- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Data RAM Size | Device Logic Gates | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Number of Outputs | Qualification Status | Power Supplies | Temperature Grade | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Core Architecture | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S090T-FG484I Microchip Technology | 2794 |
| - | - | FPBGA-484 | YES | - | 484-FPBGA (23x23) | 484 | M2S090 | 64 kB | - | 60 | MICROSEMI CORP | - | - | M2S090T-FG484I | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | 267 | 7193 LAB | 86316 LE | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.83 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||
M2S150-FC1152 Microchip Technology | In Stock | - | - | - | 1152-BBGA, FCBGA | YES | - | 1152-FCBGA (35x35) | 1152 | M2S150 | 64 kB | - | 24 | MICROSEMI CORP | - | - | M2S150-FC1152 | 166 MHz | - | Microchip Technology | - | Yes | - | - | 574 | 12177 LAB | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | - | STD | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | ||
M2S050TS-1VFG400 Microchip Technology | 2089 |
| - | Production (Last Updated: 2 months ago) | VFPBGA-400 | - | - | 400-VFBGA (17x17) | - | M2S050 | 64 kB | - | 90 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 207 | 4695 LAB | 56340 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | FPGA - 50K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S060-1FGG484I Microchip Technology | 2834 |
| - | Production (Last Updated: 2 months ago) | 484-BGA | - | - | 484-FPBGA (23x23) | - | M2S060 | 64 kB | - | 60 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | 267 | 4710 LAB | 56520 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S060T-1VFG400 Microchip Technology | 2822 |
| - | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | - | 400-VFBGA (17x17) | 400 | M2S060 | 64 kB | - | 90 | MICROSEMI CORP | - | - | M2S060T-1VFG400 | 166 MHz | - | Microchip Technology | - | Yes | 3 | - | 207 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | - | 5.8 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | 40 | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | ||
M2S090-FCSG325 Microchip Technology | 2270 |
| - | - | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x13.5) | 325 | M2S090 | 64 kB | - | 176 | MICROSEMI CORP | - | - | M2S090-FCSG325 | 166 MHz | - | Microchip Technology | - | Yes | 3 | - | 180 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | FPGA - Field Programmable Gate Array SmartFusion2 | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | - | - | R-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | ||
M2S005S-FGG484 Microchip Technology | 23 |
| - | - | 484-BGA | - | - | 484-FPBGA (23x23) | - | M2S005 | 64 kB | - | 60 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | 209 | 505 LAB | 6060 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | FPGA - 5K Logic Modules | - | 1 Core | 128KB | - | - | ||
M2S025T-1VF256I Microchip Technology | 2753 |
| - | Production (Last Updated: 2 months ago) | 256-LFBGA | - | - | 256-FPBGA (14x14) | - | M2S025 | 64 kB | - | 119 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 138 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S060TS-1FCS325 Microchip Technology | 2635 |
| - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x11) | 325 | M2S060 | 64 kB | - | 176 | MICROSEMI CORP | - | - | M2S060TS-1FCS325 | 166 MHz | - | Microchip Technology | - | Yes | - | - | 200 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.88 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | - | - | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | ||
M2S090-1FGG676I Microchip Technology | 2407 |
| - | - | BGA-676 | - | - | 676-FBGA (27x27) | - | M2S090 | 64 kB | - | 40 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 425 | 7193 LAB | 86316 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | FPGA - 90K Logic Modules | - | 1 Core | 512KB | - | - | ||
M2S005-FG484I Microchip Technology | 7 |
| - | - | FPBGA-484 | - | - | 484-FPBGA (23x23) | - | M2S005 | 64 kB | - | 60 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 209 | 505 LAB | 6060 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | FPGA - 5K Logic Modules | - | 1 Core | 128KB | - | - | ||
M2S050-1FGG896I Microchip Technology | 2763 |
| - | - | FPBGA-896 | YES | - | 896-FBGA (31x31) | 896 | M2S050 | 64 kB | - | 27 | MICROSEMI CORP | - | - | M2S050-1FGG896I | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 377 | 4695 LAB | 56340 LE | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.76 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 31 mm | 31 mm | ||
M2S090-FGG676I Microchip Technology | 2352 |
| - | - | BGA-676 | YES | - | 676-FBGA (27x27) | 676 | M2S090 | 64 kB | - | 40 | MICROSEMI CORP | - | - | M2S090-FGG676I | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | 425 | 7193 LAB | 86316 LE | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.78 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | ||
A2F500M3G-1FGG256M Microchip Technology | 838 |
| - | - | 256-LBGA | - | 256 | 256-FPBGA (17x17) | - | A2F500 | 64 kB | 500000 | 90 | MICROSEMI CORP | - | - | A2F500M3G-1FGG256M | 100 MHz | 1.575 V | Microchip Technology | 1.425 V | Yes | 3 | - | MCU - 25, FPGA - 66 | - | 6000 LE | - | Tray | - | - | - | - | - | - | Active | Active | - | 5.79 | Details | Yes | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | - | - | 125 °C | -55 °C | - | 8542.39.00.01 | - | - | - | - | - | compliant | 100 MHz | - | - | - | - | - | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | ARM | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | 1 Core | 512KB | - | - | ||
M2S010T-1VF400 Microchip Technology | 7 |
| - | - | VFPBGA-400 | YES | - | 400-VFBGA (17x17) | 400 | M2S010 | 64 kB | - | 90 | MICROSEMI CORP | - | - | M2S010T-1VF400 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | - | SMD/SMT | 195 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | S-PBGA-B400 | 160 | Not Qualified | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 17 mm | 17 mm | ||
M2S025TS-1FG484I Microchip Technology | 2185 |
| - | - | FPBGA-484 | - | - | 484-FPBGA (23x23) | - | M2S025 | 64 kB | - | 60 | - | - | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | - | SMD/SMT | 267 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | 1 | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S005S-1VF256 Microchip Technology | 7 |
| - | - | VFPBGA-256 | - | - | 256-FPBGA (14x14) | - | M2S005 | 64 kB | - | 119 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 161 | 505 LAB | 6060 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | FPGA - 5K Logic Modules | - | 1 Core | 128KB | - | - | ||
M2S010T-FG484 Microchip Technology | 23 |
| - | - | FPBGA-484 | YES | - | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | - | 60 | MICROSEMI CORP | - | - | M2S010T-FG484 | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | 233 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | STD | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 23 mm | 23 mm | ||
M2S025-1FGG484I Microchip Technology | 2098 |
| - | - | FPBGA-484 | - | - | 484-FPBGA (23x23) | - | M2S025 | 64 kB | - | 60 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 267 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | 1 | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S025TS-1VF256 Microchip Technology | 2602 |
| - | Production (Last Updated: 2 months ago) | VFPBGA-256 | - | - | 256-FPBGA (14x14) | - | M2S025 | 64 kB | - | 119 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 138 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - |