- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Breakdown Voltage / V | Clock Frequency-Max | Data Converters | Data RAM Size | Data RAM Type | Device Logic Gates | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of Elements | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Reverse Stand-off Voltage | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | JESD-609 Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Frequency | Operating Supply Voltage | Polarity | Power Supplies | Temperature Grade | Interface | Leakage Current | Memory Size | Oscillator Type | Element Configuration | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Program Memory Type | Power Line Protection | Core Size | Program Memory Size | Connectivity | Output Power | Max Reverse Leakage Current | Clamping Voltage | Architecture | Data Bus Width | Peak Pulse Current | Max Surge Current | Peak Pulse Power | Number of Inputs | Direction | Test Current | Seated Height-Max | Programmable Logic Type | Product Type | Protocol | Core Architecture | EEPROM Size | Total RAM Bits | Reverse Breakdown Voltage | Power - Output | Speed Grade | RF Family/Standard | Sensitivity | Data Rate (Max) | Number of ADC Channels | Primary Attributes | Serial Interfaces | Current - Receiving | Current - Transmitting | Number of Logic Cells | Modulation | Number of Cores | Number of Bidirectional Channels | GPIO | Flash Size | Min Breakdown Voltage | Product Category | Device Core | Height | Length | Width | Radiation Hardening |
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 A2F200M3F-1FG256 Microchip | In Stock | - | - | - | - | - | 256-LBGA | - | - | 256-FPBGA (17x17) | - | A2F200 | - | - | - | - | - | - | - | - | - | - | - | - | Klockner-Moeller, Div of Eaton | DIL2MKV-00(24V50/60HZ) | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 25, FPGA - 66 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100MHz | 64KB | - | - | ARM® Cortex®-M3 | DMA, POR, WDT | - | - | - | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | - | - | - | - | - | - | - | 256KB | - | - | - | - | - | - | - | ||
ATWINC1500B-MU-Y042 Microchip | 888 | - | - | - | - | Surface Mount | QFN-40 | YES | - | 40-QFN (5x5) | 40 | ATWINC1500 | Microchip Technology / Atmel | - | 48 MHz | - | 64 kB, 128 kB | RAM | - | 490 | MICROCHIP TECHNOLOGY INC | I2C, SPI, UART | - | - | Microchip | ATWINC1500B-MU-Y042 | 48 MHz | 72.2 Mbps | - | + 85 C | Microchip Technology | - | - 40 C | Yes | - | SMD/SMT | - | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | HQCCN | VQFN-40 | LCC40,.2SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | - | - | 5.06 | - | - | - | 61 mA | 268 mA | 4.2 V | 2.7 V | 3.3 V | - | -40°C ~ 85°C | Tray | - | - | Wi-Fi | - | - | - | - | - | - | Wireless & RF Integrated Circuits | Si | 2.7V ~ 3.6V | QUAD | NO LEAD | - | 0.4 mm | compliant | 2.4GHz | S-PQCC-N40 | - | - | 2.4 GHz | - | - | - | INDUSTRIAL | - | - | 4MB Flash, 128kB ROM, 224kB RAM | - | - | - | - | - | NETWORK CONTROLLER | - | - | Flash | - | - | 4 MB | - | 18.5 dBm | - | - | - | 32 bit | - | - | - | - | - | - | 1 mm | - | RF System on a Chip - SoC | 802.11b/g/n | - | - | - | - | 20.5dBm | - | WiFi | - 74 dBm | 72.2Mbps | - | - | I²C, SDIO, SPI, UART | 22mA ~ 58.5mA | 22mA ~ 294mA | - | CCK, DSSS, OFDM | - | - | 9 | - | - | RF System on a Chip - SoC | - | 0.85 mm | 5 mm | 5 mm | - | ||
PIC32MZ1025W104132-I/NX Microchip | 139 | - | - | - | - | Surface Mount | DQFN-132 | - | - | 132-VQFN (10x10) | - | PIC32MZ1025 | Microchip Technology / Atmel | - | - | A/D 20x12b SAR | 256 kB | SRAM | - | 168 | - | CAN, I2C, SPI, UART | - | - | Microchip | - | 80 MHz | 54 Mbps | - | + 85 C | Microchip Technology | - | - 40 C | Yes | - | SMD/SMT | MSL 3 - 168 hours | - | 64 I/O | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | 88 mA | 287 mA | 3.63 V | 2.97 V | - | - | -40°C ~ 85°C (TA) | Tray | PIC® 32MZ | - | Wi-Fi | - | - | - | - | - | - | Wireless & RF Integrated Circuits | Si | - | - | - | - | - | - | - | - | - | - | 2.4 GHz | - | - | - | - | CAN, Ethernet, I2C, I2S, SPI, UART, USB | - | - | Internal | - | 200MHz | 256K x 8 | 2.97V ~ 3.63V | - | MIPS32® M-Class | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | Flash | - | 32-Bit Single-Core | 1MB | CANbus, Ethernet, I²C, IrDA, SPI, SQI, UART/USART, USB OTG | 21.5 dBm | - | - | - | 32bit | - | - | - | - | - | - | - | - | RF System on a Chip - SoC | - | - | - | - | - | - | - | - | - 76 dBm | - | 20 Channel | - | - | - | - | - | - | - | - | - | - | - | RF System on a Chip - SoC | PIC32 MZ | - | - | - | - | ||
