- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
Attribute column
Manufacturer
Microchip Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() M1A3P250-VQG100 Microchip Technology | 30 |
| - | - | - | - | Surface Mount | VQFP | YES | - | 100-VQFP (14x14) | - | 100 | M1A3P250 | 350 MHz | 90 | MICROSEMI CORP | M1A3P250-VQG100 | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 68 I/O | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100 | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | - | - | 0 to 70 °C | Tray | M1A3P250 | e3 | - | Matte Tin (Sn) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | S-PQFP-G100 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 250000 | - | - | - | - | STD | - | - | - | 6144 | - | 250000 | 1 mm | 14 mm | 14 mm | - | - | ||
![]() APA150-FGG144I Microchip Technology | 2218 |
| - | - | - | - | Surface Mount | FBGA | - | - | 144-FPBGA (13x13) | - | - | APA150 | - | 160 | - | - | 180 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | - | SMD/SMT | 100 I/O | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | - | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | - | - | Actel | - | 0.014110 oz | - | -40°C ~ 85°C (TA) | Tray | APA150 | - | - | - | - | - | - | - | - | 2.3V ~ 2.7V | - | - | - | - | - | - | - | - | - | 2.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 36864 | 150000 | - | - | - | - | STD | - | - | - | - | - | - | 1.05 mm | 13 mm | 13 mm | - | - | ||
![]() A3P250-1FGG144 Microchip Technology | 48 |
| - | - | - | - | Surface Mount | FBGA-144 | YES | - | 144-FPBGA (13x13) | - | 144 | A3P250 | 350 MHz | 160 | MICROSEMI CORP | A3P250-1FGG144 | 272 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 97 I/O | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | - | 0 to 70 °C | Tray | A3P250 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 250000 | - | - | - | - | 1 | - | - | - | 6144 | - | 250000 | 1.05 mm | 13 mm | 13 mm | - | - | ||
![]() A3PN020-2QNG68I Microchip Technology | 31 |
| - | - | - | - | Surface Mount | QFN EP | YES | - | 68-QFN (8x8) | - | 68 | A3PN020 | - | 260 | MICROSEMI CORP | A3PN020-2QNG68I | 350 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 49 I/O | - | - | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.26 | Details | Yes | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 nano | - | - | - | -40°C ~ 100°C (TJ) | Tray | A3PN020 | - | - | - | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | - | S-XQCC-N68 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | 1 mA | - | - | - | - | - | 520 CLBS, 20000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 20000 | - | - | - | - | 2 | - | - | - | 520 | - | 20000 | 0.88 mm | 8 mm | 8 mm | - | - | ||
![]() A3P250-2FGG256 Microchip Technology | 31 |
| - | - | - | - | Surface Mount | FBGA-256 | YES | - | 256-FPBGA (17x17) | - | 256 | A3P250 | 350 MHz | 90 | MICROSEMI CORP | A3P250-2FGG256 | 310 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 157 I/O | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | - | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | - | 0.014110 oz | - | 0°C ~ 85°C (TJ) | Tray | A3P250 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 250000 | - | - | - | - | 2 | - | - | - | 6144 | - | 250000 | 1.2 mm | 17 mm | 17 mm | - | - | ||
![]() A3PE3000-FGG484I Microchip Technology | 2022 | - | - | Production (Last Updated: 2 months ago) | - | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 350 MHz | 60 | MICROSEMI CORP | A3PE3000-FGG484I | 231 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 341 I/O | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Details | Yes | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | - | -40 to 85 °C | Tray | A3PE3000 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 231 MHz | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | - | - | 63 kB | - | - | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 516096 | 3000000 | 231 MHz | - | - | - | STD | - | 75264 | - | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | No | - | ||
![]() A40MX02-PLG68I Microchip Technology | 17 |
| - | - | - | - | Surface Mount | PLCC-68 | YES | - | 68-PLCC (24.23x24.23) | - | 68 | A40MX02 | 80 MHz | 19 | MICROSEMI CORP | A40MX02-PLG68I | 139 MHz | 5.5 V | + 85 C | Microchip Technology | 3 V | - 40 C | Yes | 3 | SMD/SMT | 57 I/O | - | 295 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | ROHS COMPLIANT, PLASTIC, LCC-68 | - | SQUARE | CHIP CARRIER | Active | Active | NOT SPECIFIED | 5.28 | Details | Yes | - | - | - | 5.5 V | 3 V | 3.3 V | - | Actel | 3.3, 5 V | 0.171777 oz | - | -40 to 85 °C | Tube | A40MX02 | - | - | - | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | NOT SPECIFIED | 1.27 mm | compliant | - | S-PQCC-J68 | - | Not Qualified | 3.3 V, 5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | 295 CLBS, 3000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 3000 | - | - | - | - | STD | - | - | 2.7 ns | 295 | - | 3000 | 3.68 mm | 24.23 mm | 24.23 mm | - | - | ||
