• 1:$193.168323
• 10:$182.234267
• 100:$171.919120
• 500:$162.187849
View all price

-

-

-

-

536-BGA

-

536-LFBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

-

+ 100 C

Microchip Technology

-

0 C

-

-

SMD/SMT

MCU - 136, FPGA - 276

93000 LE

-

Tray

-

-

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C ~ 100°C

-

PolarFire®

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

857.6kB

RISC-V

-

DMA, PCI, PWM

-

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

MPU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 93K Logic Modules

-

-

-

-

-

-

-

5 Core

-

128kB

-

-

-

-

-

-

-

-

-

-

-

• 1:$313.633366
• 10:$295.880534
• 100:$279.132579
• 500:$263.332622
View all price

-

-

-

-

784-BFBGA, FCBGA

-

784-FCBGA (23x23)

Aluminum

-

-

Bivar

-

-

-

-

-

1

-

-

-

4 x 32 kB

16 kB, 4 x 32 kB

BIVAR

-

667 MHz, 667 MHz

-

-

+ 100 C

Microchip Technology

-

0 C

-

-

SMD/SMT

MCU - 136, FPGA - 312

161000 LE

-

Tray

-

-

-

-

-

-

-

-

-

-

Active

-

-

-

Details

-

-

-

-

-

-

-

-

-

-

630 nm

-40°C ~ 100°C

Tube

Coastline C5500 Linear

-

-

-

-

-

-

-

-

-

-

-

-

LED Lighting

10 W

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Black

-

1 V

-

-

-

-

-

1.4125MB

RISC-V

35 deg

DMA, PCI, PWM

-

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

MPU, FPGA

-

-

-

-

-

-

LED Lighting Fixtures

-

Red

-

390 lm

-

-

-

-

-

-

-

-

FPGA - 161K Logic Modules

-

-

-

-

-

-

-

5 Core

-

128kB

LED Lighting Fixtures

-

-

24 V

LED Lighting Fixtures

-

-

15.2 mm

609.6 mm

21.1 mm

-

-

Obsolete (Last Updated: 2 months ago)

-

-

-

144-LQFP

YES

144-TQFP (20x20)

-

144

-

TE Connectivity

-

-

-

-

-

-

-

MICROSEMI CORP

-

-

-

TE Connectivity

M2S005-1TQ144

-

-

-

-

Microchip Technology

-

-

3

-

-

84

-

85 °C

Tray

PLASTIC/EPOXY

LFQFP

TQFP-144

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

7-1617785-8

Obsolete

-

-

Obsolete

-

30

5.88

N

No

-

-

-

-

1.26 V

1.14 V

1.2 V

-

-

-

0°C ~ 85°C (TJ)

-

SmartFusion®2

-

e0

-

-

-

-

Tin/Lead (Sn/Pb)

