- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Total RAM Bits | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S025T-FCSG325 Microchip Technology | 183 | - | - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S025 | - | 64 kB | - | 176 | MICROSEMI CORP | - | - | - | M2S025T-FCSG325 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | - | MSL 3 - 168 hours | 180 | 2308 LAB | 27696 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 2.5, 3.3 V | 0.111027 oz | 0 to 85 °C | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | - | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 180 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | - | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | 592Kbit | STD | FPGA - 25K Logic Modules | - | 27696 | 1 Core | - | 256KB | 11 mm | 11 mm | ||
M2S050TS-1FGG484I Microchip Technology | 2295 |
| - | - | FPBGA-484 | - | 484-FPBGA (23x23) | - | M2S050 | - | 64 kB | - | 60 | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | - | 267 | 4695 LAB | 56340 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 50K Logic Modules | - | - | 1 Core | - | 256KB | - | - | ||
M2S150TS-1FCVG484I Microchip Technology | 2389 |
| - | - | 484-BFBGA | - | 484-FBGA (19x19) | - | M2S150 | - | 64 kB | - | 84 | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | - | 273 | 12177 LAB | 146124 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | - | 1 Core | - | 512KB | - | - | ||
M2S150T-FCS536 Microchip Technology | 2994 |
| - | - | 536-LFBGA, CSPBGA | - | 536-CSPBGA (16x16) | - | M2S150 | - | 64 kB | - | 90 | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | - | 293 | 12177 LAB | 146124 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | - | 1 Core | - | 512KB | - | - | ||
M2S005S-FG484I Microchip Technology | 26 |
| - | - | FPBGA-484 | - | 484-FPBGA (23x23) | - | M2S005 | - | 64 kB | - | 60 | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | - | 209 | 505 LAB | 6060 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 5K Logic Modules | - | - | 1 Core | - | 128KB | - | - | ||
M2S150TS-FCVG484 Microchip Technology | 2408 |
| - | - | 484-BFBGA | - | 484-FBGA (19x19) | - | M2S150 | - | 64 kB | - | 84 | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | - | 273 | 12177 LAB | 146124 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | - | 1 Core | - | 512KB | - | - | ||
M2S050TS-1FGG484M Microchip Technology | 2633 |
| - | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S050 | - | 64 kB | - | 60 | MICROSEMI CORP | - | - | - | M2S050TS-1FGG484M | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | - | 267 | 4695 LAB | 56340 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 50K Logic Modules | - | 56340 | 1 Core | - | 256KB | 23 mm | 23 mm | ||
M2S025T-1FGG484M Microchip Technology | In Stock | - | - | Production (Last Updated: 2 months ago) | FPBGA-484 | - | 484-FPBGA (23x23) | - | M2S025 | - | 64 kB | - | 60 | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | - | 267 | 2308 LAB | 27696 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | - | 1 Core | - | 256KB | - | - | ||
M2S090TS-1FGG484T2 Microchip Technology | 2904 | - | - | - | BGA-484 | - | 484-FPBGA (23x23) | - | M2S090 | - | 64 kB | 2074 kbit | 60 | - | - | - | - | - | 166 MHz | - | + 125 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | - | 267 I/O | 7193 LAB | 86316 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | 2.110353 oz | -40°C ~ 125°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 90K Logic Modules | - | - | 1 Core | - | 512KB | - | - | ||
A2F500M3G-CS288I Microchip Technology | 31 |
| - | - | 288-TFBGA, CSPBGA | - | 288-CSP (11x11) | - | A2F500 | - | 64 kB | - | 176 | - | - | - | - | - | 80 MHz | - | - | Microchip Technology | - | - | Yes | - | - | - | MCU - 31, FPGA - 78 | - | 6000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion | - | - | -40°C ~ 100°C (TJ) | Tray | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 1 Core | - | 512KB | - | - | ||
M2S010S-1TQG144I Microchip Technology | 26 |
| - | - | TQFP-144 | - | 144-TQFP (20x20) | - | M2S010 | - | 64 kB | 400 kbit | 60 | - | - | - | - | - | 166 MHz | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | - | - | SMD/SMT | - | 84 I/O | 1007 LAB | 12084 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | - | -40 to 100 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 10K Logic Modules | - | - | 1 Core | - | 256KB | - | - | ||
M2S010S-TQG144I Microchip Technology | 47 |
| - | - | TQFP-144 | - | 144-TQFP (20x20) | - | M2S010 | - | 64 kB | 400 kbit | 60 | - | - | - | - | - | 166 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | - | 84 I/O | 1007 LAB | 12084 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 10K Logic Modules | - | - | 1 Core | - | 256KB | - | - | ||
A2F060M3E-1FG256I Microchip | In Stock | - | - | - | - | YES | - | 256 | - | 100 MHz | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | A2F060M3E-1FG256I | - | - | - | - | - | - | - | 3 | - | - | - | - | - | - | - | - | PLASTIC/EPOXY | LBGA | 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | 20 | 5.84 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 66 | Not Qualified | - | 1.5,1.8,2.5,3.3 V | - | - | - | - | - | - | - | - | 66 | 1536 CLBS, 60000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 1536 | 1536 | - | 60000 | - | 17 mm | 17 mm | ||
MPFS250TS-FCVG784I Microchip Technology | 2180 | - | - | - | BGA-784 | - | 784-FCBGA (23x23) | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | - | 372 I/O | - | 254000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | 5 Core | - | 128kB | - | - | ||
MPFS095T-1FCVG784E Microchip Technology | 2998 | - | - | - | BGA-784 | - | 784-BGA | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | 276 I/O | - | 93000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 100°C | Tray | PolarFire® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | 5 Core | - | 128kB | - | - | ||
A2F200M3F-PQ208 Microchip | In Stock | - | - | - | 208-BFQFP | - | 208-PQFP (28x28) | - | A2F200 | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | MCU - 22, FPGA - 66 | - | - | - | - | Tray | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | - | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | - | - | - | 256KB | - | - | ||
MPFS160T-1FCVG484I Microchip Technology | 2499 | - | - | - | FCVG-484 | - | 484-FCBGA (19x19) | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | 312 I/O | - | 161000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 5 Core | - | 128kB | - | - | ||
MPFS160T-1FCSG536I Microchip Technology | 2019 | - | - | - | FCSG-536 | - | 536-LFBGA | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | 312 I/O | - | 161000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 5 Core | - | 128kB | - | - | ||
MPFS160TS-FCVG784I Microchip Technology | 2797 | - | - | - | BGA-784 | - | 784-FCBGA (23x23) | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | 312 I/O | - | 161000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 5 Core | - | 128kB | - | - | ||
MPFS250T-FCVG784I Microchip Technology | 2003 | - | - | - | FCVG-784 | - | 784-FCBGA (23x23) | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | 372 I/O | - | 254000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | 5 Core | - | 128kB | - | - |