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Factory Pack QuantityFactory Pack Quantity

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Manufacturer Part Number

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Total RAM Bits

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Speed Grade

Number of Poles per Deck

Angle of Throw

Primary Attributes

Number of Logic Cells

Number of Cores

Flash Size

Constant Current Load - Max

Features

Product Category

Length

Width

Actuator Length

MPFS095T-FCVG784E
MPFS095T-FCVG784E

Microchip Technology

2313

-

-

-

-

FCVG-784

-

784-BGA

-

-

-

-

-

-

1

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

-

SMD/SMT

-

276 I/O

-

93000 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

0°C ~ 100°C

Tray

PolarFire®

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

-

MPU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 93K Logic Modules

-

5 Core

128kB

-

-

-

-

-

-

MPFS160TLS-FCVG784I
MPFS160TLS-FCVG784I

Microchip Technology

2822

-

-

-

-

BGA-784

-

784-FCBGA (23x23)

-

-

-

-

-

-

1

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

-

SMD/SMT

-

312 I/O

-

161000 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

-

MPU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 161K Logic Modules

-

5 Core

128kB

-

-

-

-

-

-

MPFS160TS-1FCSG536I
MPFS160TS-1FCSG536I

Microchip Technology

2447

-

-

-

-

BGA-536

-

536-LFBGA

-

-

-

-

-

-

1

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

-

SMD/SMT

-

312 I/O

-

161000 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

-

MPU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 161K Logic Modules

-

5 Core

128kB

-

-

-

-

-

-

MPFS095TS-1FCVG484I
MPFS095TS-1FCVG484I

Microchip Technology

2267

-

-

-

-

BGA-484

-

484-FCBGA (19x19)

-

-

-

-

-

-

1

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

- 40 C

-

-

SMD/SMT

-

276 I/O

-

93000 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire®

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

-

MPU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 93K Logic Modules

-

5 Core

128kB

-

-

-

-

-

-

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Phoenix Contact

1935297

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2372

-

-

Production (Last Updated: 2 months ago)

-

484-BGA

-

484-FPBGA (23x23)

-

M2S025

-

-

64 kB

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

-

-

SMD/SMT

-

267

-

27696 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Compliant

-

-

-

-

-

-

-

-

-

-55°C ~ 125°C (TJ)

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 25K Logic Modules

-

1 Core

256KB

-

-

-

-

-

-

2190
  • 1:$259.883425
  • 10:$245.173042
  • 100:$231.295323
  • 500:$218.203135
  • View all price
-

-

-

896-BGA

-

896-FBGA (31x31)

-

M2S050

-

-

64 kB

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

-

-

SMD/SMT

-

377

-

56340 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

1.2000 V

-

-

0 to 85 °C

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

1

-

-

FPGA - 50K Logic Modules

-

1 Core

256KB

-

-

-

-

-

-

2901
  • 1:$365.879535
  • 10:$345.169373
  • 100:$325.631484
  • 500:$307.199513
  • View all price
-

-

-

BGA-484

YES

484-FPBGA (23x23)

484

M2S060

Microchip Technology / Atmel

-

64 kB

1314 kbit

60

MICROSEMI CORP

-

-

Microchip

M2S060TS-1FG484M

166 MHz

-

+ 125 C

Microchip Technology

-

- 55 C

Yes

3

SMD/SMT

-

267 I/O

4710 LAB

56520 LE

125 °C

-55 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-484

-

SQUARE

GRID ARRAY

Active

Active

30

5.84

-

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

SmartFusion2

-

0.326090 oz

-

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e0

Yes

-

3A001.A.2.C

-

-

Tin/Lead (Sn/Pb)

8542.39.00.01

SOC - Systems on a Chip

-

-

BOTTOM

BALL

240

1 mm

not_compliant

-

-

-

S-PBGA-B484

-

-

-

-

1.2 V

-

-

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

SoC FPGA

-

-

-

-

-

-

-

-

FPGA - 60K Logic Modules

-

1 Core

256KB

-

-

SoC FPGA

23 mm

23 mm

-

M2S050-FG484
M2S050-FG484

Microchip

2300

-

-

-

-

484-BGA

-

484-FPBGA (23x23)

