-

-

BGA-536

-

-

536-LFBGA

-

-

-

-

-

1

-

-

-

-

-

4 x 32 kB

16 kB, 4 x 32 kB

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

- 40 C

-

-

-

SMD/SMT

-

276 I/O

-

93000 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire®

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

FPGA - 93K Logic Modules

-

5 Core

128kB

-

-

-

• 1:$208.809206
• 10:$196.989817
• 100:$185.839450
• 500:$175.320236
View all price

Production (Last Updated: 2 months ago)

484-BGA

-

484

484-FPBGA (23x23)

-

M2S060

64 kB

-

-

60

-

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

-

-

267

4710 LAB

56520 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

-

SmartFusion2

-

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

-

-

-

-

85 °C

0 °C

-

-

-

-

-

-

-

-

-

-

-

-

1.2 V

-

-

-

166MHz

164.3 kB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

1

FPGA - 60K Logic Modules

-

1 Core

256KB

-

-

-

• 1:$398.024686
• 10:$375.494987
• 100:$354.240554
• 500:$334.189202
View all price

-

FPBGA-484

YES

-

484-FPBGA (23x23)

484

M2S050

64 kB

-

-

60

-

MICROSEMI CORP

-

-

-

-

-

M2S050T-1FG484M

166 MHz

-

-

Microchip Technology

-

-

Yes

3

-

SMD/SMT

-

267

4695 LAB

56340 LE

125 °C

-55 °C

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,22X22,40

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

30

5.81

N

No

This product may require additional documentation to export from the United States.

-

1.26 V

1.14 V

1.2 V

-

-

-

-

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e0

-

3A001.A.2.C

Tin/Lead (Sn/Pb)

-

-

-

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

-

S-PBGA-B484

267

Not Qualified

-

1.2 V

MILITARY

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

267

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

FPGA - 50K Logic Modules

56340

1 Core

256KB

-

23 mm

23 mm

• 1:$276.685895
• 10:$261.024429
• 100:$246.249462
• 500:$232.310813
View all price

-

FCBGA-325

YES

-

325-FCBGA (11x13.5)

325

M2S090

64 kB

-

-

176

-

MICROSEMI CORP

-

-

-

-

-

M2S090T-1FCSG325I

166 MHz

-

-

Microchip Technology

-

-

Yes

3

-

SMD/SMT

-

180

7193 LAB

86316 LE

-

-

Tray

PLASTIC/EPOXY

TFBGA

FBGA-325

BGA325,21X21,20

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

40

5.78

Details

Yes

This product may require additional documentation to export from the United States.

-

1.26 V

1.14 V

1.2 V

-

-

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

-

R-PBGA-B325

180

Not Qualified

-

1.2 V

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

180

1.16 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

FPGA - 90K Logic Modules

86316

1 Core

512KB

-

13.5 mm

11 mm

• 1:$90.489312
• 10:$85.367275
• 100:$80.535166
• 500:$75.976571
View all price

-

FPBGA-484

-

-

484-FPBGA (23x23)

-

M2S010

64 kB

-

-

60

-

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

SMD/SMT

-

233

1007 LAB

12084 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Details

-

-

-

-

-

-

-

1.2000 V

-

-

0 to 85 °C

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

1

FPGA - 10K Logic Modules

-

1 Core

256KB

-

-

-

• 1:$43.229757
• 10:$40.782790
• 100:$38.474330
• 500:$36.296538
View all price

-

VFPBGA-400

YES

-

400-VFBGA (17x17)

400

M2S005

64 kB

-

-

90

-

MICROSEMI CORP

-

-

-

-

-

M2S005-1VF400I

166 MHz

1.26 V

-

Microchip Technology

1.14 V

-

Yes

-

-

SMD/SMT

-

169

505 LAB

6060 LE

-

-

Tray

PLASTIC/EPOXY

LFBGA

LFBGA, BGA400,20X20,32

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

30

5.86

N

No

This product may require additional documentation to export from the United States.

-

1.26 V

1.14 V

1.2 V

-

-

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

-

-

Tin/Lead (Sn/Pb)

-

-

-

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

-

S-PBGA-B400

160

Not Qualified

-

1.2 V

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

160

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

-

1

FPGA - 5K Logic Modules

4956

1 Core

128KB

-

17 mm

17 mm

• 1:$122.976905
• 10:$116.015948
• 100:$109.449008
• 500:$103.253781
View all price

Production (Last Updated: 2 months ago)

FCBGA-325

-

-

325-FCBGA (11x11)

-

M2S025

64 kB

-

-

176

-

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

SMD/SMT

-

180

2308 LAB

27696 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 25K Logic Modules

-

1 Core

256KB

-

-

-

• 1:$563.524596
• 10:$531.626977
• 100:$501.534884
• 500:$473.146117
View all price

-

484-BFBGA

YES

-

484-FBGA (19x19)

484

M2S150

64 kB

-

-

84

-

MICROSEMI CORP

-

-

-

-

-

M2S150TS-1FCVG484

166 MHz

-

-

Microchip Technology

-

-

Yes

4

-

-

-

273

12177 LAB

146124 LE

85 °C

-

Tray

PLASTIC/EPOXY

FBGA

VFBGA-484

-

SQUARE

GRID ARRAY, FINE PITCH

Active

Active

40

5.81

N

Yes

This product may require additional documentation to export from the United States.