-

-

-

-

8542.39.00.01

Relays

-

-

CMOS

-

QUAD

GULL WING

-

240

0.5 mm

not_compliant

-

-

-

-

S-PQFP-G144

84

Not Qualified

-

-

-

-

1.2 V

OTHER

-

-

166MHz

64KB

ARM® Cortex®-M3

-

-

-

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

84

-

1.6 mm

-

FIELD PROGRAMMABLE GATE ARRAY

Industrial Relays

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 5K Logic Modules

-

-

-

-

6060

-

-

-

-

128KB

Military/Aerospace Relays

-

-

-

Industrial Relays

-

-

-

20 mm

20 mm

-

-

-

-

-

Surface Mount

BGA-82

-

-

-

-

IS2083

-

-

96 kB

SRAM

-

-

3000

-

-

I2C, UART, USB

-

-

-

-

-

2 Mbps

-

+ 85 C

Microchip Technology

-

- 40 C

-

Surface Mount

SMD/SMT

19 I/O

-

-

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

-

-

-

-

-

-

-

Class I/Class II

-

Active

-

-

-

-

-

-

VFBGA

-

-

4.2 V

3.2 V

-

-

Industrial grade

-

-40 to 85 °C

Reel

-

-

-

-

-

Bluetooth

-

-

-

-

-

-

-

-

-

-

-

3.2V ~ 4.2V

-

-

-

-

-

-

2.4GHz

-

-

82

-

-

-

-

-

-

3.3 V

-

-

2

16MB Flash, 512kB RAM, 832kB ROM

-

-

-

-

-

Flash

2 MB

-

9.5 dBm

3Mbps

-

8 bit

-

-

-

IS2083BM

-

-

-

-

Bluetooth v5.0

-

Industrial

-

-

-

Bluetooth

Antenna Not Included

- 90 dBm

2 Channel

-

GPIO, I²C, I²S, PWM, UART, USB

-

-

-

-

-

8DPSK, DQPSK, GFSK

-

-

-

-

-

-

-

-

-

-

0.9 mm

5.5 mm

5.5 mm

-

-

-

-

-

-

BGA-784

-

784-BGA

-

-

-

-

-

-

-

-

-

1

-

-

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

-

+ 100 C

Microchip Technology

-

0 C

-

-

SMD/SMT

276 I/O

93000 LE

-

Tray

-

-

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire®

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

857.6kB

RISC-V

-

DMA, PCI, PWM

-

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

MPU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 93K Logic Modules

-

-

-

-

-

-

-

5 Core

-

128kB

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

YES

-

-

256

-

-

80 MHz

-

-

-

-

-

-

MICROSEMI CORP

-

-

-

Microsemi Corporation

A2F060M3E-FG256I

-

-

-

-

-

-

-

3

-

-

-

-

-

-

PLASTIC/EPOXY

LBGA

1 MM PITCH, FBGA-256

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

-

Obsolete

-

-

-

-

20

8.76

-

No

-

-

-

-

1.575 V

1.425 V

1.5 V

-

-

-

-

-

-

-

e0

-

-

-

-

Tin/Lead (Sn/Pb)

-

-

-

-

8542.39.00.01

Field Programmable Gate Arrays

-

-

CMOS

-

BOTTOM

BALL

-

225

1 mm

unknown

-

-

-

-

S-PBGA-B256

66

Not Qualified

-

-

-

-

1.5,1.8,2.5,3.3 V

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

66

1536 CLBS, 60000 GATES

1.7 mm

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1536

1536

-

-

-

60000

-

-

-

-

-

-

-

-

-

17 mm

17 mm

-

• 1:$77.828343
• 10:$73.422965
• 100:$69.266948
• 500:$65.346178
View all price

-

-

-

-

288-TFBGA, CSPBGA

-

288-CSP (11x11)

-

-

A2F200

-

-

-

-

-

200000

-

-

-

-

-

-

-

-

-

-

1.575 V

-

Microchip Technology

1.425 V

-

-

-

-

MCU - 31, FPGA - 78

-

-

Tray

-

-

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

1.5000 V

-

-

-40 to 100 °C

-

SmartFusion®

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

100MHz

64KB

ARM® Cortex®-M3

-

DMA, POR, WDT

-

-

EBI/EMI, Ethernet, I²C, SPI, UART/USART

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1

-

-

-

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

-

-

-

-

-

-

-

-

-

256KB

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

YES

-

-

144

-

-

80 MHz

-

-

-

-

-

-

MICROSEMI CORP

-

-

-

Microsemi Corporation

A2F060M3E-TQG144

-

-

-

-

-

-

-

3

-

-

-

-

85 °C

-

PLASTIC/EPOXY

LFQFP

LFQFP, QFP144,.87SQ,20

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

-

Obsolete

-

-

-

-

30

8.63

-

Yes

-

-

-

-

1.575 V

1.425 V

1.5 V

-

-

-

-

-

-

-

e3

-

-

-

-

PURE MATTE TIN (394)