M2S010T-VFG400I Microchip | 36 |
| - | - | Surface Mount | - | 400-LFBGA | YES | 2 | 400-VFBGA (17x17) | 400 | M2S010 | - | 12.2 V | - | - | 64 kB | - | - | - | MICROSEMI CORP | - | - | - | Microsemi Corporation | M2S010T-VFG400I | 166 MHz | - | - | - | Microchip Technology | - | - | - | 3 | SMD/SMT | - | 1 | 195 | - | 12084 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 11 V | 5.77 | Compliant | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 150 °C | -55 °C | Zener | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | S-PBGA-B400 | 195 | Not Qualified | - | 11 V | Bidirectional | 1.2 V | - | - | 5 µA | - | - | Single | 166MHz | 64KB | - | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | No | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | 5 µA | 18.2 V | MCU, FPGA | - | 82.4 A | 82.4 A | 1.5 kW | 195 | Bidirectional | 1 mA | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | 12.2 V | - | - | - | - | - | - | FPGA - 10K Logic Modules | - | - | - | 12084 | - | 1 Core | 1 | - | 256KB | 12.2 V | - | - | - | 17 mm | 17 mm | No | ||
M2S090-FCS325I Microchip Technology | 2299 |
| - | Production (Last Updated: 2 months ago) | - | - | FCBGA-325 | YES | - | 325-FCBGA (11x13.5) | 325 | M2S090 | - | - | - | - | 64 kB | - | - | 176 | MICROSEMI CORP | - | - | - | - | M2S090-FCS325I | 166 MHz | - | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | SMD/SMT | - | - | 180 | 7193 LAB | 86316 LE | - | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | - | 5.83 | N | No | This product may require additional documentation to export from the United States. | - | - | 1.26 V | 1.14 V | 1.2 V | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | - | CMOS | - | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | - | R-PBGA-B325 | 180 | Not Qualified | - | - | - | 1.2 V | - | - | - | - | - | - | 166MHz | 64KB | - | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | MCU, FPGA | - | - | - | - | 180 | - | - | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 90K Logic Modules | - | - | - | 86316 | - | 1 Core | - | - | 512KB | - | - | - | - | 13.5 mm | 11 mm | - | ||
M2S010-FG484I Microchip Technology | 23 |
| - | - | - | - | FPBGA-484 | YES | - | 484-FPBGA (23x23) | 484 | M2S010 | - | - | - | - | 64 kB | - | - | 60 | MICROSEMI CORP | - | - | - | - | M2S010-FG484I | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | - | - | 233 | 1007 LAB | 12084 LE | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | - | 5.81 | N | No | This product may require additional documentation to export from the United States. | - | - | 1.26 V | 1.14 V | 1.2 V | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | - | 8542.39.00.01 | - | CMOS | - | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | S-PBGA-B484 | 233 | Not Qualified | - | - | - | 1.2 V | - | - | - | - | - | - | 166MHz | 64KB | - | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | MCU, FPGA | - | - | - | - | 233 | - | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 10K Logic Modules | - | - | - | 12084 | - | 1 Core | - | - | 256KB | - | - | - | - | 23 mm | 23 mm | - | ||
M2S050T-1FGG484 Microchip Technology | 2638 |
| - | - | - | - | FPBGA-484 | - | - | 484-FPBGA (23x23) | - | M2S050 | - | - | - | - | 64 kB | - | - | 60 | - | - | - | - | - | - | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | - | - | 267 | 4695 LAB | 56340 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 | - | - | - | - | FPGA - 50K Logic Modules | - | - | - | - | - | 1 Core | - | - | 256KB | - | - | - | - | - | - | - | ||