-

1.26 V

1.14 V

1.2 V

-

-

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

No

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

LG-MIN, WD-MIN

8542.39.00.01

-

BOTTOM

BALL

250

0.8 mm

compliant

-

S-PBGA-B484

-

-

-

-

OTHER

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

3.15 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

FPGA - 150K Logic Modules

-

1 Core

512KB

-

19 mm

19 mm

• 1:$244.798068
• 10:$230.941574
• 100:$217.869409
• 500:$205.537178
View all price

Production (Last Updated: 2 months ago)

676-BGA

-

-

676-FBGA (27x27)

-

M2S060

64 kB

-

-

40

-

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

-

-

387

4710 LAB

56520 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

-

SmartFusion2

-

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 60K Logic Modules

-

1 Core

256KB

-

-

-

• 1:$272.564716
• 10:$257.136525
• 100:$242.581627
• 500:$228.850591
View all price

-

484-BGA

-

-

484-FPBGA (23x23)

-

M2S090

64 kB

-

-

60

-

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

-

-

267

7193 LAB

86316 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

1.2000 V

-

-

0 to 85 °C

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

STD

FPGA - 90K Logic Modules

-

1 Core

512KB

-

-

-

• 1:$55.225525
• 10:$52.099552
• 100:$49.150521
• 500:$46.368416
View all price

Production (Last Updated: 1 month ago)

256-LFBGA

YES

-

256-FPBGA (14x14)

256

M2S010

64 kB

-

-

119

-

MICROSEMI CORP

-

-

-

-

-

M2S010TS-VF256

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

-

-

138

1007 LAB

12084 LE

85 °C

-

Tray

PLASTIC/EPOXY

LFBGA

LFBGA, BGA256,16X16,32

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

30

5.87

N

No

This product may require additional documentation to export from the United States.

-

1.26 V

1.14 V

1.2 V

-

-

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

-

-

Tin/Lead (Sn/Pb)

-

-

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

-

S-PBGA-B256

138

Not Qualified

-

1.2 V

OTHER

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

138

1.56 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

FPGA - 10K Logic Modules

12084

1 Core

256KB

-

14 mm

14 mm

-

Production (Last Updated: 2 months ago)

484-BGA

YES

-

484-FPBGA (23x23)

484

M2S060

64 kB

-

-

60

-

MICROSEMI CORP

-

-

-

-

-

M2S060T-FG484

166 MHz

-

-

Microchip Technology

-

-

Yes

3

-

-

-

267

4710 LAB

56520 LE

85 °C

-

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

30

5.88

N

No

This product may require additional documentation to export from the United States.

-

1.26 V

1.14 V

1.2 V

SmartFusion2

-

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

-

-

Tin/Lead (Sn/Pb)

-

-

-

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

-

S-PBGA-B484

267

Not Qualified

-

1.2 V

OTHER

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

267

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

FPGA - 60K Logic Modules

56520

1 Core

256KB

-

23 mm

23 mm

• 1:$59.917551
• 10:$56.525992
• 100:$53.326407
• 500:$50.307931
View all price

Production (Last Updated: 1 month ago)

256-LFBGA

-

-

256-FPBGA (14x14)

-

M2S010

64 kB

-

-

119

-

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

-

-

138

1007 LAB

12084 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

N

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 10K Logic Modules

-

1 Core

256KB

-

-

-

• 1:$34.512701
• 10:$32.559152
• 100:$30.716181
• 500:$28.977529
View all price

-

FPBGA-484

-

-

484-FPBGA (23x23)

-

M2S005

64 kB

-

-

60

-

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

SMD/SMT

-

209

505 LAB

6060 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 5K Logic Modules

-

1 Core

128KB

-

-

-

• 1:$241.266128
• 10:$227.609555
• 100:$214.725995
• 500:$202.571693
View all price

Production (Last Updated: 2 months ago)

FPBGA-896

YES

-

896-FBGA (31x31)

896

M2S050

64 kB

-

-

27

-

MICROSEMI CORP

-

-

-

-

-

M2S050-FGG896I

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

SMD/SMT

-

377

4695 LAB

56340 LE

-

-

Tray

PLASTIC/EPOXY

BGA

FBGA-896

BGA896,30X30,40

SQUARE

GRID ARRAY

Active

Active

40

5.26

Details

Yes

This product may require additional documentation to export from the United States.

