- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Number of Terminals | Angle | Approvals | Base Product Number | Cable Style | Data RAM Size | Development Kit | Factory Pack QuantityFactory Pack Quantity | Grip Type | Ihs Manufacturer | Input Frequency | Interface Type | Isolation Voltage (Min) | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Cable Diameter (mm) | Maximum Clock Frequency | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Cable Diameter (mm) | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Elements | Operating Temperature Max Deg. C | Operating Temperature Min Deg. C | Operating Temperature-Max | Operation | Output Power (Max) | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Processor Series | Product Depth (mm) | Product Status | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Timing Range | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Termination | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Number of Outputs | Qualification Status | Efficiency | Output Voltage | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Output Current | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Output Power | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Terminal Type | Operating Temperature Range | Total RAM Bits | Screening Level | Speed Grade | Number of ADC Channels | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Mode of Operation | Connection Type | Input Voltage | Contacts | IP Rating | Product Length (mm) | Length | Width | Width (in) | Product Height (mm) | Lead Free |
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![]() MPFS250T-FCVG484EES Microchip Technology | In Stock | - | - | - | - | FCVG-484 | - | - | 484-FCBGA (19x19) | - | - | - | - | - | - | - | - | 1 | - | - | - | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | - | 667 MHz, 667 MHz | 667 MHz | - | + 100 C | Microchip Technology | - | - | 0 C | Yes | - | SMD/SMT | - | 372 I/O | 254000 LE | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | 2.2MB | - | RISC-V | DMA, PCI, PWM | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | 5 Core | 128kB | - | - | - | - | - | - | - | - | - | - | - | ||
![]() MPFS250T-1FCSG536EES Microchip Technology | In Stock | - | - | - | - | FCSG-536 | - | - | 536-LFBGA | - | - | - | - | - | - | - | - | 1 | - | - | - | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | - | 667 MHz, 667 MHz | 667 MHz | - | + 100 C | Microchip Technology | - | - | 0 C | Yes | - | SMD/SMT | - | 372 I/O | 254000 LE | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | 2.2MB | - | RISC-V | DMA, PCI, PWM | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | 5 Core | 128kB | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M2S050S-1FGG484I Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | 47 to 63(Hz) | - | 3000VAC(V) | - | - | Microsemi Corporation | M2S050S-1FGG484I | - | - | - | - | - | - | - | - | - | - | 3 | Desktop | - | - | - | 60C | -10C | - | - | 120 W | - | - | - | - | - | - | - | Active | - | 97(mm) | - | No | 30 | 5.26 | - | Yes | - | - | - | - | - | - | - | Commercial grade | - | - | - | e1 | - | Regulated | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | - | 8542.39.00.01 | - | - | - | - | 250 | - | compliant | - | - | 1 | - | 85(%) | 24(V) | - | - | - | - | - | 5(A) | - | - | - | - | - | 120(W) | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | Commercial | - | - | - | - | - | - | - | - | 85 to 132/170 to 265(V) | - | - | 110(mm) | - | - | - | 60(mm) | - | ||
![]() M2S060TS-VFG400 Microchip | 2621 |
| - | - | - | 400-LFBGA | YES | - | 400-VFBGA (17x17) | - | 400 | - | - | M2S060 | - | 64 kB | - | - | - | MICROSEMI CORP | - | - | - | - | - | Microsemi Corporation | M2S060TS-VFG400 | - | 166 MHz | - | - | - | PEI-Genesis | - | - | - | - | 3 | - | - | 207 | 56520 LE | - | - | 85 °C | - | - | Bulk | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | - | Active | - | - | 5.8 | - | Yes | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | * | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | 40 | S-PBGA-B400 | 207 | Not Qualified | - | - | - | 1.2 V | OTHER | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | - | - | - | - | - | - | 17 mm | 17 mm | - | - | - | ||
![]() MPFS460TS-FCG1152IPP Microchip | In Stock | - | - | - | - | 1152-BBGA, FCBGA | - | - | 1152-FCBGA (35x35) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 136, FPGA - 468 | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C | - | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.95MB | - | RISC-V | DMA, PCI, PWM | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 461K Logic Modules | - | - | 128kB | - | - | - | - | - | - | - | - | - | - | - | ||