-

-

-

-

8542.39.00.01

Field Programmable Gate Arrays

-

-

CMOS

-

QUAD

GULL WING

-

250

0.5 mm

compliant

-

-

-

-

S-PQFP-G144

33

Not Qualified

-

-

-

-

1.5,1.8,2.5,3.3 V

OTHER

-

-

-

-

-

-

-

-

-

-

-

-

-

-

33

1536 CLBS, 60000 GATES

1.6 mm

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1536

1536

-

-

-

60000

-

-

-

-

-

-

-

-

-

20 mm

20 mm

-

• 1:$153.457761
• 10:$144.771473
• 100:$136.576861
• 500:$128.846095
View all price

Production (Last Updated: 2 months ago)

-

-

-

325-TFBGA, FCBGA

-

325-FCBGA (11x11)

-

-

M2S060

-

-

64 kB

-

-

-

-

-

-

-

-

-

Miscellaneous

-

166 MHz

-

-

-

Microchip Technology

-

-

-

-

-

200

56520 LE

-

Tray

-

-

-

-

-

-

-

-

-

-

Active

-

-

-

Compliant

-

-

-

-

-

-

-

-

1.2000 V

-

-

0 to 85 °C

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1

-

-

-

-

FPGA - 60K Logic Modules

-

-

-

-

-

-

-

1 Core

-

256KB

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

676-BGA

YES

676-FBGA (27x27)

-

676

M2S090

-

-

64 kB

-

-

-

-

-

MICROSEMI CORP

-

-

-

Johnson Controls

VH7441GT+3008E

166 MHz

-

-

-

Microchip Technology

-

-

3

-

-

425

86316 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-676

BGA676,26X26,40

SQUARE

GRID ARRAY

-

Active

-

-

Active

-

40

5.78

-

Yes

-

-

-

-

1.26 V

1.14 V

1.2 V

1.2000 V

-

-

0 to 85 °C

-

SmartFusion®2

-

e1

-

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

-

8542.39.00.01

Field Programmable Gate Arrays

-

-

CMOS

-

BOTTOM

BALL

-

250

1 mm

compliant

-

-

-

-

S-PBGA-B676

425

Not Qualified

-

-

-

-

1.2 V

OTHER

-

-

166MHz

64KB

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

-

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

425

-

2.44 mm

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

STD

-

-

-

-

FPGA - 90K Logic Modules

-

-

-

-

86316

-

-

1 Core

-

512KB

-

-

-

-

-

-

-

-

27 mm

27 mm

-

-

-

-

-

-

484-BGA

YES

484-FPBGA (23x23)

-

484

A2F200

-

80 MHz

-

-

-

200000

-

-

MICROSEMI CORP

-

-

-

Cutler Hammer, Div of Eaton Co

E57LBL30T110

-

-

1.575 V

-

Microchip Technology

1.425 V

-

3

-

-

MCU - 41, FPGA - 94

-

85 °C

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

-

Active

-

-

Active

10 mm

40

1.36

-

Yes

-

-

-

-

1.575 V

1.425 V

1.5 V

1.5000 V

-

-

0 to 85 °C

-

SmartFusion®

-

e1

-

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

-

8542.39.00.01

Field Programmable Gate Arrays

-

-

CMOS

-

BOTTOM

BALL

Shielded

250

1 mm

compliant

-

-

-

-

S-PBGA-B484

94

Not Qualified

-

-

NC NPN

-

1.5,1.8,2.5,3.3 V

OTHER

-

-

80MHz

64KB

ARM® Cortex®-M3

-

DMA, POR, WDT

-

-

EBI/EMI, Ethernet, I²C, SPI, UART/USART

-

-

MCU, FPGA

-

94

4608 CLBS, 200000 GATES

2.44 mm

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

STD

-

-

-

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

-

-

-

4608

4608

-

-

-

200000

256KB

-

Cable Connection

-

-

-

DC

30 mm

-

23 mm

23 mm

-

• 1:$267.116065
• 10:$251.996288
• 100:$237.732347
• 500:$224.275799
View all price

-

-

-

-

536-LFBGA, CSPBGA

-

536-CSPBGA (16x16)

