- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
Attribute column
Manufacturer
Microchip Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() A3PN010-1QNG48I Microchip Technology | 47 |
| - | - | - | Surface Mount | QFN-48 | YES | - | 48-QFN (6x6) | - | 48 | A3PN010 | - | 429 | MICROSEMI CORP | A3PN010-1QNG48I | 350 MHz | - | + 100 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 34 I/O | - | 85 °C | -40 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Active | Active | 30 | 5.26 | Details | Yes | - | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | - | - | -40°C ~ 100°C (TJ) | Tray | A3PN010 | - | - | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | - | S-XQCC-N48 | - | Not Qualified | 1.425 V to 1.575 V | - | INDUSTRIAL | - | - | - | - | - | - | 260 CLBS, 10000 GATES | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | 10000 | - | - | 1 | - | - | - | 260 | - | 10000 | 0.88 mm | 6 mm | 6 mm | - | - | ||
![]() A3P250-1FGG256 Microchip Technology | 48 |
| - | - | - | Surface Mount | FBGA-256 | YES | - | 256-FPBGA (17x17) | - | 256 | A3P250 | 350 MHz | 90 | MICROSEMI CORP | A3P250-1FGG256 | 272 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 157 I/O | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | - | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 250000 | - | - | 1 | - | - | - | 6144 | - | 250000 | 1.2 mm | 17 mm | 17 mm | - | - | ||
![]() A3P250-1FG256 Microchip Technology | 5000 |
| - | - | - | Surface Mount | FBGA-256 | - | - | 256-FPBGA (17x17) | - | - | A3P250 | - | 90 | - | - | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | - | SMD/SMT | 157 I/O | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P250 | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | - | - | - | - | - | - | - | - | - | - | 36864 | 250000 | - | - | 1 | - | - | - | - | - | - | 1.2 mm | 17 mm | 17 mm | - | - | ||
![]() M1A3PE1500-FGG676I Microchip Technology | 2076 |
| - | - | - | Surface Mount | FBGA | YES | - | 676-FBGA (27x27) | - | 676 | M1A3PE1500 | 350 MHz | 40 | MICROSEMI CORP | M1A3PE1500-FGG676I | 231 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 444 I/O | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | S-PBGA-B676 | 444 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | 444 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 276480 | 1500000 | - | - | STD | - | - | - | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | - | - | ||
![]() AGLP125V5-CS281 Microchip Technology | 50 |
| - | - | - | Surface Mount | CSP-281 | YES | - | 281-CSP (10x10) | - | 281 | AGLP125 | 250 MHz | 184 | MICROSEMI CORP | AGLP125V5-CS281 | 892.86 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | - | SMD/SMT | 212 I/O | - | 70 °C | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA281,19X19,20 | BGA281,19X19,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Obsolete | NOT SPECIFIED | 5.26 | N | No | - | 1.575 V | 1.425 V | 1.5 V | IGLOO PLUS | - | - | 0°C ~ 85°C (TJ) | Tray | AGLP125V5 | - | - | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | - | S-PBGA-B281 | 212 | Not Qualified | 1.5 V | 1.5 V | COMMERCIAL | - | - | - | - | - | 212 | 3120 CLBS, 125000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 3120 | 36864 | 125000 | - | - | STD | - | - | - | 3120 | 3120 | 125000 | 0.71 mm | 10 mm | 10 mm | - | - | ||
![]() AGL030V2-VQ100 Microchip Technology | 30 |
| - | - | - | Surface Mount | VQFP | YES | - | 100-VQFP (14x14) | - | 100 | AGL030 | 108 MHz | 90 | MICROSEMI CORP | AGL030V2-VQ100 | 526.32 MHz, 892.86 MHz | 1.575 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 77 I/O | 330 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.24 | N | No | - | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | - | 0 to 70 °C | Tray | AGL030V2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | GULL WING | 230 | 0.5 mm | unknown | - | S-PQFP-G100 | - | Not Qualified | 1.2 V to 1.5 V | - | OTHER | - | - | - | - | - | - | 768 CLBS, 30000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | - | 30000 | - | - | STD | - | - | - | 768 | - | 30000 | 1 mm | 14 mm | 14 mm | - | - | ||
![]() M2GL025T-1FCS325I Microchip Technology | 2888 |