![]() MPFS460T-1FCG1152EPP Microchip | In Stock | - | - | - | - | 1152-BBGA, FCBGA | - | - | 1152-FCBGA (35x35) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 136, FPGA - 468 | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 100°C | - | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.95MB | - | RISC-V | DMA, PCI, PWM | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 461K Logic Modules | - | - | 128kB | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M2S090-1FG676IX417 Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-Compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() A2F500M3G-1FGG256 Microchip | In Stock | - | - | - | - | 256-LBGA | - | - | 256-FPBGA (17x17) | - | - | - | - | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 25, FPGA - 66 | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100MHz | 64KB | - | ARM® Cortex®-M3 | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | MCU, FPGA | - | - | - | - | - | - | - | 1 | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 512KB | - | - | - | - | - | - | - | - | - | - | - | ||
![]() MPFS095T-FCSG325T2 Microchip | In Stock | - | - | - | - | 325-TFBGA | - | - | 325-BGA (11x11) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 102, FPGA - 80 | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 857.6KB | - | RISC-V | DMA, PCI, PWM | - | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | 128KB | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M2S025T-VFG400 Microchip | 2864 |
| - | - | - | 400-LFBGA | - | - | 400-VFBGA (17x17) | - | - | - | - | M2S025 | - | 64 kB | - | - | - | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | Microchip Technology | - | - | - | - | - | - | - | 207 | 27696 LE | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | - | - | - | - | - | - | - | - | - | ||
![]() MPFS160T-FCVG484T2 Microchip | In Stock | - | - | - | - | 484-BFBGA, FCBGA | - | - | 484-FCBGA (19x19) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 136, FPGA - 108 | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4125MB | - | RISC-V | DMA, PCI, PWM | - | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 128KB | - | - | - | - | - | - | - | - | - | - | - | ||
![]() MPFS095T-1FCVG784T2 Microchip | In Stock | - | - | - | - | 784-BFBGA, FCBGA | - | - | 784-FCBGA (23x23) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | PEI-Genesis | - | - | - | - | - | - | - | MCU - 136, FPGA - 276 | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 125°C (TJ) | - | * | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 857.6KB | - | RISC-V | DMA, PCI, PWM | - | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | 128KB | - | - | - | - | - | - | - | - | - | - | - | ||
![]() PIC32CX1025SG41128-I/Z2X Microchip Technology | 473 | - | - | - | - | TQFP-128 | - | - | - | - | - | - | - | - | - | - | EV06X38A | 1000 | - | - | - | CAN, Ethernet, USB | - | - | - | - | - | - | 120 MHz | - | - | + 85 C | Microchip Technology | - | - | - 40 C | - | - | SMD/SMT | - | 99 I/O | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | PIC32CX | - | Active | - | - | - | Details | - | - | - | 3.63 V | 1.71 V | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.71 V to 3.63 V | - | - | - | - | - | - | - | Flash | 1 MB | - | - | - | - | - | - | - | - 40 C to + 85 C | - | - | - | 32 Channel | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() MPFS025T-FCVG484I Microchip Technology | 60 |
| - | - | - | FCVG-484 | - | - | 484-FCBGA (19x19) | - | - | - | - | - | - | - | - | 1 | - | - | - | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | - | 667 MHz, 667 MHz | - | - | + 100 C | Microchip Technology | - | - | 0 C | - | - | SMD/SMT | MSL 3 - 168 hours | 108 I/O | 23000 LE | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | 230.4KB | - | RISC-V | DMA, PCI, PWM | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | MPU, FPGA | - | - | - | - | - | 1843.2Kbit | - | - | - | FPGA - 23K Logic Modules | - | 5 Core | 128KB | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M2S025-1FG484I Microchip | 2708 |
| - | - | - | 484-BGA | - | - | 484-FPBGA (23x23) | - | - | - | - | M2S025 | - | 64 kB | - | - | - | - | - | - | - | - | - | Clarostat-Honeywell | 73JA500 | - | 166 MHz | - | 1.26 V | - | Microchip Technology | - | 1.14 V | - | - | - | SMD/SMT | - | 267 | 27696 LE | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | - | - | - | - | 1 | - | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M2S060T-FCSG325I Microchip | 2642 |