-

-

M2S150

-

-

64 kB

-

-

-

-

-

-

-

-

-

-

-

166 MHz

-

-

-

PEI-Genesis

-

-

-

-

-

293

146124 LE

-

Bulk

-

-

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

-

*

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

-

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 150K Logic Modules

-

-

-

-

-

-

-

1 Core

-

512KB

-

-

-

-

-

-

-

-

-

-

-

-

Production (Last Updated: 2 months ago)

Lead, Tin

Through Hole

-

896-BGA

YES

896-FBGA (31x31)

-

896

M2S050

-

-

64 kB

-

-

-

-

-

MICROSEMI CORP

-

-

-

Microsemi Corporation

M2S050TS-FGG896I

166 MHz

-

-

-

Microchip Technology

-

-

-

-

SMD/SMT

377

56340 LE

-

Tray

PLASTIC/EPOXY

BGA

FBGA-896

BGA896,30X30,40

SQUARE

GRID ARRAY

-

Active

-

-

Active

-

40

5.82

Compliant

Yes

-

-

-

-

1.26 V

1.14 V

1.2 V

-

-

-

-40°C ~ 100°C (TJ)

Tape & Reel (TR)

SmartFusion®2

1 %

e1

2

50 ppm/°C

-

1.62 MΩ

Tin/Silver/Copper (Sn/Ag/Cu)

175 °C

-65 °C

Metal Film

-

8542.39.00.01

Field Programmable Gate Arrays

250 mW

250 mW

CMOS

-

BOTTOM

BALL

-

250

1 mm

compliant

-

-

MIL-R-10509

-

S-PBGA-B896

377

Not Qualified

-

-

-

-

1.2 V

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

377

-

2.44 mm

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 50K Logic Modules

-

-

-

-

56340

-

-

1 Core

-

256KB

-

-

Flame Retardant Coating, Military, Moisture Resistant

-

-

-

3.68 mm

-

8.7376 mm

3.68 mm

Contains Lead

• 1:$248.838024
• 10:$234.752853
• 100:$221.464956
• 500:$208.929203
View all price

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-

-

-

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

-

536

M2S150

-

-

64 kB

-

-

-

-

-

MICROSEMI CORP

-

-

-

Microsemi Corporation

M2S150T-FCSG536I

166 MHz

-

-

-

PEI-Genesis

-

-

3

-

-

293

146124 LE

-

Bulk

PLASTIC/EPOXY

BGA

FBGA-536

BGA536,30X30,20

SQUARE

GRID ARRAY

-

Active

-

-

Active

-

40

5.77

-

Yes

-

-

-

-

1.26 V

1.14 V

1.2 V

-

-

-

-40°C ~ 100°C (TJ)

-

*

-

e1

-

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

-

8542.39.00.01

Field Programmable Gate Arrays

-

-

CMOS

-

BOTTOM

BALL

-

250

-

compliant

-

-

-

-

S-PBGA-B536

293

Not Qualified

-

-

-

-

1.2 V

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

-

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

293

-

-

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 150K Logic Modules

-

-

-

-

146124

-

-

1 Core

-

512KB

-

-

-

-

-

-

-

-

-

-

-

• 1:$183.861013
• 10:$173.453786
• 100:$163.635647
• 500:$154.373252
View all price

Production (Last Updated: 2 months ago)

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-

-

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

-

325

M2S050

-

-

64 kB

-

-

-

-

-

MICROSEMI CORP

-

-

-

Microsemi Corporation

M2S050T-1FCSG325I

166 MHz

-

-

-

PEI-Genesis

-

-

3

-

SMD/SMT

200

56340 LE

-

Bulk

PLASTIC/EPOXY

TFBGA

FBGA-325

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

-

Active

-

-

Active

-

-

5.76

Compliant

Yes

-

-

-

-

1.26 V

1.14 V

1.2 V

-

-

-

-40°C ~ 100°C (TJ)