| - | - | - | Surface Mount | FCBGA-325 | YES | - | 325-FCBGA (11x11) | - | 325 | M2GL025 | - | 176 | MICROSEMI CORP | M2GL025T-1FCS325I | - | - | + 100 C | Microchip Technology | - | - 40 C | Yes | - | SMD/SMT | 180 I/O | 27696 LE | - | - | Tray | PLASTIC/EPOXY | BGA | 11 X 11 MM, 0.50 MM PITCH, FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.2 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | - | - | -40°C ~ 100°C (TJ) | Tray | M2GL025T | - | - | - | - | - | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | compliant | - | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | 1.2 V | - | - | - | - | - | - | 180 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 1130496 | - | - | - | - | 2 Transceiver | - | - | - | 27696 | - | - | - | - | - | - | ||
![]() A42MX16-PQG100I Microchip Technology | 2445 |
| - | - | - | Surface Mount | PQFP-100 | YES | - | 100-PQFP (20x14) | - | 100 | A42MX16 | 94 MHz | 66 | MICROSEMI CORP | A42MX16-PQG100I | 172 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 83 I/O | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | - | RECTANGULAR | FLATPACK | Active | Active | 40 | 5.27 | Details | Yes | - | 5.5 V | 3 V | 3.3 V | Actel | - | 0.062040 oz | -40°C ~ 85°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.65 mm | compliant | - | R-PQFP-G100 | - | Not Qualified | 3.3 V, 5 V | - | INDUSTRIAL | - | - | - | - | - | - | 1232 CLBS, 24000 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 24000 | - | - | STD | - | - | 2.8 ns | 1232 | - | 24000 | 2.7 mm | 20 mm | 14 mm | - | - | ||
![]() A54SX16A-1PQG208I Microchip Technology | 2236 |
| - | - | - | Surface Mount | PQFP-208 | YES | - | 208-PQFP (28x28) | - | 208 | A54SX16 | 263 MHz | 24 | MICROSEMI CORP | A54SX16A-1PQG208I | 263 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 175 I/O | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ | QFP208,1.2SQ | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | - | 2.75 V | 2.25 V | 2.5 V | Actel | - | - | -40°C ~ 85°C (TA) | Tray | A54SX16A | e3 | Matte Tin (Sn) | - | - | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | S-PQFP-G208 | 175 | Not Qualified | 2.5 V | 2.5,3.3/5 V | INDUSTRIAL | - | - | - | - | - | 175 | 1452 CLBS, 24000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 24000 | - | 1452 | - | - | - | 1.2 ns | 1452 | 1452 | 24000 | 3.4 mm | 28 mm | 28 mm | - | - | ||
![]() APA150-FGG144A Microchip Technology | 2494 |
| - | - | - | Surface Mount | FBGA | - | - | 144-FPBGA (13x13) | - | - | APA150 | - | 160 | - | - | 180 MHz | - | + 125 C | Microchip Technology | - | - 40 C | Yes | - | SMD/SMT | 100 I/O | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | - | Actel | - | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA150 | - | - | - | - | - | - | - | 2.375V ~ 2.625V | - | - | - | - | - | - | - | - | - | 2.5 V | - | - | - | - | - | - | - | - | - | - | - | - | 36864 | 150000 | - | - | STD | - | - | - | - | - | - | 1.05 mm | 13 mm | 13 mm | - | - | ||
![]() A3P600-1FGG256I Microchip Technology | 47 |
| - | - | - | Surface Mount | FBGA | YES | - | 256-FPBGA (17x17) | - | 256 | A3P600 | 350 MHz | 90 | MICROSEMI CORP | A3P600-1FGG256I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | - | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | - | - | 1 | - | - | - | 13824 | - | 600000 | 1.2 mm | 17 mm | 17 mm | - | - | ||
![]() A3P250-1FG144I Microchip Technology | 5000 |
| - | - | - | Surface Mount | FPBGA-144 | YES | - | 144-FPBGA (13x13) | - | 144 | A3P250 | 350 MHz | 160 | MICROSEMI CORP | A3P250-1FG144I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P250 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 250000 | - | - | 1 | - | - | - | 6144 | - | 250000 | 1.05 mm | 13 mm | 13 mm | - | - | ||
![]() APA1000-BGG456M Microchip Technology | 577 |
| - | - | - | Surface Mount | BGA-456 | - | - | 456-PBGA (35x35) | - | - | APA1000 | - | 24 | - | - | 180 MHz | - | + 125 C | Microchip Technology | - | - 55 C | Yes | - | SMD/SMT | 356 I/O | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | - | Actel | - | - | -55°C ~ 125°C (TC) | Tray | APA1000 | - | - | - | - | - | - | - | 2.3V ~ 2.7V | - | - | - | - | - | - | - | - | - | 2.5 V | - | - | - | - | - | - | - | - | - | - | - | - | 202752 | 1000000 | - | - | - | - | - | - | - | - | - | 1.73 mm | 35 mm | 35 mm | - | - | ||
![]() M1A3PE1500-PQG208 Microchip Technology | 2814 |
| - | - | - | Surface Mount | PQFP-208 | YES | - | 208-PQFP (28x28) | - | 208 | M1A3PE1500 | 350 MHz | 24 | MICROSEMI CORP | M1A3PE1500-PQG208 | 231 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 147 I/O | - | 70 °C | - | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.59 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | - | - | 0°C ~ 85°C (TJ) | Tray | M1A3PE1500 | e3 | Matte Tin (Sn) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | S-PQFP-G208 | 147 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | - | - | - | - | - | 147 | 38400 CLBS, 1500000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 276480 | 1500000 | - | - | STD | - | - | - | 38400 | 38400 | 1500000 | 3.4 mm | 28 mm | 28 mm | - | - | ||
