- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Device Logic Gates | Display | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Pbfree Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | HTS Code | Capacitance | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Output | Pin Count | JESD-30 Code | Function | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Height Seated (Max) | Length | Width |
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![]() M2S060T-1FCSG325I Microchip | 2491 |
| - | Production (Last Updated: 2 months ago) | Through Hole | 325-TFBGA, FCBGA | - | 325-FCBGA (11x11) | - | M2S060 | - | - | 64 kB | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | - | - | - | 200 | - | 56520 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Non-Compliant | - | - | - | - | - | - | - | 13 kV | -40°C ~ 100°C (TJ) | Bulk | SmartFusion®2 | 5 % | - | - | - | 100 °C | -55 °C | - | - | 5 nF | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | 1 Core | - | 256KB | - | 45.0088 mm | - | - | ||
![]() MPFS095TS-FCVG484I Microchip | 2074 |
| - | - | - | 484-BFBGA, FCBGA | - | 484-FCBGA (19x19) | - | - | - | - | - | - | - | - | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | MCU - 136, FPGA - 276 | - | 93000 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C | - | PolarFire® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | 5 Core | - | 128kB | - | - | - | - | ||
![]() MPFS250T-FCVG484E Microchip | 2302 |
| - | - | - | FCVG-484 | - | 484-FCBGA (19x19) | - | - | Microchip Technology / Atmel | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | Microchip | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | 372 I/O | - | 254000 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | SOC - Systems on a Chip | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | 5 Core | - | 128kB | SoC FPGA | - | - | - | ||
![]() M2S090TS-1FGG676I Microchip | 2029 | - | - | - | - | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S090 | - | - | 64 kB | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | M2S090TS-1FGG676I | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | - | 3 | - | 425 | - | 86316 LE | - | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | - | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | - | Yes | - | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | - | - | -40 to 100 °C | - | SmartFusion®2 | - | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B676 | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 90K Logic Modules | - | - | 1 Core | - | 512KB | - | - | 27 mm | 27 mm | ||
![]() M2S025-VFG400I Microchip | 2148 | - | - | - | - | VFPBGA-400 | - | 400-VFBGA (17x17) | - | M2S025 | Microchip Technology / Atmel | - | 64 kB | - | - | - | 90 | - | - | - | Microchip | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 207 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | - | - | - | - | 0.227784 oz | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | SOC - Systems on a Chip | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | SoC FPGA | STD | FPGA - 25K Logic Modules | - | - | 1 Core | - | 256KB | SoC FPGA | - | - | - | ||
![]() A2F060M3E-CS288I Microchip | In Stock | - | - | - | - | - | YES | - | 288 | - | - | 80 MHz | - | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | A2F060M3E-CS288I | - | - | - | - | - | - | - | - | - | - | - | - | - | - | PLASTIC/EPOXY | TFBGA | 11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, BGA-288 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | - | 20 | 5.84 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e0 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | - | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 235 | 0.5 mm | compliant | - | - | S-PBGA-B288 | - | 68 | Not Qualified | - | 1.5,1.8,2.5,3.3 V | - | - | - | - | - | - | - | - | 68 | 1536 CLBS, 60000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 1536 | 1536 | - | 60000 | - | - | - | 11 mm | 11 mm | ||
![]() M2S025-1FG484 Microchip | 2623 |
| - | - | - | 484-BGA | - | 484-FPBGA (23x23) | - | M2S025 | - | - | 64 kB | - | - | - | - | - | - | - | - | - | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | - | - | SMD/SMT | 267 | - | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | 1.2000 V | - | - | 0 to 85 °C | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 25K Logic Modules | - | - | 1 Core | - | 256KB | - | - | - | - | ||
![]() M2S005-TQG144 Microchip | 40 | - | - | - | - | 144-LQFP | - | 144-TQFP (20x20) | - | M2S005 | Microchip Technology / Atmel | - | 64 kB | - | - | 191 kbit | 60 | - | - | - | Microchip | - | 166 MHz | - | + 85 C | Microchip Technology | - | 0 C | Yes | - | SMD/SMT | 84 | 505 LAB | 6060 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | - | - | - | - | 0.035380 oz | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion®2 | - | - | - | - | - | - | - | - | - | SOC - Systems on a Chip | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | SoC FPGA | - | FPGA - 5K Logic Modules | - | - | 1 Core | - | 128KB | SoC FPGA | - | - | - | ||
![]() A2F060M3E-1FGG256 Microchip | In Stock | - | - | - | - | - | YES | - | 256 | - | - | 100 MHz | - | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | A2F060M3E-1FGG256 | - | - | - | - | - | - | - | 3 | - | - | - | - | 85 °C | - | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | 30 | 5.8 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B256 | - | 66 | Not Qualified | - | 1.5,1.8,2.5,3.3 V | OTHER | - | - | - | - | - | - | - | 66 | 1536 CLBS, 60000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 1536 | 1536 | - | 60000 | - | - | - | 17 mm | 17 mm | ||
![]() M2S060T-VFG400I Microchip | 2446 |
| - | Production (Last Updated: 2 months ago) | - | 400-LFBGA | - | 400-VFBGA (17x17) | - | M2S060 | - | - | 64 kB | - | - | - | - | - | - | - | - | - | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | - | - | - | 207 | - | 56520 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Non-Compliant | - | - | - | - | - | 1.2000 V | - | - | -40 to 100 °C | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | STD | FPGA - 60K Logic Modules | - | - | 1 Core | - | 256KB | - | - | - | - | ||