| - | Production (Last Updated: 2 months ago) | DIN Rail,Surface | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x11) | - | 325 | - | CSA, UL | M2S060 | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | - | Syrelec, Brand of Crouzet Control | SHS1S24A | - | - | - | 1.26 V | - | Microchip Technology | - | 1.14 V | - | - | 3 | - | - | 200 | - | - | - | - | - | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | - | Active | - | - | 2.36 | No | Yes | 8542390000 | - | 1.26 V | 1.14 V | 1.2 V | 1 | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | e1 | 0.250 in Flat Blade | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | LG-MIN, WD-MIN | - | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | S-PBGA-B325 | 200 | Not Qualified | - | - | - | 1.2 V | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | STD | - | FPGA - 60K Logic Modules | 56520 | - | 256KB | Interval | - | - | Solid State | IP66 | - | 11 mm | 11 mm | - | - | Lead Free | ||
![]() M2S010-1TQG144I Microchip | 2685 |
| - | - | - | 144-LQFP | - | - | 144-TQFP (20x20) | Steel | - | Straight | cUL, UL | M2S010 | Round | 64 kB | - | - | Bushing Grip with Strain Relief | - | - | - | - | - | - | Crouse-Hinds Industrial Produc | CGB399 | 30.18 mm | 166 MHz | - | - | - | Microchip Technology | 25.4 mm | - | - | - | - | SMD/SMT | - | 84 | 12084 LE | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | No | - | - | - | - | - | - | - | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | - | - | - | - | - | - | Metallic | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | - | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | - | - | - | - | 1 | - | FPGA - 10K Logic Modules | - | 1 Core | 256KB | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M2S060T-FCSG325 Microchip | 2851 |
| - | Production (Last Updated: 2 months ago) | - | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x11) | Nylon | 325 | - | - | M2S060 | - | 64 kB | - | - | - | MICROSEMI CORP | - | - | - | - | - | Thomas & Betts | TY23M-4 | - | 166 MHz | - | 1.26 V | - | Microchip Technology | - | 1.14 V | - | - | 3 | - | - | 200 | 56520 LE | - | - | 85 °C | - | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | - | Active | - | - | 5.82 | Non-Compliant | Yes | - | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 85 °C | - | SmartFusion®2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | Yellow | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | S-PBGA-B325 | 200 | Not Qualified | - | - | - | 1.2 V | OTHER | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | STD | - | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | - | - | - | - | - | - | 11 mm | 11 mm | 0.093 | - | - | ||
![]() M2S050T-FCSG325I Microchip | 2784 |
| - | - | - | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x11) | - | 325 | - | - | M2S050 | - | 64 kB | - | - | - | MICROSEMI CORP | - | - | - | - | - | Schneider | 136499 | - | 166 MHz | - | 1.26 V | - | Microchip Technology | - | 1.14 V | - | - | 3 | SMD/SMT | - | 200 | 56340 LE | - | - | - | - | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | - | Active | - | 40 | 5.76 | - | Yes | - | - | 1.26 V | 1.14 V | 1.2 V | - | 2.5, 3.3 V | - | -40 to 100 °C | - | SmartFusion®2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | - | S-PBGA-B325 | 200 | Not Qualified | - | - | - | 1.2 V | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | STD | - | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | - | Threaded | - | - | - | - | 11 mm | 11 mm | - | - | - | ||
![]() M2S010T-VFG256 Microchip | 163 |
| - | Production (Last Updated: 1 month ago) | - | 256-LBGA | - | 256 | 256-FPBGA (17x17) | - | - | - | CE, CSA, UL | M2S010 | - | 64 kB | - | - | - | - | - | - | - | - | - | Cutler Hammer, Div of Eaton Co | 10250T112-2 | - | 166 MHz | - | 1.26 V | + 85 C | Microchip Technology | - | 1.14 V | 0 C | - | - | SMD/SMT | - | 138 | 12084 LE | - | - | - | Momentary | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | Compliant | - | - | - | - | - | - | - | 1.2000 V | - | 0 to 85 °C | - | SmartFusion®2 | - | - | - | - | 85 °C | 0 °C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | 166MHz | 50 kB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | Screw | - | - | - | STD | - | FPGA - 10K Logic Modules | - | 1 Core | 256KB | - | - | - | 2NO | IP65 | - | - | - | - | - | - |