![]() A42MX09-1PQG100 Microchip Technology | 2671 |
| - | - | - | Surface Mount | PQFP-100 | YES | - | 100-PQFP (20x14) | - | 100 | A42MX09 | 135 MHz | 66 | MICROSEMI CORP | A42MX09-1PQG100 | 247 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 83 I/O | - | 70 °C | - | Tray | PLASTIC/EPOXY | QFP | QFP, | - | RECTANGULAR | FLATPACK | Active | Active | 40 | 5.29 | Details | Yes | - | 5.25 V | 3 V | 3.3 V | Actel | - | 0.062040 oz | 0°C ~ 70°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 245 | 0.65 mm | compliant | - | R-PQFP-G100 | - | Not Qualified | 3.3 V, 5 V | - | COMMERCIAL | - | - | - | - | - | - | 684 CLBS, 14000 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 14000 | - | - | - | - | - | 2.1 ns | 684 | - | 14000 | 2.7 mm | 20 mm | 14 mm | - | - | ||
![]() A3P125-1TQG144 Microchip Technology | 2 |
| - | - | - | Surface Mount | TQFP-144 | YES | - | 144-TQFP (20x20) | - | 144 | A3P125 | 350 MHz | 60 | MICROSEMI CORP | A3P125-1TQG144 | 350 MHz | - | + 85 C | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 100 I/O | 1500 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | - | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.046530 oz | 0 to 70 °C | Tray | A3P125 | e3 | Matte Tin (Sn) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | S-PQFP-G144 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | 3072 CLBS, 125000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 125000 | - | - | 1 | - | - | - | 3072 | - | 125000 | 1.4 mm | 20 mm | 20 mm | - | - | ||
![]() M1A3P250-1VQ100 Microchip Technology | 31 |
| - | - | - | Surface Mount | VQFP | YES | - | 100-VQFP (14x14) | - | 100 | M1A3P250 | 350 MHz | 90 | MICROSEMI CORP | M1A3P250-1VQ100 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 68 I/O | - | 85 °C | - | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.24 | N | No | - | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | - | 0 to 70 °C | Tray | M1A3P250 | e0 | TIN LEAD | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | - | S-PQFP-G100 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 250000 | - | - | 1 | - | - | - | 6144 | - | 250000 | 1 mm | 14 mm | 14 mm | - | - | ||
![]() AFS1500-FGG484 Microchip Technology | 2954 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | - | 484 | 484-FPBGA (23x23) | 400.011771 mg | - | AFS1500 | - | 60 | - | - | 1098.9 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | - | SMD/SMT | 223 I/O | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | - | Fusion | - | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | - | - | 70 °C | 0 °C | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | 1.0989 GHz | - | - | - | 1.5 V | - | - | 1.575 V | 1.425 V | - | 33.8 kB | - | - | - | - | - | - | 276480 | 1500000 | 1.0989 GHz | - | - | - | 38400 | - | - | - | - | 1.73 mm | 23 mm | 23 mm | No | Lead Free | ||
![]() A3PE1500-2FG676I Microchip Technology | 2608 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | - | 676 | 676-FBGA (27x27) | 400.011771 mg | - | A3PE1500 | - | 40 | - | - | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | - | SMD/SMT | 444 I/O | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE1500 | - | - | 85 °C | -40 °C | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | 1.575 V | 1.425 V | - | 33.8 kB | - | - | - | - | - | - | 276480 | 1500000 | 310 MHz | - | 2 | - | 38400 | - | - | - | - | 1.73 mm | 27 mm | 27 mm | No | - | ||
![]() AGLN125V2-VQ100I Microchip Technology | 245 |
| - | - | - | Surface Mount | VQFP | YES | - | 100-VQFP (14x14) | - | 100 | AGLN125 | - | 90 | MICROSEMI CORP | AGLN125V2-VQ100I | 250 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 71 I/O | 1500 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.59 | N | No | - | 1.575 V | 1.14 V | 1.2 V | IGLOO nano | 1.2, 1.5 V | - | -40 to 85 °C | Tray | AGLN125V2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | GULL WING | 230 | 0.5 mm | unknown | - | S-PQFP-G100 | - | Not Qualified | 1.2 V to 1.5 V | - | INDUSTRIAL | - | - | 18 uA | - | - | - | 3072 CLBS, 125000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | 36864 | 125000 | - | - | STD | - | - | - | 3072 | - | 125000 | 1 mm | 14 mm | 14 mm | - | - |