M2S025-VF400I Microchip Technology | 330 | - | - | - | - | - | VFPBGA-400 | YES | - | 400-VFBGA (17x17) | 400 | M2S025 | - | - | - | - | 64 kB | - | - | 90 | MICROSEMI CORP | - | - | - | - | M2S025-VF400I | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | - | - | 207 | 2308 LAB | 27696 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | - | 5.84 | N | No | This product may require additional documentation to export from the United States. | - | - | 1.26 V | 1.14 V | 1.2 V | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | - | 8542.39.00.01 | - | CMOS | - | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | S-PBGA-B400 | 207 | Not Qualified | - | - | - | 1.2 V | - | - | - | - | - | - | 166MHz | 64KB | - | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | MCU, FPGA | - | - | - | - | 207 | - | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | - | - | 27696 | - | 1 Core | - | - | 256KB | - | - | - | - | 17 mm | 17 mm | - | ||
M2S005S-1VFG256 Microchip Technology | 23 |
| - | - | - | - | VFPBGA-256 | - | - | 256-FPBGA (17x17) | - | M2S005 | - | - | - | - | 64 kB | - | - | 119 | - | - | - | - | - | - | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | - | - | 161 | 505 LAB | 6060 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | - | ARM® Cortex®-M3 | - | - | - | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 5K Logic Modules | - | - | - | - | - | 1 Core | - | - | 128KB | - | - | - | - | - | - | - | ||
M2S005-1FGG484 Microchip Technology | 94 |
| - | - | - | - | FPBGA-484 | - | - | 484-FPBGA (23x23) | - | M2S005 | - | - | - | - | 64 kB | - | - | 60 | - | - | - | - | - | - | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | MSL 3 - 168 hours | - | 209 | 505 LAB | 6060 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | - | ARM® Cortex®-M3 | DDR | - | - | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | 191Kbit | - | - | - | - | - | - | - | FPGA - 5K Logic Modules | - | - | - | - | - | 1 Core | - | - | 128KB | - | - | - | - | - | - | - | ||
M2S010-1FG484 Microchip Technology | 7 |
| - | - | - | - | FPBGA-484 | YES | - | 484-FPBGA (23x23) | 484 | M2S010 | - | - | - | - | 64 kB | - | - | 60 | MICROSEMI CORP | - | - | - | - | M2S010-1FG484 | 166 MHz | - | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | 3 | SMD/SMT | - | - | 233 | 1007 LAB | 12084 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | - | 5.84 | N | No | This product may require additional documentation to export from the United States. | - | - | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | - | 8542.39.00.01 | - | CMOS | - | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | S-PBGA-B484 | 233 | Not Qualified | - | - | - | 1.2 V | OTHER | - | - | - | - | - | 166MHz | 64KB | - | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | MCU, FPGA | - | - | - | - | 233 | - | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | 1 | - | - | - | - | FPGA - 10K Logic Modules | - | - | - | 9744 | - | 1 Core | - | - | 256KB | - | - | - | - | 23 mm | 23 mm | - | ||
M2S025-VFG256 Microchip Technology | 2756 | - | - | Production (Last Updated: 2 months ago) | - | - | 256-LBGA | YES | - | 256-FPBGA (17x17) | 256 | M2S025 | - | - | - | - | 64 kB | - | - | 119 | MICROSEMI CORP | - | - | - | - | M2S025-VFG256 | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | 3 | - | - | - | 138 | 2308 LAB | 27696 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | - | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | - | - | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | - | CMOS | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | S-PBGA-B256 | 138 | Not Qualified | - | - | - | 1.2 V | OTHER | - | - | - | - | - | 166MHz | 64KB | - | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | MCU, FPGA | - | - | - | - | 138 | - | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | STD | - | - | - | - | FPGA - 25K Logic Modules | - | - | - | 27696 | - | 1 Core | - | - | 256KB | - | - | - | - | 14 mm | 14 mm | - | ||
A2F500M3G-CSG288 Microchip | 45 |
| - | - | - | - | 288-TFBGA, CSPBGA | - | - | 288-CSP (11x11) | - | A2F500 | - | - | - | - | - | - | 500000 | - | - | - | - | - | - | - | - | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | - | - | - | - | MCU - 31, FPGA - 78 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | 1.5000 V | 0 to 85 °C | - | SmartFusion® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 80MHz | 64KB | - | - | ARM® Cortex®-M3 | DMA, POR, WDT | - | - | - | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | STD | - | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | - | - | - | - | - | - | 512KB | - | - | - | - | - | - | - | ||