![]() A2F060M3E-1FG256 Microchip | In Stock | - | - | - | - | - | YES | - | 256 | - | - | 100 MHz | - | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | A2F060M3E-1FG256 | - | - | - | - | - | - | - | 3 | - | - | - | - | 85 °C | - | PLASTIC/EPOXY | LBGA | 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | 20 | 5.84 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B256 | - | 66 | Not Qualified | - | 1.5,1.8,2.5,3.3 V | OTHER | - | - | - | - | - | - | - | 66 | 1536 CLBS, 60000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 1536 | 1536 | - | 60000 | - | - | - | 17 mm | 17 mm | ||
![]() M2S025T-1VFG256I Microchip | 24 |
| - | Production (Last Updated: 2 months ago) | - | 256-LBGA | - | 256-FPBGA (17x17) | - | M2S025 | - | - | 64 kB | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | - | - | SMD/SMT | 138 | - | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Compliant | - | - | - | - | - | 1.2000 V | - | - | -40 to 100 °C | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 25K Logic Modules | - | - | 1 Core | - | 256KB | - | - | - | - | ||
![]() A2F060M3E-TQG144I Microchip | In Stock | - | - | - | - | - | YES | - | 144 | - | - | 80 MHz | - | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | A2F060M3E-TQG144I | - | - | - | - | - | - | - | 3 | - | - | - | - | - | - | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | - | 30 | 8.63 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e3 | - | PURE MATTE TIN (394) | - | - | - | 8542.39.00.01 | - | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 250 | 0.5 mm | compliant | - | - | S-PQFP-G144 | - | 33 | Not Qualified | - | 1.5,1.8,2.5,3.3 V | - | - | - | - | - | - | - | - | 33 | 1536 CLBS, 60000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 1536 | 1536 | - | 60000 | - | - | - | 20 mm | 20 mm | ||
![]() A2F060M3E-CSG288 Microchip | In Stock | - | - | - | - | - | YES | - | 288 | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | A2F060M3E-CSG288 | - | - | - | - | - | - | - | - | - | - | - | - | 85 °C | - | PLASTIC/EPOXY | TFBGA | TFBGA, | - | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | - | - | 8.46 | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | CMOS | BOTTOM | BALL | - | 0.5 mm | compliant | - | - | S-PBGA-B288 | - | - | - | - | - | OTHER | - | - | - | - | - | - | - | - | 1536 CLBS, 60000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 1536 | - | - | 60000 | - | - | - | 11 mm | 11 mm | ||
![]() M2S050T-FG484I Microchip | 2244 |
| - | - | - | 484-BGA | - | 484-FPBGA (23x23) | - | M2S050 | - | - | 64 kB | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | - | - | SMD/SMT | 267 | - | 56340 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | STD | FPGA - 50K Logic Modules | - | - | 1 Core | - | 256KB | - | - | - | - | ||
![]() A2F060M3E-1CSG288I Microchip | In Stock | - | - | - | - | - | YES | - | 288 | - | - | 100 MHz | - | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | A2F060M3E-1CSG288I | - | - | - | - | - | - | - | - | - | - | - | - | - | - | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | - | 30 | 5.25 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e1 | - | TIN SILVER COPPER | - | - | - | 8542.39.00.01 | - | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 260 | 0.5 mm | compliant | - | - | S-PBGA-B288 | - | 68 | Not Qualified | - | 1.5,1.8,2.5,3.3 V | - | - | - | - | - | - | - | - | 68 | 1536 CLBS, 60000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 1536 | 1536 | - | 60000 | - | - | - | 11 mm | 11 mm | ||
![]() M2S025TS-1VFG256T2 Microchip | 2670 |
| - | - | - | 256-LBGA | - | 256-FPBGA (17x17) | - | M2S025 | - | - | - | - | No Display | - | - | - | - | - | Honeywell | C7772G1004/U | - | - | - | Microchip Technology | - | - | - | - | - | 138 | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | 1.2000 V | - | - | 0 to 85 °C | - | Automotive, AEC-Q100, SmartFusion®2 | - | - | - | - | - | - | Indoor | - | - | - | - | - | - | - | - | - | 10 kOhm NTC | - | - | Temperature | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 25K Logic Modules | - | - | - | - | 256KB | - | - | - | - | ||
![]() M2S060T-VFG400 Microchip | 2409 |
| - | Production (Last Updated: 2 months ago) | - | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S060 | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060T-VFG400 | - | - | - | PEI-Genesis | - | - | - | 3 | - | 207 | - | - | 85 °C | Bulk | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Non-Compliant | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | * | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | - | S-PBGA-B400 | - | 207 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 60K Logic Modules | - | 56520 | - | - | 256KB | - | - | 17 mm | 17 mm | ||
![]() M2S050-1FG896I Microchip | 2469 |
| - | - | - | 896-BGA | - | 896-FBGA (31x31) | - | M2S050 | - | - | 64 kB | - | - | - | - | - | - | - | Electri-Flex | - | 166 MHz | - | - | Microchip Technology | - | - | - | - | SMD/SMT | 377 | - | 56340 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | 1.2000 V | - | - | -40 to 100 °C | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 896 | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 50K Logic Modules | - | - | 1 Core | - | 256KB | - | - | - | - | ||
![]() A2F200M3F-1PQG208I Microchip | In Stock | - | - | - | - | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | A2F200 | - | 100 MHz | - | 200000 | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | A2F200M3F-1PQG208I | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | 3 | - | MCU - 22, FPGA - 66 | - | - | - | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 30 | 5.59 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | - | - | -40 to 100 °C | - | SmartFusion® | - | - | Yes | Pure Matte Tin (Sn) | - | - | - | 8542.39.00.01 | - | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | - | S-PQFP-G208 | - | 66 | Not Qualified | - | 1.5,1.8,2.5,3.3 V | - | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | - | 200000 | 256KB | - | - | 28 mm | 28 mm |