-

M2S050

-

-

64 kB

-

-

-

-

-

-

-

166 MHz

1.26 V

-

Microchip Technology

1.14 V

-

-

-

SMD/SMT

-

267

-

56340 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

1.2000 V

-

-

0 to 85 °C

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

STD

-

-

FPGA - 50K Logic Modules

-

1 Core

256KB

-

-

-

-

-

-

39

-

-

-

-

400-LFBGA

-

400-VFBGA (17x17)

-

M2S005

-

-

64 kB

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

-

-

-

-

169

-

6060 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 5K Logic Modules

-

1 Core

128KB

-

-

-

-

-

-

9
-

-

-

TQFP-144

-

144-TQFP (20x20)

-

M2S005

Microchip Technology / Atmel

-

64 kB

-

60

-

-

-

Microchip

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

SMD/SMT

-

84

505 LAB

6060 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

0.046530 oz

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

SOC - Systems on a Chip

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

-

-

-

SoC FPGA

-

-

-

-

-

-

-

-

FPGA - 5K Logic Modules

-

1 Core

128KB

-

-

SoC FPGA

-

-

-

M2S010-TQG144
M2S010-TQG144

Microchip

500

-

-

-

-

144-LQFP

-

144-TQFP (20x20)

-

M2S010

Microchip Technology / Atmel

-

64 kB

400 kbit

60

-

-

-

Microchip

-

166 MHz

-

+ 85 C

Microchip Technology

-

0 C

Yes

-

SMD/SMT

-

84

1007 LAB

12084 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Details

-

-

-

-

-

-

-

0.035380 oz

-

0°C ~ 85°C (TJ)

Tray

SmartFusion®2

-

-

-

-

-

-

-

-

SOC - Systems on a Chip

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.2 V

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

-

-

-

SoC FPGA

-

-

-

-

-

-

-

-

FPGA - 10K Logic Modules

-

1 Core

256KB

-

-

SoC FPGA

-

-

-

23
-

-

-

144-LQFP

-

144-TQFP (20x20)

-

M2S005

Microchip Technology / Atmel

-

64 kB

-

60

-

-

-

Microchip

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

-

84

505 LAB

6060 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

-

1.2000 V

-

-

0 to 85 °C

Tray

SmartFusion2

-

-

-

-

-

-

-

-

SOC - Systems on a Chip

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

-

-

-

SoC FPGA

-

-

-

-

-

STD

-

-

FPGA - 5K Logic Modules

-

1 Core

128KB

-

-

SoC FPGA

-

-

-

In Stock

-

-

-

Panel Mount

484-BFBGA, FCBGA

-

484-FCBGA (19x19)

-

-

-

Silver Alloy

-

-

-

-

-

-

-

-

-

-

-

Microchip Technology

-

-

-

-

-

-

MCU - 136, FPGA - 372

-

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

28V

0°C ~ 100°C

-

44

-

-

Active

-

-

10

-

-

-

-

-

-

-

-

-

-

1A (AC/DC)

--

Solder Lug

-

-

-

Flatted (6.35mm Dia)

-

-

--

-

-

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

1

MPU, FPGA

-

5.761 ~ 83gfm

-

-

-

-

Shorting (MBB)

-

Fixed

SP10T

26.04mm

-

1

30°

FPGA - 254K Logic Modules

-

-

128kB

-

Shaft and Panel Sealed

-

-

-

11.10mm

2681
  • 1:$403.764071
  • 10:$380.909501
  • 100:$359.348586
  • 500:$339.008100
  • View all price
-

-

-

676-BGA

YES

676-FBGA (27x27)