-

*

-

e1

-

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

LG-MIN, WD-MIN

8542.39.00.01

Field Programmable Gate Arrays

-

-

CMOS

-

BOTTOM

BALL

-

250

0.5 mm

compliant

-

40

-

-

S-PBGA-B325

200

Not Qualified

-

-

-

-

1.2 V

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

200

-

1.01 mm

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 50K Logic Modules

-

-

-

-

56340

-

-

1 Core

-

256KB

-

-

-

-

-

-

-

-

11 mm

11 mm

-

-

-

-

-

-

TQFP-100

-

-

-

-

-

-

-

-

-

EV06X38A

-

90

-

-

CAN, Ethernet, USB

-

-

-

-

120 MHz

-

-

+ 85 C

Microchip Technology

-

- 40 C

-

-

SMD/SMT

81 I/O

-

-

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

-

-

-

-

-

-

-

-

PIC32CX

Active

-

-

-

Details

-

-

-

-

-

3.63 V

1.71 V

-

-

-

-

-

Reel

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.71 V to 3.63 V

-

-

-

-

-

-

-

-

-

Flash

1 MB

-

-

-

-

-

-

-

-

-

-

-

- 40 C to + 85 C

-

-

-

-

-

-

-

-

-

-

32 Channel

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

TQFP-128

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-

-

-

-

-

-

-

-

EV06X38A

-

1000

-

-

CAN, Ethernet, USB

-

-

-

-

120 MHz

-

-

+ 125 C

Microchip Technology

-

- 40 C

-

-

SMD/SMT

99 I/O

-

-

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

-

-

-

-

-

-

-

-

PIC32CX

Active

-

-

-

Details

-

-

-

-

-

3.63 V

1.71 V

-

-

-

-

-

Reel

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.71 V to 3.63 V

-

-

-

-

-

-

-

-

-

Flash

1 MB

-

-

-

-

-

-

-

-

-

-

-

- 40 C to + 125 C

-

-

-

-

-

-

-

-

-

-

32 Channel

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Surface Mount

LGA-39

-

-

-

-

-

-

-

128 kB

SRAM

-

-

1

-

-

GPIO, I2C, QSPI, SPI, UART

-

-

-

-

64 MHz

2 Mb/s

-

+ 85 C

Microchip Technology

-

- 40 C

-

-

SMD/SMT

29 I/O

-

-

Tray

-

-

-

-

-

-

-

-

-

-

Active

-

-

-

Details

-

-

-

40.6 mA

96.7 mA

3.6 V

1.9 V

-

-

-

-

-40°C ~ 85°C

Tray

-

-

-

-

-

Bluetooth, Zigbee

-

-

-

-

-

-

-

-

-

-

-

1.9V ~ 3.6V

-

-

-

-

-

-

2.4GHz

-

-

-

-

-

-

2.4 GHz

-

-

1.9 V to 3.6 V

-

-

-

1MB Flash

-

-

-

-

-

Flash

1 MB

-

12 dBm

2Mbps

-

32 bit

-

-

-

-

-

-

- 40 C to + 85 C

-

Bluetooth v5.2, Zigbee®

-

-

12dBm

-

-

802.15.4, Bluetooth

Antenna Not Included, U.FL

-103dBm

8 Channel

-

GPIO, HCI, I²C, IrDA, JTAG, PWM, SPI, UART, USART

-

-

-

-

4 Timer

O-QPSK

-

-

-

-

-

-

-

-

-

-

-

-

-

-

• 1:$362.877394
• 10:$342.337164
• 100:$322.959589
• 500:$304.678857
View all price

-

-

-

-

FCSG-536

-

536-LFBGA

-

-

-

TE Connectivity

-

-

-

-

-

1

-

-

-

4 x 32 kB

16 kB, 4 x 32 kB

TE Connectivity

-

667 MHz, 667 MHz

-

-

+ 100 C

Microchip Technology

-

0 C

-

-

SMD/SMT

372 I/O

254000 LE

-

Tray

-

-

-

-

-

-

FCB-405-0628M

-

-

-

Active

-

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-

-

0°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

Relays

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

2.2MB

RISC-V

-

DMA, PCI, PWM

-

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

MPU, FPGA

-

-

-

-

-

-

General Purpose Relays

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 254K Logic Modules

-

-

-

-

-

-

-

5 Core

-

128kB

-

-

-

-

General Purpose Relays

-

-

-

-

-

-