- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Data RAM Size | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S060-FG676 Microchip Technology | 2495 |
| - | Production (Last Updated: 2 months ago) | 676-BGA | - | 676-FBGA (27x27) | - | M2S060 | 64 kB | - | - | 40 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 387 | 4710 LAB | 56520 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S060TS-FG676 Microchip Technology | 2549 |
| - | - | 676-BGA | - | 676-FBGA (27x27) | - | M2S060 | 64 kB | - | - | 40 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 387 | 4710 LAB | 56520 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S025T-1FG484I Microchip Technology | 2663 |
| - | - | FPBGA-484 | - | 484-FPBGA (23x23) | - | M2S025 | 64 kB | - | - | 60 | - | - | - | - | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | SMD/SMT | 267 | 2308 LAB | 27696 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | - | -40 to 100 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | 1 | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S090TS-1FG484 Microchip Technology | 2855 |
| - | - | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S090 | 64 kB | - | - | 60 | MICROSEMI CORP | - | - | M2S090TS-1FG484 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | 267 | 7193 LAB | 86316 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||
M2S050-FCSG325 Microchip Technology | 23 |
| - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S050 | 64 kB | - | - | 176 | MICROSEMI CORP | - | - | M2S050-FCSG325 | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | 3 | - | 200 | 4695 LAB | 56340 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | ||
M2S025-FCSG325 Microchip Technology | 40 | - | - | - | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S025 | 64 kB | - | - | 176 | MICROSEMI CORP | - | - | M2S025-FCSG325 | 166 MHz | 1.26 V | - | Microchip Technology | - | - | Yes | 3 | - | 180 | 2308 LAB | 27696 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 180 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | ||
M2S060T-1FG676 Microchip Technology | 2524 |
| - | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | 64 kB | - | - | 40 | MICROSEMI CORP | - | - | M2S060T-1FG676 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | - | 387 | 4710 LAB | 56520 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 387 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | ||
M2S050T-FG896 Microchip Technology | 2314 |
| - | - | BGA-896 | - | 896-FBGA (31x31) | - | M2S050 | 64 kB | 1.314 Mbit | 64 kB | 27 | - | - | - | - | 166 MHz | - | + 85 C | Microchip Technology | - | 0 C | Yes | - | SMD/SMT | 377 I/O | 4695 LAB | 56340 LE | - | - | Tray | - | - | - | - | - | - | - | Obsolete | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | STD | FPGA - 50K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S060T-1FGG484M Microchip Technology | 2439 |
| - | - | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S060 | 64 kB | 1314 kbit | - | 60 | MICROSEMI CORP | - | - | M2S060T-1FGG484M | 166 MHz | - | + 125 C | Microchip Technology | - | - 55 C | - | 3 | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | - | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | - | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | Yes | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | - | - | 1.2 V | - | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 60K Logic Modules | - | 1 Core | 256KB | 23 mm | 23 mm | ||
M2S060TS-1FGG484M Microchip Technology | 600 | - | - | - | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S060 | 64 kB | 1314 kbit | - | 60 | MICROSEMI CORP | - | - | M2S060TS-1FGG484M | 166 MHz | - | + 125 C | Microchip Technology | - | - 55 C | - | 3 | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | - | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | - | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | Yes | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | - | - | 1.2 V | - | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 60K Logic Modules | - | 1 Core | 256KB | 23 mm | 23 mm | ||
M2S025TS-VF400I Microchip Technology | 2550 |
| - | Production (Last Updated: 2 months ago) | VFPBGA-400 | - | 400-VFBGA (17x17) | - | M2S025 | 64 kB | - | - | 90 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 207 | 2308 LAB | 27696 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S005-VFG400I Microchip Technology | 40 | - | - | - | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S005 | 64 kB | - | - | 90 | MICROSEMI CORP | - | - | M2S005-VFG400I | 166 MHz | - | + 100 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 169 I/O | 505 LAB | 6060 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | - | 0.346560 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 171 | Not Qualified | 1.2 V | 1.2 V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 171 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 17 mm | 17 mm | ||
M2S060T-1FG484 Microchip Technology | 2327 |
| - | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S060 | 64 kB | - | - | 60 | MICROSEMI CORP | - | - | M2S060T-1FG484 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | - | 267 | 4710 LAB | 56520 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 23 mm | 23 mm | ||
M2S060-VFG400 Microchip Technology | 2340 |
| - | Production (Last Updated: 2 months ago) | 400-LFBGA | - | 400-VFBGA (17x17) | - | M2S060 | 64 kB | - | - | 90 | - | - | - | - | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | - | 207 | 4710 LAB | 56520 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | 1.2000 V | - | -40 to 100 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | STD | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S090-1FCSG325I Microchip Technology | 2544 |
| - | - | FCBGA-325 | YES | 325-FCBGA (11x13.5) | 325 | M2S090 | 64 kB | - | - | 176 | MICROSEMI CORP | - | - | M2S090-1FCSG325I | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | 3 | SMD/SMT | 180 | 7193 LAB | 86316 LE | - | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | Tray | SmartFusion2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | R-PBGA-B325 | 180 | Not Qualified | - | 1.2 V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | ||
M2S050T-FCSG325 Microchip Technology | 2853 |
| - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S050 | 64 kB | - | - | 176 | MICROSEMI CORP | - | - | M2S050T-FCSG325 | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | 3 | - | 200 | 4695 LAB | 56340 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 2.5, 3.3 V | - | 0 to 85 °C | Tray | SmartFusion2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | ||
M2S005S-1TQG144I Microchip Technology | 23 |
| - | - | TQFP-144 | - | 144-TQFP (20x20) | - | M2S005 | 64 kB | - | - | 60 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 84 | 505 LAB | 6060 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0.046530 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 5K Logic Modules | - | 1 Core | 128KB | - | - | ||
M2S005-VFG256 Microchip Technology | 23 | - | - | - | BGA-256 | YES | 256-FPBGA (14x14) | 256 | M2S005 | 64 kB | 191 kbit | - | 119 | MICROSEMI CORP | - | - | M2S005-VFG256 | 166 MHz | - | + 85 C | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 161 I/O | 505 LAB | 6060 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA256,16X16,32 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Details | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | - | 0.167354 oz | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 161 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 14 mm | 14 mm | ||
M2S050TS-1FCSG325 Microchip Technology | 2766 |
| - | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2S050 | 64 kB | - | - | 176 | MICROSEMI CORP | - | - | M2S050TS-1FCSG325 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | 200 | 4695 LAB | 56340 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.82 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | ||
M2S005S-1FGG484 Microchip Technology | 7 |
| - | - | FPBGA-484 | - | 484-FPBGA (23x23) | - | M2S005 | 64 kB | - | - | 60 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 209 | 505 LAB | 6060 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 5K Logic Modules | - | 1 Core | 128KB | - | - |