- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | # I/Os (Max) | Base Product Number | Data RAM Size | Device Logic Units | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Family Name | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Logic Cells | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Screening Level | Speed Grade | Primary Attributes | Max Junction Temperature (Tj) | Number of Logic Cells | Number of Cores | Flash Size | Device Core | Height | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S090TS-1FCS325I Microchip Technology | 2632 | - | - | - | FCBGA-325 | - | 325-FCBGA (11x13.5) | - | 180 | M2S090 | 64 kB | - | - | 176 | SMARTFUSION2 | - | - | - | - | - | - | - | 86184 | - | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | - | Surface Mount | SMD/SMT | - | 180 | 7193 LAB | 86184 | 86316 LE | 1.26(V) | 1.14(V) | 1.2(V) | -40C to 100C | 100C | -40C | INDUSTRIALC | - | Tray | - | - | - | - | - | - | FCBGA | - | 65nm | Active | Yes | No | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 325 | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | 1 | FPGA - 90K Logic Modules | - | - | 1 Core | 512KB | - | - | - | - | ||
M2S150TS-1FC1152 Microchip Technology | In Stock | - | - | - | FCBGA-1152 | - | 1152-FCBGA (35x35) | - | - | M2S150 | 64 kB | - | - | 24 | - | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | - | - | SMD/SMT | - | 574 | 12177 LAB | - | 146124 LE | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | - | 1 Core | 512KB | - | - | - | - | ||
M2S010TS-1FG484 Microchip Technology | 2126 |
| - | Production (Last Updated: 1 month ago) | FPBGA-484 | - | 484-FPBGA (23x23) | - | - | M2S010 | 64 kB | - | - | 60 | - | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | - | - | SMD/SMT | - | 233 | 1007 LAB | - | 12084 LE | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | FPGA - 10K Logic Modules | - | - | 1 Core | 256KB | - | - | - | - | ||
M2S060TS-1FCSG325I Microchip Technology | 2268 |
| - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | - | 325-FCBGA (11x11) | - | - | M2S060 | 64 kB | - | - | 176 | - | 1.2, 1.5, 1.8, 2.5, 3.3 V | - | RISC | CAN/Ethernet/Serial I2C/SPI/UART/USB | Yes | - | - | - | - | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | - | Surface Mount | - | 1 | 200 | 4710 LAB | - | 56520 LE | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | SmartFusion2 | - | - | Industrial grade | -40 to 100 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 325 | - | - | - | 1.2 V | - | - | CAN/Ethernet/Serial | - | - | - | 166MHz | 64 KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | - | - | - | - | Industrial | - | FPGA - 60K Logic Modules | - | - | 1 Core | 256KB | - | - | - | - | ||
M2S005S-1VF400 Microchip Technology | 23 |
| - | - | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | - | M2S005 | 64 kB | - | - | 90 | - | - | MICROSEMI CORP | - | - | - | - | - | - | M2S005S-1VF400 | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | - | - | SMD/SMT | - | 169 | 505 LAB | - | 6060 LE | - | - | - | - | - | - | - | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | - | Active | - | Active | - | - | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | - | S-PBGA-B400 | 171 | Not Qualified | - | 1.2 V | OTHER | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 171 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 5K Logic Modules | - | 6060 | 1 Core | 128KB | - | - | 17 mm | 17 mm | ||
M2S010-1FG484I Microchip Technology | 32 |
| - | - | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | - | M2S010 | 64 kB | - | - | 60 | - | - | MICROSEMI CORP | - | - | - | - | - | - | M2S010-1FG484I | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | 3 | - | SMD/SMT | - | 233 | 1007 LAB | - | 12084 LE | - | - | - | - | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | - | S-PBGA-B484 | 233 | Not Qualified | - | 1.2 V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 1 | FPGA - 10K Logic Modules | - | 9744 | 1 Core | 256KB | - | - | 23 mm | 23 mm | ||
M2S150TS-1FCSG536I Microchip Technology | 503 |