676

M2S090

-

-

64 kB

-

-

MICROSEMI CORP

-

-

Microsemi Corporation

M2S090T-FG676I

166 MHz

-

-

Microchip Technology

-

-

-

3

SMD/SMT

-

425

-

86316 LE

-

-

Tray

PLASTIC/EPOXY

BGA

BGA, BGA676,26X26,40

BGA676,26X26,40

SQUARE

GRID ARRAY

Active

Active

30

5.83

-

No

-

1.26 V

1.14 V

1.2 V

-

-

-

-

-40°C ~ 100°C (TJ)

-

1500

e0

-

Active

-

Panel Mount

-

Tin/Lead (Sn/Pb)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

120VAC

BOTTOM

BALL

240

1 mm

not_compliant

-

-

-

S-PBGA-B676

425

Not Qualified

-

Terminals

-

-

1.2 V

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Terminals

120VAC, 140VAC

-

MCU, FPGA

425

-

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

8.810 L x 7.250 W x 13.000 H (223.77mm x 184.15mm x 330.20mm)

-

-

-

-

-

-

-

-

-

FPGA - 90K Logic Modules

86316

1 Core

512KB

15A (2.1kVA)

-

-

27 mm

27 mm

-

In Stock

-

-

-

-

144-LQFP

YES

144-TQFP (20x20)

144

-

-

-

-

-

-

MICROSEMI CORP

-

-

Microsemi Corporation

M2S005S-1TQ144

-

-

-

Microchip Technology

-

-

-

3

-

-

84

-

-

85 °C

-

Tray

PLASTIC/EPOXY

LFQFP

TQFP-144

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

Obsolete

30

5.88

-

No

-

1.26 V

1.14 V

1.2 V

-

-

-

-

0°C ~ 85°C (TJ)

-

SmartFusion®2

e0

-

-

-

-

-

Tin/Lead (Sn/Pb)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

-

QUAD

GULL WING

240

0.5 mm

not_compliant

-

-

-

S-PQFP-G144

84

Not Qualified

-

-

-

-

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

-

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

84

-

1.6 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

FPGA - 5K Logic Modules

6060

-

128KB

-

-

-

20 mm

20 mm

-

2424
  • 1:$357.099577
  • 10:$336.886393
  • 100:$317.817352
  • 500:$299.827691
  • View all price
-

-

-

FCG-1152

-

1152-FCBGA (35x35)

-

-

Microchip Technology / Atmel

-

-

-

1

-

4 x 32 kB

16 kB, 4 x 32 kB

Microchip

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

Yes

-

SMD/SMT

-

372 I/O

-

254000 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

0°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

SOC - Systems on a Chip

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

-

MPU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 254K Logic Modules

-

5 Core

128kB

-

-

SoC FPGA

-

-

-

In Stock

-

-

-

-

1152-BBGA, FCBGA

-

1152-FCBGA (35x35)

-

-

Microchip Technology

-

-

-

1

-

-

-

Microchip

-

-

-

-

Microchip Technology

-

-

-

-

-

-

MCU - 136, FPGA - 468

-

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

Tray

PolarFire™

-

-

-

-

-

-

-

-

SOC - Systems on a Chip

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

3.95MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

-

MPU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 461K Logic Modules

-

-

128kB

-

-

SoC FPGA

-

-

-

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

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-

-

-

-

-

-

-

-

-

-

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-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

27

-

-

-

-

325-TFBGA

-

325-BGA (11x11)

-

-

Amphenol Commercial Products

-

-

-

15

-

4 x 32 kB

16 kB, 4 x 32 kB

Amphenol

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

-

SMD/SMT

MSL 3 - 168 hours

MCU - 136, FPGA - 108

-

23000 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

0°C ~ 100°C

Tray

-

-

-

-

-

-

-

-

-

I/O Connectors

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

-

MPU, FPGA

-

-

-

-

-

I/O Connectors

-

1843.2Kbit

-

-

-

-

-

-

FPGA - 23K Logic Modules

-

5 Core

128KB

-

-

I/O Connectors

-

-

-