MPFS095T-1FCVG484E Microchip Technology | 2047 | - | - | - | - | - | BGA-484 | - | - | 484-FCBGA (19x19) | - | - | - | - | - | - | - | - | - | 1 | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | - | 276 I/O | - | 93000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 100°C | Tray | PolarFire® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | - | - | - | - | 857.6kB | - | - | RISC-V | DMA, PCI, PWM | - | - | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | - | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | - | - | - | 5 Core | - | - | 128kB | - | - | - | - | - | - | - | ||
MPFS460T-FCG1152EPP Microchip | In Stock | - | - | - | - | - | 1152-BBGA, FCBGA | - | - | 1152-FCBGA (35x35) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 136, FPGA - 468 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 100°C | - | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.95MB | - | - | RISC-V | DMA, PCI, PWM | - | - | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | - | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 461K Logic Modules | - | - | - | - | - | - | - | - | 128kB | - | - | - | - | - | - | - | ||
MPFS460T-FCG1152IPP Microchip | In Stock | - | - | - | - | - | 1152-BBGA, FCBGA | - | - | 1152-FCBGA (35x35) | - | - | Microchip Technology | - | - | - | - | - | - | 1 | - | - | - | - | Microchip | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 136, FPGA - 468 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | SOC - Systems on a Chip | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.95MB | - | - | RISC-V | DMA, PCI, PWM | - | - | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | - | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 461K Logic Modules | - | - | - | - | - | - | - | - | 128kB | - | SoC FPGA | - | - | - | - | - | ||
A2F060M3E-1FGG256M Microchip | In Stock | - | - | - | - | - | - | - | 256 | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | Microsemi Corporation | A2F060M3E-1FGG256M | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | , | - | - | - | Obsolete | - | - | - | 5.82 | Compliant | Yes | - | - | - | - | - | - | - | - | - | - | - | - | - | 125 °C | -55 °C | - | - | 8542.39.00.01 | - | - | - | - | - | - | - | compliant | 100 MHz | - | - | - | - | - | - | - | - | EBI/EMI, I2C, SPI, UART, USART | - | - | - | - | - | - | - | - | - | DMA, POR, WDT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ARM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
MPFS095T-1FCSG536E Microchip Technology | 2501 | - | - | - | - | - | BGA-536 | - | - | 536-LFBGA | - | - | - | - | - | - | - | - | - | 1 | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | - | 276 I/O | - | 93000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 100°C | Tray | PolarFire® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | - | - | - | - | 857.6kB | - | - | RISC-V | DMA, PCI, PWM | - | - | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | - | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | - | - | - | 5 Core | - | - | 128kB | - | - | - | - | - | - | - | ||
MPFS160TS-FCVG484I Microchip Technology | 2172 | - | - | - | - | - | BGA-484 | - | - | 484-FCBGA (19x19) | - | - | - | - | - | - | - | - | - | 1 | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | - | 312 I/O | - | 161000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | - | - | - | - | 1.4125MB | - | - | RISC-V | DMA, PCI, PWM | - | - | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | - | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | - | - | - | 5 Core | - | - | 128kB | - | - | - | - | - | - | - | ||
MPFS250TS-FCVG484I Microchip Technology | 2314 | - | - | - | - | - | BGA-484 | - | - | 484-FCBGA (19x19) | - | - | - | - | - | - | - | - | - | 1 | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | - | + 100 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | - | - | 372 I/O | - | 254000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | - | - | - | - | 2.2MB | - | - | RISC-V | DMA, PCI, PWM | - | - | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | - | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | - | - | - | 5 Core | - | - | 128kB | - | - | - | - | - | - | - |