| - | - | 536-LFBGA, CSPBGA | - | 536-CSPBGA (16x16) | - | - | M2S150 | 64 kB | - | - | 90 | - | 1.2, 1.5, 1.8, 2.5, 3.3 V | - | RISC | - | Yes | - | - | - | - | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | - | - | - | 1 | 293 | 12177 LAB | - | 146124 LE | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | Industrial grade | -40 to 100 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 536 | - | - | - | 1.2 V | - | - | CAN/Ethernet/Serial | - | - | - | 166MHz | 64 KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | - | - | - | - | Industrial | - | FPGA - 150K Logic Modules | - | - | 1 Core | 512KB | ARM Cortex-M3 | - | - | - | ||
M2S150TS-FCV484I Microchip Technology | 721 |
| - | - | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | - | M2S150 | 64 kB | - | - | 84 | - | - | MICROSEMI CORP | - | - | - | - | - | - | M2S150TS-FCV484I | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | - | - | - | - | 273 | 12177 LAB | - | 146124 LE | - | - | - | - | - | - | - | - | Tray | PLASTIC/EPOXY | FBGA | FBGA, | - | SQUARE | GRID ARRAY, FINE PITCH | - | Active | - | Active | - | - | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | No | Tin/Lead (Sn/Pb) | - | - | LG-MIN,WD-MIN | 8542.39.00.01 | - | BOTTOM | BALL | 240 | 0.8 mm | compliant | - | - | - | S-PBGA-B484 | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 150K Logic Modules | - | - | 1 Core | 512KB | - | - | 19 mm | 19 mm | ||
M2S005-FGG484I Microchip Technology | 5000 |
| - | - | FPBGA-484 | - | 484-FPBGA (23x23) | - | - | M2S005 | 64 kB | 6,060 | - | 60 | - | - | - | - | - | - | - | - | - | - | 166 MHz | 209 | 1.26 V | - | - | Microchip Technology | 1.14 V | - | Yes | - | Surface Mount | SMD/SMT | - | 209 | 505 LAB | - | 6060 LE | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | Details | - | - | FPBGA | - | - | - | - | 1.2000 V | 0.377729 oz | Industrial grade | -40 to 100 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 484 | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | Industrial | STD | FPGA - 5K Logic Modules | - | - | 1 Core | 128KB | - | - | - | - | ||
M2S010TS-FGG484 Microchip Technology | 32 |
| - | Production (Last Updated: 1 month ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | - | M2S010 | 64 kB | - | - | 60 | - | - | MICROSEMI CORP | - | - | - | - | - | - | M2S010TS-FGG484 | 166 MHz | - | - | - | FLASH | Microchip Technology | - | - | Yes | 3 | - | - | - | 233 | 1007 LAB | - | 12084 LE | - | - | - | - | - | - | - | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 40 | 5.82 | Details | Yes | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 166 MHz | - | - | S-PBGA-B484 | 233 | Not Qualified | - | 1.2 V | OTHER | - | 3.6 V | 1.4 V | 256 kB | 166MHz | 64 kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 10K Logic Modules | 85 °C | 12084 | 1 Core | 256KB | - | 2.44 mm | 23 mm | 23 mm | ||
M2S005-1TQG144I Microchip Technology | 32 |
| - | - | TQFP-144 | - | 144-TQFP (20x20) | - | - | M2S005 | 64 kB | - | 191 kbit | 60 | - | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | + 100 C | - | Microchip Technology | - | - 40 C | Yes | - | - | SMD/SMT | - | 84 I/O | 505 LAB | - | 6060 LE | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0.046530 oz | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | FPGA - 5K Logic Modules | - | - | 1 Core | 128KB | - | - | - | - | ||
M2S090TS-1FGG676 Microchip Technology | 2809 |
| - | - | BGA-676 | YES | 676-FBGA (27x27) | 676 | - | M2S090 | 64 kB | - | - | 40 | - | - | MICROSEMI CORP | - | - | - | - | - | - | M2S090TS-1FGG676 | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | 3 | - | SMD/SMT | - | 425 | 7193 LAB | - | 86316 LE | - | - | - | - | - | - | - | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | - | S-PBGA-B676 | 425 | Not Qualified | - | 1.2 V | OTHER | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 90K Logic Modules | - | 86316 | 1 Core | 512KB | - | - | 27 mm | 27 mm | ||
M2S090TS-1FCSG325 Microchip Technology | 2726 |
| - | - | FCBGA-325 | YES | 325-FCBGA (11x13.5) | 325 | - | M2S090 | 64 kB | - | - | 176 | - | - | MICROSEMI CORP | - | - | - | - | - | - | M2S090TS-1FCSG325 | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | 3 | - | SMD/SMT | - | 180 | 7193 LAB | - | 86316 LE | - | - | - | - | - | - | - | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | - | Active | - | Active | - | - | - | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | - | 40 | - | R-PBGA-B325 | 180 | Not Qualified | - | 1.2 V | OTHER | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 90K Logic Modules | - | 86316 | 1 Core | 512KB | - | - | 13.5 mm | 11 mm | ||