![]() AX2000-FGG896M Microchip Technology | 580 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 649 MHz | 27 | MICROSEMI CORP | AX2000-FGG896M | 649 MHz | - | + 125 C | Microchip Technology | - | - 55 C | Yes | 3 | SMD/SMT | 586 I/O | - | - | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | Actel | - | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX2000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | - | - | 36 kB | 990 ps | 990 ps | - | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 649 MHz | 32256 | MIL-STD-883 Class B | 21504 | - | - | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | - | ||
![]() A54SX32A-PQG208 Microchip Technology | 2418 |
| - | - | - | - | Surface Mount | PQFP-208 | - | - | 208-PQFP (28x28) | - | - | A54SX32 | - | 24 | - | - | 238 MHz | 2.75 V | + 70 C | Microchip Technology | 2.25 V | 0 C | Yes | - | SMD/SMT | 174 I/O | - | 1800 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | - | - | 5.25 V | 2.25 V | - | - | Actel | 2.5000 V | - | - | 0 to 70 °C | Tray | A54SX32A | - | - | - | - | - | - | - | - | 2.25V ~ 5.25V | - | - | - | - | - | - | - | - | - | 2.5 V | - | - | - | - | - | 900 uA | - | - | - | - | - | - | - | - | - | - | 48000 | - | 2880 | - | - | STD | - | - | - | - | - | - | 3.4 mm | 28 mm | 28 mm | - | - | ||
![]() AGLN010V2-UCG36 Microchip Technology | 31 |
| - | - | - | - | Surface Mount | UCSP | YES | - | 36-UCSP (3x3) | - | 36 | AGLN010 | - | 490 | MICROSEMI CORP | AGLN010V2-UCG36 | 250 MHz | - | + 70 C | Microchip Technology | - | - 20 C | Yes | - | SMD/SMT | 23 I/O | - | 100 LE | 70 °C | -20 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Obsolete | NOT SPECIFIED | 5.59 | Details | Yes | FPGA - Field Programmable Gate Array IGLOO | - | - | 1.575 V | 1.14 V | 1.2 V | - | IGLOO nano | - | - | - | -20°C ~ 85°C (TJ) | Tray | AGLN010V2 | - | - | - | - | - | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.4 mm | compliant | - | S-PBGA-B36 | - | Not Qualified | 1.2 V to 1.5 V | - | OTHER | - | - | - | 3 uA | - | - | - | - | - | 260 CLBS, 10000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 260 | - | 10000 | - | - | - | - | STD | - | - | - | 260 | - | 10000 | - | 3 mm | 3 mm | - | - | ||
![]() APA450-PQG208 Microchip Technology | 2054 |
| - | Production (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | - | 208 | APA450 | 180 MHz | 24 | MICROSEMI CORP | APA450-PQG208 | 180 MHz | 2.7 V | + 70 C | Microchip Technology | 2.3 V | 0 C | Yes | 3 | SMD/SMT | 158 I/O | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 1.56 | Details | Yes | - | - | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | 110592 bit | ProASICPLUS | 2.5000 V | - | - | 0 to 70 °C | Tray | APA450 | e3 | - | Matte Tin (Sn) | 70 °C | 0 °C | - | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 245 | 0.5 mm | compliant | 180 MHz | S-PQFP-G208 | 158 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 2.7 V | 2.3 V | 13.5 kB | 5 mA | 13.5 kB | - | - | - | 158 | 450000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 450000 | 180 MHz | - | - | - | STD | - | 12288 | - | - | 12288 | 450000 | 3.4 mm | 28 mm | 28 mm | No | Lead Free | ||
![]() AX2000-FG896M Microchip Technology | 528 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 649 MHz | 27 | MICROSEMI CORP | AX2000-FG896M | 649 MHz | - | + 125 C | Microchip Technology | - | - 55 C | Yes | 3 | SMD/SMT | 586 I/O | - | - | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | Actel | - | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX2000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | - | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | - | - | 36 kB | 990 ps | - | - | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 649 MHz | 32256 | MIL-STD-883 Class B | - | - | - | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | - | ||
![]() M1A3P600-FGG144I Microchip Technology | 30 |
| - | - | - | - | Surface Mount | FBGA | YES | - | 144-FPBGA (13x13) | - | 144 | M1A3P600 | - | 160 | MICROSEMI CORP | M1A3P600-FGG144I | 231 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | - | 0.014110 oz | - | -40°C ~ 100°C (TJ) | Tray | M1A3P600 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | - | - | - | - | STD | - | - | - | 13824 | - | 600000 | 1.05 mm | 13 mm | 13 mm | - | - | ||
![]() A3P250-2FGG144 Microchip Technology | 31 |
