- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Core Architecture | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPFS160T-FCSG536E Microchip Technology | 2170 | - | - | FCSG-536 | - | - | 536-LFBGA | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | - | SMD/SMT | 312 I/O | 161000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | 0°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 5 Core | - | 128kB | - | - | - | ||
M2S025T-FCSG158I Microchip Technology | 458 | - | - | TFBGA-158 | - | - | 158-FCBGA | - | - | - | 64 kB | 260 | - | - | - | - | - | 166 MHz | + 100 C | Microchip Technology | - 40 C | - | SMD/SMT | - | 27696 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.14 V to 1.26 V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | - | 1 Core | - | 256KB | - | - | - | ||
A2F060M3E-1TQG144I Microchip | In Stock | - | - | - | YES | - | - | 144 | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | A2F060M3E-1TQG144I | - | - | - | - | - | - | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | LFQFP | LFQFP, | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | - | - | 5.82 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | 8542.39.00.01 | - | CMOS | QUAD | GULL WING | - | 0.5 mm | compliant | - | S-PQFP-G144 | - | - | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | 1536 CLBS, 60000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 1536 | - | - | 60000 | - | - | 20 mm | 20 mm | ||
MPFS250T-FCVG484I Microchip Technology | 2680 | - | - | FCVG-484 | - | - | 484-FCBGA (19x19) | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | - | SMD/SMT | 372 I/O | 254000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | 5 Core | - | 128kB | - | - | - | ||
MPFS095T-1FCSG325I Microchip Technology | 2994 | - | - | BGA-325 | - | - | 325-LFBGA (11x14.5) | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | - | SMD/SMT | 276 I/O | 93000 LE | - | - | Bulk | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | -40°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | 5 Core | - | 128KB | - | - | - | ||
MPFS095TL-FCSG325I Microchip Technology | 2032 | - | - | BGA-325 | - | - | 325-LFBGA (11x14.5) | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | - | SMD/SMT | 276 I/O | 93000 LE | - | - | Bulk | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | -40°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | 5 Core | - | 128KB | - | - | - | ||
MPFS160TLS-FCVG484I Microchip Technology | 2915 | - | - | BGA-484 | - | - | 484-FCBGA (19x19) | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | - | SMD/SMT | 312 I/O | 161000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 5 Core | - | 128kB | - | - | - | ||
MPFS250TL-FCG1152E Microchip Technology | 2691 | - | - | BGA-1152 | - | - | 1152-FCBGA (35x35) | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | - | SMD/SMT | 372 I/O | 254000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | 0°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | 5 Core | - | 128kB | - | - | - | ||
MPFS250TS-FCG1152I Microchip Technology | 2686 | - | - | BGA-1152 | - | - | 1152-FCBGA (35x35) | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | - | SMD/SMT | 372 I/O | 254000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | 5 Core | - | 128kB | - | - | - | ||
MPFS250TS-1FCG1152I Microchip Technology | 587 | - | - | BGA-1152 | - | - | 1152-FCBGA (35x35) | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | - | SMD/SMT | 372 I/O | 254000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | 5 Core | - | 128kB | - | - | - | ||
MPFS160T-1FCSG536E Microchip Technology | 2627 | - | - | FCSG-536 | - | - | 536-LFBGA | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | - | SMD/SMT | 312 I/O | 161000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | 0°C ~ 100°C | Tray | PolarFire® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 5 Core | - | 128kB | - | - | - | ||
MPFS250TLS-FCG1152I Microchip Technology | 859 | - | - | BGA-1152 | - | - | 1152-FCBGA (35x35) | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | - | SMD/SMT | 372 I/O | 254000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | 5 Core | - | 128kB | - | - | - | ||
MPFS250T-1FCG1152I Microchip Technology | 2168 | - | - | BGA-1152 | - | - | 1152-FCBGA (35x35) | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | - | SMD/SMT | 372 I/O | 254000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | 5 Core | - | 128kB | - | - | - | ||
MPFS250T-1FCG1152E Microchip | 2442 |
| - | BGA-1152 | - | - | 1152-FCBGA (35x35) | - | - | Microchip Technology / Atmel | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | Microchip | - | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | Yes | SMD/SMT | 372 I/O | 254000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | 0°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | SOC - Systems on a Chip | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | 5 Core | - | 128kB | SoC FPGA | - | - | ||
MPFS460T-FCG1152E Microchip | In Stock | - | - | - | - | - | - | - | - | Microchip Technology / Atmel | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | Microchip | - | 667 MHz, 667 MHz | + 100 C | - | 0 C | - | SMD/SMT | 468 I/O | 461000 LE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | Tray | - | - | - | - | - | - | SOC - Systems on a Chip | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5 Core | - | - | SoC FPGA | - | - | ||
MPFS250TS-FCS536M Microchip | In Stock | - | - | 536-LFBGA, CSPBGA | - | - | 536-LFBGA | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | MCU - 136, FPGA - 372 | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | - | - | 128kB | - | - | - | ||
M2S025-1VF400I Microchip | 2980 |
| - | 400-LFBGA | YES | - | 400-VFBGA (17x17) | 400 | M2S025 | - | 64 kB | - | MICROSEMI CORP | - | - | Microsemi Corporation | M2S025-1VF400I | 166 MHz | - | Microchip Technology | - | - | SMD/SMT | 207 | 27696 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.3 | - | No | - | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | S-PBGA-B400 | 160 | Not Qualified | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 25K Logic Modules | - | 23988 | 1 Core | - | 256KB | - | 17 mm | 17 mm | ||
MPFS160T-1FCVG784T2 Microchip | In Stock | - | - | 784-BFBGA, FCBGA | - | - | 784-FCBGA (23x23) | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | MCU - 136, FPGA - 312 | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | - | - | 128KB | - | - | - | ||
A2F500M3G-1FG256M Microchip | In Stock | - | - | 256-LBGA | - | 256 | 256-FPBGA (17x17) | - | A2F500 | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | A2F500M3G-1FG256M | - | - | Microchip Technology | - | - | - | MCU - 25, FPGA - 66 | - | - | - | Tray | - | - | - | - | - | - | Active | Active | - | 2.54 | Non-Compliant | No | - | - | - | - | -55°C ~ 125°C (TJ) | - | SmartFusion® | - | - | 125 °C | -55 °C | 8542.39.00.01 | - | - | - | - | - | - | unknown | 100 MHz | - | - | - | - | - | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | ARM | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | - | - | 512KB | - | - | - | ||
M2S060TS-VFG784I Microchip | 2832 |
| - | 784-FBGA | - | - | 784-VFBGA (23x23) | - | - | - | - | - | - | - | - | - | - | - | + 100 C | Microchip Technology | - 40 C | - | SMD/SMT | - | 56500 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | - | - | - | - | - | - |