014110 oz | - | 0°C ~ 85°C (TJ) | Tray | M1A3P1000 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 147456 | 1000000 | - | - | - | - | STD | - | - | - | 24576 | - | 1000000 | - | 23 mm | 23 mm | - | - | ||
![]() M1A3PE1500-PQG208I Microchip Technology | 2143 |
| - | - | - | - | Surface Mount | PQFP-208 | YES | - | 208-PQFP (28x28) | - | 208 | - | - | M1A3PE1500 | 350 MHz | - | 24 | - | MICROSEMI CORP | M1A3PE1500-PQG208I | 231 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | - | SMD/SMT | 147 I/O | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | - | Active | - | - | Active | - | - | 40 | 5.61 | Details | Yes | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | - | - | -40 to 85 °C | Tray | M1A3PE1500 | e3 | - | Matte Tin (Sn) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | - | S-PQFP-G208 | 147 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | 147 | 38400 CLBS, 1500000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 276480 | 1500000 | - | - | - | - | STD | - | - | - | 38400 | 38400 | 1500000 | 3.4 mm | 28 mm | 28 mm | - | - | ||
![]() A3P250-1FG256I Microchip Technology | 17 |
| - | - | - | - | Surface Mount | FBGA-256 | YES | - | 256-FPBGA (17x17) | - | 256 | - | - | A3P250 | 350 MHz | - | 90 | - | MICROSEMI CORP | A3P250-1FG256I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | - | SMD/SMT | 157 I/O | - | - | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | - | SQUARE | GRID ARRAY | - | Active | - | - | Active | - | - | 30 | 5.23 | N | No | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | - | -40 to 85 °C | Tray | A3P250 | - | - | TIN LEAD/TIN LEAD SILVER | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 250000 | - | - | - | - | 1 | - | - | - | 6144 | - | 250000 | 1.2 mm | 17 mm | 17 mm | - | - | ||
![]() AFS600-FGG256I Microchip Technology | 2614 |
| - | - | - | - | Surface Mount | FPBGA-256 | - | - | 256-FPBGA (17x17) | - | - | 119 | 13824 | AFS600 | - | 600000 | 90 | FUSION® | - | - | 1098.9 MHz | - | + 100 C | Microchip Technology | - | - 40 C | Yes | - | Surface Mount | SMD/SMT | 119 I/O | - | 7000 LE | 600000 | 1.575(V) | 1.425(V) | 1.5(V) | -40C to 85C | 85C | -40C | INDUSTRIALC | - | - | Tray | - | - | - | - | - | - | FBGA | - | - | 130NM | Active | Yes | No | - | - | Details | - | - | - | - | 1.575 V | 1.425 V | - | Fusion | - | 0.014110 oz | - | -40°C ~ 100°C (TJ) | Tray | AFS600 | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | 1098.9(MHz) | 256 | - | - | - | 1.5 V | - | - | - | - | - | - | - | - | - | - | - | - | 110592 | 600000 | - | - | - | - | STD | - | - | - | - | - | - | 1.2 mm | 17 mm | 17 mm | - | - | ||
![]() A42MX16-PQG100M Microchip Technology | 717 |
| - | - | - | - | Surface Mount | PQFP-100 | YES | - | 100-PQFP (20x14) | - | 100 | - | - | A42MX16 | 94 MHz | - | 66 | - | MICROSEMI CORP | A42MX16-PQG100M | 172 MHz | - | + 125 C | Microchip Technology | - | - 55 C | Yes | 3 | - | SMD/SMT | 83 I/O | - | - | - | - | - | - | - | - | - | - | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-100 | - | RECTANGULAR | FLATPACK | - | Active | - | - | Active | - | - | 40 | 5.29 | Details | Yes | - | - | - | 5.5 V | 3 V | 3.3 V | Actel | - | 0.062040 oz | - | -55°C ~ 125°C (TC) | Tray | A42MX16 | e3 | 3A001.A.2.C | Matte Tin (Sn) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.65 mm | compliant | - | - | R-PQFP-G100 | - | Not Qualified | 3.3 V, 5 V | - | MILITARY | - | - | - | - | - | - | 1232 CLBS, 24000 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 24000 | - | - | - | - | STD | - | - | 2.8 ns | 1232 | - | 24000 | 2.7 mm | 20 mm | 14 mm | - | - | ||
![]() A3P600-2FG256I Microchip Technology | 2621 |
| - | - | - | - | Surface Mount | FBGA | YES | - | 256-FPBGA (17x17) | - | 256 | - | - | A3P600 | 350 MHz | - | 90 | - | MICROSEMI CORP | A3P600-2FG256I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | - | SMD/SMT | 177 I/O | - | - | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | - | SQUARE | GRID ARRAY | - | Active | - | - | Active | - | - | 30 | 5.22 | N | No | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | - | 0.014110 oz | - | -40°C ~ 100°C (TJ) | Tray | A3P600 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | - | - | - | - | 2 | - | - | - | 13824 | - | 600000 | 1.2 mm | 17 mm | 17 mm | - | - | ||
![]() A3P030-2QNG68I Microchip Technology | 30 |