| - | - | - | - | Surface Mount | FBGA-144 | YES | - | 144-FPBGA (13x13) | - | 144 | A3P250 | 350 MHz | 160 | MICROSEMI CORP | A3P250-2FGG144 | 310 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 97 I/O | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | - | 0.014110 oz | - | 0°C ~ 85°C (TJ) | Tray | A3P250 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 250000 | - | - | - | - | 2 | - | - | - | 6144 | - | 250000 | 1.05 mm | 13 mm | 13 mm | - | - | ||
![]() MPF500T-1FCG1152I Microchip Technology | 614 |
| - | - | - | - | Surface Mount | BGA-1152 | - | - | 1152-FCBGA (35x35) | - | - | MPF500 | - | 1 | - | - | - | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 584 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | - | This product may require additional documentation to export from the United States. | 1.03 V/1.08 V | 970 mV/1.02 V | - | - | PolarFire | - | - | - | -40°C ~ 100°C (TJ) | Tray | MPF500T | - | - | - | - | - | - | - | - | 0.97V ~ 1.08V | - | - | - | - | - | - | - | - | - | 1.05 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 481000 | 33792000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() A42MX16-1PLG84I Microchip Technology | In Stock | - | - | - | - | - | Surface Mount | PLCC-84 | YES | - | 84-PLCC (29.31x29.31) | - | 84 | A42MX16 | 108 MHz | 16 | MICROSEMI CORP | A42MX16-1PLG84I | 198 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 72 I/O | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | ROHS COMPLIANT, PLASTIC, LCC-84 | - | SQUARE | CHIP CARRIER | Active | Active | NOT SPECIFIED | 5.28 | Details | Yes | - | - | - | 5.5 V | 3 V | 3.3 V | - | Actel | - | 0.239083 oz | - | -40°C ~ 85°C (TA) | Tube | A42MX16 | - | - | - | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | NOT SPECIFIED | 1.27 mm | compliant | - | S-PQCC-J84 | - | Not Qualified | 3.3 V, 5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | 1232 CLBS, 24000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 24000 | - | - | - | - | - | - | - | 2.4 ns | 1232 | - | 24000 | 3.68 mm | 29.31 mm | 29.31 mm | - | - | ||
![]() M1A3P250-2FG144I Microchip Technology | 30 |
| - | - | - | - | Surface Mount | FBGA | YES | - | 144-FPBGA (13x13) | - | 144 | M1A3P250 | - | 160 | MICROSEMI CORP | M1A3P250-2FG144I | 310 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | - | 0.014110 oz | - | -40°C ~ 100°C (TJ) | Tray | M1A3P250 | e0 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 250000 | - | - | - | - | 2 | - | - | - | 6144 | - | 250000 | 1.05 mm | 13 mm | 13 mm | - | - | ||
![]() M1A3P600-FG484I Microchip Technology | 2875 |
| - | - | - | - | Surface Mount | FBGA | YES | - | 484-FPBGA (23x23) | - | 484 | M1A3P600 | - | 60 | MICROSEMI CORP | M1A3P600-FG484I | 231 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 235 I/O | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | - | 0.014110 oz | - | -40°C ~ 100°C (TJ) | Tray | M1A3P600 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B484 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | - | - | - | - | STD | - | - | - | 13824 | - | 600000 | 1.73 mm | 23 mm | 23 mm | - | - | ||
![]() A3P400-1FGG256I Microchip Technology | 14 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | Surface Mount | FBGA | - | 256 | 256-FPBGA (17x17) | 400.011771 mg | - | A3P400 | - | 90 | - | - | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | - | SMD/SMT | 178 I/O | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | - | - | ProASIC3 | 1.5000 V | 0.014110 oz | - | -40 to 85 °C | Tray | A3P400 | - | - | - | 85 °C | -40 °C | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | 1.575 V | 1.425 V | - | - | 6.8 kB | - | - | - | - | - | - | - | - | 55296 | 400000 | 272 MHz | - | - | - | 1 | - | 9216 | - | - | - | - | 1.2 mm | 17 mm | 17 mm | No | - | ||
![]() A3PE1500-2FG484I Microchip Technology | 2551 |
| - | Production (Last Updated: 2 months ago) | Lead, Tin | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE1500 | - | 60 | MICROSEMI CORP | A3PE1500-2FG484I | 310 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 280 I/O | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | - | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | - | 8542390000 | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | - | 0.014110 oz | - | -40°C ~ 100°C (TJ) | Tray | A3PE1500 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 310 MHz | S-PBGA-B484 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | 1.575 V | 1.425 V | - | - | 33.8 kB | - | - | - | - | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 276480 | 1500000 | 310 MHz | - | - | - | 2 | - | 38400 | - | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | No | - |