- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Gates | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S060T-1FCSG325 Microchip Technology | 2906 |
| - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | - | 64 kB | 176 | MICROSEMI CORP | - | - | M2S060T-1FCSG325 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | - | 200 | 4710 LAB | 56520 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.82 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | - | - | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | - | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 60K Logic Modules | - | 56520 | 1 Core | - | 256KB | 11 mm | 11 mm | ||
A2F500M3G-1CS288 Microchip Technology | 30 |
| - | - | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F500 | 100 MHz | 64 kB | 176 | MICROSEMI CORP | - | - | A2F500M3G-1CS288 | 100 MHz | - | - | Microchip Technology | - | - | Yes | - | - | MCU - 31, FPGA - 78 | - | 6000 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | - | 0°C ~ 85°C (TJ) | Tray | A2F500 | e0 | - | - | TIN LEAD SILVER | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PBGA-B288 | 78 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 11 mm | 11 mm | ||
M2S050-1FGG896 Microchip Technology | 2213 |
| - | - | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | M2S050 | - | 64 kB | 27 | MICROSEMI CORP | - | - | M2S050-1FGG896 | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 377 | 4695 LAB | 56340 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 50K Logic Modules | - | 56340 | 1 Core | - | 256KB | 31 mm | 31 mm | ||
M2S025-1VF400 Microchip Technology | 2370 |
| - | - | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S025 | - | 64 kB | 90 | MICROSEMI CORP | - | - | M2S025-1VF400 | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | SMD/SMT | 207 | 2308 LAB | 27696 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | S-PBGA-B400 | 160 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 25K Logic Modules | - | 23988 | 1 Core | - | 256KB | 17 mm | 17 mm | ||
M2S025TS-1FCS325I Microchip Technology | 2336 |
| - | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2S025 | - | 64 kB | 176 | MICROSEMI CORP | - | - | M2S025TS-1FCS325I | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 180 | 2308 LAB | 27696 LE | - | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | - | - | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | - | - | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | - | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 25K Logic Modules | - | 27696 | 1 Core | - | 256KB | 11 mm | 11 mm | ||
M2S025TS-FCS325I Microchip Technology | 2781 |
| - | Production (Last Updated: 2 months ago) | FCBGA-325 | - | 325-FCBGA (11x11) | - | M2S025 | - | 64 kB | 176 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 180 | 2308 LAB | 27696 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | - | 1 Core | - | 256KB | - | - | ||
M2S090TS-1FCS325 Microchip Technology | 2765 |
| - | - | FCBGA-325 | YES | 325-FCBGA (11x13.5) | 325 | M2S090 | - | 64 kB | 176 | MICROSEMI CORP | - | - | M2S090TS-1FCS325 | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 180 | 7193 LAB | 86316 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | - | - | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | - | - | R-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | - | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 90K Logic Modules | - | 86316 | 1 Core | - | 512KB | 13.5 mm | 11 mm | ||
M2S060TS-1FGG676I Microchip Technology | 2563 |
| - | Production (Last Updated: 2 months ago) | 676-BGA | - | 676-FBGA (27x27) | - | M2S060 | - | 64 kB | 40 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 387 | 4710 LAB | 56520 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | 1 Core | - | 256KB | - | - | ||
M2S060TS-FG676I Microchip Technology | 2111 |
| - | - | 676-BGA | - | 676-FBGA (27x27) | - | M2S060 | - | 64 kB | 40 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 387 | 4710 LAB | 56520 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | 1 Core | - | 256KB | - | - | ||
M2S025TS-VFG400I Microchip Technology | 2745 |
| - | Production (Last Updated: 2 months ago) | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S025 | - | 64 kB | 90 | MICROSEMI CORP | - | - | M2S025TS-VFG400I | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | 207 | 2308 LAB | 27696 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | - | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | 40 | - | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 25K Logic Modules | - | 27696 | 1 Core | - | 256KB | 17 mm | 17 mm | ||
M2S025TS-FCS325 Microchip Technology | 2603 |
| - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | - | 325-FCBGA (11x11) | - | M2S025 | - | 64 kB | 176 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 180 | 2308 LAB | 27696 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | - | 1 Core | - | 256KB | - | - | ||
M2S050TS-1FCS325 Microchip Technology | 2650 |
| - | Production (Last Updated: 2 months ago) | FCBGA-325 | - | 325-FCBGA (11x11) | - | M2S050 | - | 64 kB | 176 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 200 | 4695 LAB | 56340 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 50K Logic Modules | - | - | 1 Core | - | 256KB | - | - | ||
M2S150TS-1FCV484I Microchip Technology | 949 | - | - | - | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | M2S150 | - | 64 kB | 84 | MICROSEMI CORP | - | - | M2S150TS-1FCV484I | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 273 | 12177 LAB | 146124 LE | - | - | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | - | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | No | - | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | - | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | S-PBGA-B484 | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 150K Logic Modules | - | - | 1 Core | - | 512KB | 19 mm | 19 mm | ||
M2S150TS-1FCS536 Microchip Technology | 2759 |
| - | - | 536-LFBGA, CSPBGA | - | 536-CSPBGA (16x16) | - | M2S150 | - | 64 kB | 90 | - | - | - | - | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | - | 293 | 12177 LAB | 146124 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | 536 | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 150K Logic Modules | - | - | 1 Core | - | 512KB | - | - | ||
M2S050T-1FGG484M Microchip Technology | 2652 | - | - | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S050 | - | 64 kB | 60 | MICROSEMI CORP | - | - | M2S050T-1FGG484M | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | 267 | 4695 LAB | 56340 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | - | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | - | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | - | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 50K Logic Modules | - | 56340 | 1 Core | - | 256KB | 23 mm | 23 mm | ||
M2S025-1FCSG325 Microchip Technology | 26 |
| - | Production (Last Updated: 2 months ago) | FCBGA-325 | - | 325-FCBGA (11x11) | - | M2S025 | - | 64 kB | 176 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 180 | 2308 LAB | 27696 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | - | 1 Core | - | 256KB | - | - | ||
A2F200M3F-PQ208I Microchip Technology | In Stock | - | - | - | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | A2F200 | 80 MHz | 64 kB | 24 | MICROSEMI CORP | - | - | A2F200M3F-PQ208I | 80 MHz | - | + 100 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 113 I/O | - | 2000 LE | - | - | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 20 | 5.61 | N | No | - | 1.575 V | 1.425 V | 1.5 V | SmartFusion | - | -40°C ~ 100°C (TJ) | Tray | A2F200 | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | CMOS | QUAD | GULL WING | 225 | 0.5 mm | compliant | - | - | S-PQFP-G208 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 200000 | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | 256KB | 28 mm | 28 mm | ||
M2S060TS-1VFG400I Microchip Technology | 2612 |
| - | - | 400-LFBGA | - | 400-VFBGA (17x17) | - | M2S060 | - | 64 kB | 90 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 207 | 4710 LAB | 56520 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | 1 Core | - | 256KB | - | - | ||
A2F200M3F-1CS288I Microchip Technology | 31 |
| - | - | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F200 | 100 MHz | 64 kB | 176 | MICROSEMI CORP | - | - | A2F200M3F-1CS288I | 100 MHz | - | - | Microchip Technology | - | - | Yes | - | - | MCU - 31, FPGA - 78 | - | 2000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 20 | 1.56 | N | No | - | 1.575 V | 1.425 V | 1.5 V | SmartFusion | - | -40°C ~ 100°C (TJ) | Tray | A2F200 | e0 | - | - | TIN LEAD SILVER | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 235 | 0.5 mm | compliant | - | - | S-PBGA-B288 | 78 | Not Qualified | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 4608 CLBS, 200000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | 256KB | 11 mm | 11 mm | ||
M2S060TS-VFG400I Microchip Technology | 2571 |
| - | - | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S060 | - | 64 kB | 90 | MICROSEMI CORP | - | - | M2S060TS-VFG400I | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | - | 207 | 4710 LAB | 56520 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | - | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | 40 | - | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 60K Logic Modules | - | 56520 | 1 Core | - | 256KB | 17 mm | 17 mm |