| - | - | - | - | Surface Mount | QFN EP | YES | - | 68-QFN (8x8) | - | 68 | - | - | A3P030 | - | - | 260 | - | MICROSEMI CORP | A3P030-2QNG68I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | - | SMD/SMT | 49 I/O | - | - | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | Active | - | - | Active | - | - | 30 | 5.24 | Details | Yes | - | - | - | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | - | - | -40 to 85 °C | Tray | A3P030 | - | - | - | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | - | - | S-XQCC-N68 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | 2 mA | - | - | - | 768 CLBS, 30000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 30000 | - | - | - | - | 2 | - | - | - | 768 | - | 30000 | 0.88 mm | 8 mm | 8 mm | - | - | ||
![]() M1A3PE1500-FGG484I Microchip Technology | 2317 |
| - | - | - | - | Surface Mount | FBGA | YES | - | 484-FPBGA (23x23) | - | 484 | - | - | M1A3PE1500 | 350 MHz | - | 60 | - | MICROSEMI CORP | M1A3PE1500-FGG484I | 231 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | 280 I/O | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | - | Active | - | - | Active | - | - | 40 | 5.3 | Details | Yes | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | - | 0.014110 oz | - | -40°C ~ 100°C (TJ) | Tray | M1A3PE1500 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 276480 | 1500000 | - | - | - | - | STD | - | - | - | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | - | - | ||
![]() A54SX08A-2TQG100I Microchip Technology | 2341 |
| - | - | - | - | Surface Mount | TQFP-100 | YES | - | 100-TQFP (14x14) | - | 100 | - | - | A54SX08 | 313 MHz | - | 90 | - | MICROSEMI CORP | A54SX08A-2TQG100I | 313 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | 81 I/O | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | - | Active | - | - | Active | - | - | 40 | 5.25 | Details | Yes | - | - | - | 2.75 V | 2.25 V | 2.5 V | Actel | - | 0.023175 oz | - | -40°C ~ 85°C (TA) | Tray | A54SX08A | e3 | - | Matte Tin (Sn) | - | - | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | - | S-PQFP-G100 | 130 | Not Qualified | 2.5 V | 2.5,3.3/5 V | INDUSTRIAL | - | - | - | - | - | 130 | 768 CLBS, 12000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 12000 | - | 768 | - | - | - | - | - | 0.9 ns | 768 | 768 | 12000 | 1.4 mm | 14 mm | 14 mm | - | - | ||
![]() APA600-BG456 Microchip Technology | 716 |
| - | Production (Last Updated: 1 month ago) | Lead, Silver, Tin | Surface Mount | Surface Mount | BGA-456 | YES | 456 | 456-PBGA (35x35) | - | 456 | - | - | APA600 | 180 MHz | - | 24 | - | MICROSEMI CORP | APA600-BG456 | 180 MHz | 2.7 V | + 70 C | Microchip Technology | 2.3 V | 0 C | Yes | 3 | - | SMD/SMT | 356 I/O | - | - | - | - | - | - | - | - | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | - | Active | - | - | Active | - | - | 30 | 5.25 | N | No | IC FPGA 356 I/O 456BGA | - | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | - | - | 0 to 70 °C | Tray | APA600 | - | - | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | - | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | - | 456 | S-PBGA-B456 | 356 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 2.7 V | 2.3 V | - | 15.8 kB | - | 356 | 600000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 129024 | 600000 | 180 MHz | - | - | - | STD | - | 21504 | - | - | 21504 | 600000 | 1.73 mm | 35 mm | 35 mm | No | Contains Lead | ||
![]() A42MX16-VQG100 Microchip Technology | 2578 |
| - | - | - | - | Surface Mount | VQFP | YES | - | 100-VQFP (14x14) | - | 100 | - | - | A42MX16 | 94 MHz | - | 90 | - | MICROSEMI CORP | A42MX16-VQG100 | 172 MHz | 5.25 V | + 70 C | Microchip Technology | 3 V | 0 C | Yes | 3 | - | SMD/SMT | 83 I/O | - | - | - | - | - | - | - | - | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | - | Active | - | - | Active | - | - | NOT SPECIFIED | 1.57 | Details | Yes | - | - | - | 5.25 V | 3 V | 3.3 V | Actel | 3.3, 5 V | - | - | 0 to 70 °C | Tray | A42MX16 | - | - | - | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PQFP-G100 | - | Not Qualified | 3.3 V, 5 V | - | COMMERCIAL | - | - | - | - | - | - | 1232 CLBS, 24000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 24000 | - | - | - | - | STD | - | - | 2.8 ns | 1232 | 1232 | 24000 | 1 mm | 14 mm | 14 mm | - | - | ||
![]() A54SX32A-CQ84B Microchip Technology | 763 |