-

1.26 V

1.14 V

1.2 V

-

1.2000 V

-

-

-40 to 100 °C

Tray

SmartFusion2

e1

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

-

S-PBGA-B896

377

Not Qualified

-

1.2 V

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

377

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

-

31 mm

31 mm

• 1:$34.128993
• 10:$32.197163
• 100:$30.374682
• 500:$28.655361
View all price

-

256-LFBGA

-

-

256-FPBGA (14x14)

-

M2S005

64 kB

-

-

119

-

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

-

-

161

505 LAB

6060 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

N

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 5K Logic Modules

-

1 Core

128KB

-

-

-

-

-

FPBGA-896

YES

-

896-FBGA (31x31)

896

M2S050

64 kB

-

-

27

-

MICROSEMI CORP

-

-

-

-

-

M2S050TS-1FG896I

166 MHz

-

-

Microchip Technology

-

-

Yes

3

-

SMD/SMT

-

377

4695 LAB

56340 LE

-

-

Tray

PLASTIC/EPOXY

BGA

FBGA-896

-

SQUARE

GRID ARRAY

Active

Active

30

5.84

N

No

This product may require additional documentation to export from the United States.

-

1.26 V

1.14 V

1.2 V

-

1.2000 V

-

-

-40 to 100 °C

Tray

SmartFusion2

e0

-

-

Tin/Lead (Sn/Pb)

-

-

-

8542.39.00.01

-

BOTTOM

BALL

240

1 mm

not_compliant

896

S-PBGA-B896

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

1

FPGA - 50K Logic Modules

-

1 Core

256KB

-

31 mm

31 mm

• 1:$375.775956
• 10:$354.505619
• 100:$334.439263
• 500:$315.508739
View all price

-

BGA-676

YES

-

676-FBGA (27x27)

676

M2S090

64 kB

-

-

40

-

MICROSEMI CORP

-

-

-

-

-

M2S090-FG676I

166 MHz

-

-

Microchip Technology

-

-

Yes

3

-

SMD/SMT

-

425

7193 LAB

86316 LE

-

-

Tray

PLASTIC/EPOXY

BGA

BGA, BGA676,26X26,40

BGA676,26X26,40

SQUARE

GRID ARRAY

Active

Active

30

5.83

N

No

This product may require additional documentation to export from the United States.

-

1.26 V

1.14 V

1.2 V

-

-

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

-

-

Tin/Lead (Sn/Pb)

-

-

-

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

-

S-PBGA-B676

425

Not Qualified

-

1.2 V

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

425

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

FPGA - 90K Logic Modules

86316

1 Core

512KB

-

27 mm

27 mm

• 1:$363.710461
• 10:$343.123076
• 100:$323.701015
• 500:$305.378316
View all price

-

484-BFBGA

YES

-

484-FBGA (19x19)

484

M2S150

64 kB

-

-

84

1.2, 1.5, 1.8, 2.5, 3.3 V

MICROSEMI CORP

RISC

CAN/Ethernet/Serial I2C/SPI/UART/USB

Yes

-

-

M2S150-FCVG484I

166 MHz

-

+ 100 C

Microchip Technology

-

- 40 C

Yes

4

Surface Mount

SMD/SMT

1

273 I/O

12177 LAB

146124 LE

-

-

Tray

PLASTIC/EPOXY

FBGA

VFBGA-484

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

Active

Active

40

5.76

Details

Yes

-

VFBGA

1.26 V

1.14 V

1.2 V

-

-

-

Industrial grade

-40 to 100 °C

Tray

SmartFusion2

e1

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

484

S-PBGA-B484

273

Not Qualified

1.2 V

1.2 V

-

CAN/Ethernet/Serial

166MHz

64 KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

32 Bit

273

3.15 mm

FIELD PROGRAMMABLE GATE ARRAY

Industrial

-

FPGA - 150K Logic Modules

146124

1 Core

512KB

ARM Cortex-M3

19 mm

19 mm

• 1:$69.153354
• 10:$65.239013
• 100:$61.546239
• 500:$58.062490
View all price

-

BGA-484

YES

-

484-FPBGA (23x23)

484

M2S010

64 kB

400 kbit

64 kB

60

-

MICROSEMI CORP

-

-

-

-

-

M2S010-FGG484I

166 MHz

1.26 V

+ 100 C

Microchip Technology

1.14 V

- 40 C

Yes

3

-

SMD/SMT

-

233 I/O

1007 LAB

12084 LE

-

-

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

40

5.76

Details

Yes

-

-

1.26 V

1.14 V

1.2 V

-

1.2000 V

0.404535 oz

-

-40 to 100 °C

Tray

SmartFusion2

e1

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

-

S-PBGA-B484

233

Not Qualified

1.2 V

1.2 V

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

233

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

STD

FPGA - 10K Logic Modules

12084

1 Core

256KB

-

23 mm

23 mm