M2S025TS-VFG256 Microchip Technology | 2790 |
| - | Production (Last Updated: 2 months ago) | 256-LBGA | - | 256-FPBGA (17x17) | - | - | M2S025 | 64 kB | - | - | 119 | - | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | - | - | - | - | 138 | 2308 LAB | - | 27696 LE | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | - | 1 Core | 256KB | - | - | - | - | ||
M2S060TS-1FGG484 Microchip Technology | 2050 |
| - | Production (Last Updated: 2 months ago) | 484-BGA | - | 484-FPBGA (23x23) | - | - | M2S060 | 64 kB | - | - | 60 | - | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | FLASH | Microchip Technology | - | - | Yes | - | - | - | - | 395 | 4710 LAB | - | 56520 LE | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | SmartFusion2 | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | 85 °C | 0 °C | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | - | - | - | - | - | - | 3.45 V | 1.14 V | 256 kB | 166MHz | 1.3 MB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | 56520 | - | - | FPGA - 60K Logic Modules | 85 °C | - | 1 Core | 256KB | - | 2.44 mm | - | - | ||
M2S025TS-VFG400 Microchip Technology | 2638 |
| - | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | - | M2S025 | 64 kB | - | - | 90 | - | - | MICROSEMI CORP | - | - | - | - | - | - | M2S025TS-VFG400 | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | 3 | - | - | - | 207 | 2308 LAB | - | 27696 LE | - | - | - | - | - | - | - | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | - | Active | - | Active | - | - | 40 | 5.82 | Details | Yes | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | - | - | S-PBGA-B400 | 207 | Not Qualified | - | 1.2 V | OTHER | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Modules | - | 27696 | 1 Core | 256KB | - | - | 17 mm | 17 mm | ||
M2S025TS-1VF256I Microchip Technology | 2549 |
| - | Production (Last Updated: 2 months ago) | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | - | M2S025 | 64 kB | - | - | 119 | - | - | MICROSEMI CORP | - | - | - | - | - | - | M2S025TS-1VF256I | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | - | - | SMD/SMT | - | 138 | 2308 LAB | - | 27696 LE | - | - | - | - | - | - | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | - | Active | - | Active | - | - | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | No | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | - | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | - | S-PBGA-B256 | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Modules | - | - | 1 Core | 256KB | - | - | 14 mm | 14 mm | ||
M2S025-1VFG400I Microchip Technology | 2424 |
| - | - | VFPBGA-400 | - | 400-VFBGA (17x17) | - | - | M2S025 | 64 kB | - | - | 90 | - | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | - | - | SMD/SMT | - | 207 | 2308 LAB | - | 27696 LE | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | 1 | FPGA - 25K Logic Modules | - | - | 1 Core | 256KB | - | - | - | - | ||
M2S150T-FCVG484I Microchip Technology | 2674 |
| - | - | 484-BFBGA | - | 484-FBGA (19x19) | - | - | M2S150 | 64 kB | - | - | 84 | - | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | - | - | - | - | 273 | 12177 LAB | - | 146124 LE | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | - | 1 Core | 512KB | - | - | - | - | ||
M2S090T-1FG484I Microchip Technology | 2969 | - | - | - | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | - | M2S090 | 64 kB | - | - | 60 | - | - | MICROSEMI CORP | - | - | - | - | - | - | M2S090T-1FG484I | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | 3 | - | SMD/SMT | - | 267 | 7193 LAB | - | 86316 LE | - | - | - | - | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 30 | 5.83 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | - | -40 to 100 °C | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 1 | FPGA - 90K Logic Modules | - | 86316 | 1 Core | 512KB | - | - | 23 mm | 23 mm |