| - | - | - | - | Surface Mount | CQFP-84 | YES | - | 84-CQFP (42x42) | - | 84 | - | - | A54SX32 | 217 MHz | - | 1 | - | MICROSEMI CORP | A54SX32A-CQ84B | 238 MHz | - | + 125 C | Microchip Technology | - | - 55 C | Yes | - | - | SMD/SMT | 62 I/O | - | - | - | - | - | - | - | - | - | - | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, | - | SQUARE | FLATPACK | - | Active | - | - | Active | - | - | 20 | 5.23 | N | No | - | - | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | 2.5 V | Actel | - | - | Military grade | -55°C ~ 125°C (TJ) | - | A54SX32A | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | - | - | IT CAN ALSO OPERATE WITH 3.3V AND 5V | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 225 | 0.635 mm | compliant | - | - | S-CQFP-F84 | - | Not Qualified | 2.5 V | - | MILITARY | - | - | - | - | - | - | 1800 CLBS, 48000 GATES | 2.4 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 48000 | - | 2880 | MIL-STD-883 Class B | - | - | - | - | 1.4 ns | 1800 | - | 48000 | - | 16.51 mm | 16.51 mm | - | - | ||
![]() A42MX24-PQG160I Microchip Technology | 2299 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | Surface Mount | PQFP-160 | YES | 160 | 160-PQFP (28x28) | 5.566797 g | 160 | - | - | A42MX24 | 91.8 MHz | - | 24 | - | MICROSEMI CORP | A42MX24-PQG160I | 250 MHz | 5.5 V | + 85 C | Microchip Technology | 3 V | - 40 C | Yes | 3 | - | SMD/SMT | 125 I/O | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-160 | - | SQUARE | FLATPACK | - | Active | - | - | Active | - | - | 40 | 5.28 | Details | Yes | - | 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000 | - | 5.5 V | 3 V | 3.3 V | Actel | 3.3, 5 V | 0.196363 oz | - | -40 to 85 °C | Tray | A42MX24 | e3 | - | Matte Tin (Sn) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.65 mm | compliant | - | - | S-PQFP-G160 | - | Not Qualified | 3.3 V, 5 V | - | INDUSTRIAL | 5.5 V | 3 V | - | - | - | - | 1890 CLBS, 36000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 912 | - | 36000 | 250 MHz | - | - | 912 | STD | - | 1410 | 2.5 ns | 1890 | - | 36000 | 3.4 mm | 28 mm | 28 mm | No | - | ||
![]() A42MX09-VQG100 Microchip Technology | 2735 |
| - | - | - | - | Surface Mount | VQFP-84 | YES | - | 100-VQFP (14x14) | - | 100 | - | - | A42MX09 | 117 MHz | - | 90 | - | MICROSEMI CORP | A42MX09-VQG100 | 215 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | 3 | - | SMD/SMT | 83 I/O | - | 336 LE | - | - | - | - | - | - | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | TFQFP | 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100 | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | - | Active | - | - | Active | - | - | 40 | 1.55 | Details | Yes | - | - | - | 5.25 V | 3 V | 3.3 V | Actel | - | - | - | 0°C ~ 70°C (TA) | Tray | A42MX09 | e3 | - | Matte Tin (Sn) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | - | S-PQFP-G100 | 104 | Not Qualified | 3.3 V, 5 V | 3.3,3.3/5,5 V | COMMERCIAL | - | - | - | - | - | 104 | 684 CLBS, 14000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 14000 | - | - | - | - | - | - | - | 2.5 ns | 684 | 684 | 14000 | 1 mm | 14 mm | 14 mm | - | - | ||
![]() A3P600-2FG144 Microchip Technology | 46 |
| - | - | - | - | Surface Mount | FBGA | - | - | 144-FPBGA (13x13) | - | - | - | - | A3P600 | - | - | 160 | - | - | - | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | - | - | SMD/SMT | 97 I/O | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | N | - | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | - | 0 to 70 °C | Tray | A3P600 | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | - | - | - | - | - | - | - | - | - | - | 110592 | 600000 | - | - | - | - | 2 | - | - | - | - | - | - | 1.05 mm | 13 mm | 13 mm | - | - | ||
![]() AGL400V5-FG256 Microchip Technology | In Stock | - | - | - | - | - | Surface Mount | FBGA | YES | - | 256-FPBGA (17x17) | - | 256 | - | - | AGL400 | - | - | 90 | - | MICROSEMI CORP | AGL400V5-FG256 | 250 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | - | SMD/SMT | 178 I/O | - | - | - | - | - | - | - | - | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | - | Active | - | - | Active | - | - | 30 | 5.26 | N | No | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | 0.014110 oz | - | 0 to 70 °C | Tray | AGL400V5 | e0 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | - | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | OTHER | - | - | 27 uA | - | - | - | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 55296 | 400000 | - | - | - | - | STD | - | - | - | 9216 | - | 400000 | 1.2 mm | 17 mm | 17 mm | - | - |