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Microchip Embedded - System On Chip (SoC)

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Ihs Manufacturer

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L1 Cache Instruction Memory

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Features

Product Length

Product Width

Length

Width

Contact Finish Thickness - Mating

Material Flammability Rating

M2S090S-1FG676I
M2S090S-1FG676I

Microchip

In Stock

-

-

-

-

-

-

YES

-

-

-

-

676

-

-

-

-

-

-

-

MICROSEMI CORP

-

-

-

-

Microsemi Corporation

M2S090S-1FG676I

-

-

-

-

-

-

-

-

-

-

-

-

-

-

PLASTIC/EPOXY

BGA

BGA,

-

SQUARE

GRID ARRAY

Active

BGA

-

-

NOT SPECIFIED

5.83

-

No

-

-

1.26 V

1.14 V

1.2 V

-

-

-

-

-

No

-

-

-

-

-

-

-

-

-

8542.39.00.01

-

-

-

-

-

BOTTOM

-

BALL

-

NOT SPECIFIED

-

1 mm

compliant

-

-

676

-

S-PBGA-B676

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

-

27 mm

27 mm

-

-

M2S100T-FCG1152
M2S100T-FCG1152

Microchip

In Stock

-

-

-

-

-

-

YES

-

-

-

-

1152

-

-

-

-

-

-

-

MICROSEMI CORP

-

-

-

-

Microsemi Corporation

M2S100T-FCG1152

-

-

-

-

-

-

4

-

-

-

-

85 °C

-

-

PLASTIC/EPOXY

BGA

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

BGA1152,34X34,40

SQUARE

GRID ARRAY

Active

-

-

-

NOT SPECIFIED

5.8

-

Yes

-

-

1.26 V

1.14 V

1.2 V

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

8542.39.00.01

-

-

Field Programmable Gate Arrays

-

CMOS

BOTTOM

-

BALL

-

NOT SPECIFIED

-

1 mm

compliant

-

-

-

-

S-PBGA-B1152

574

Not Qualified

-

-

1.2 V

-

OTHER

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

574

2.9 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

99512

-

-

-

-

-

-

-

35 mm

35 mm

-

-

M2S010-TQ144I
M2S010-TQ144I

Microchip

2689

-

-

-

-

-

144-LQFP

YES

-

-

144-TQFP (20x20)

-

144

-

-

-

-

-

-

-

MICROSEMI CORP

-

-

-

-

Microsemi Corporation

M2S010-TQ144I

-

-

-

Microchip Technology

-

-

3

Surface Mount

-

84

-

-

38.4 MHz

Tray

PLASTIC/EPOXY

LFQFP

TQFP-144

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

-

-

Obsolete

30

5.85

-

No

-

SMD

1.26 V

1.14 V

1.2 V

-

-

-40 to 85 °C

SmartFusion®2

e0

-

-

-

-

-

Temperature Compensated Crystal Oscillator (TCXO)

-

Tin/Lead (Sn/Pb)

-

-

8542.39.00.01

-

-

Field Programmable Gate Arrays

-

CMOS

QUAD

-

GULL WING

-

240

-

0.5 mm

not_compliant

-

-

4

-

S-PQFP-G144

84

Not Qualified

-

-

1.2 V

-

-

-

-

10 pF

166MHz

64KB

-

ARM® Cortex®-M3

-

-

-

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

84

1.6 mm

FIELD PROGRAMMABLE GATE ARRAY

-

FPGA - 10K Logic Modules

-

12084

-

Clipped Sinewave

256KB

-

-

-

-

20 mm

20 mm

-

-

M2S010T-1FG484
M2S010T-1FG484

Microchip

5000
-

-

-

-

484-BGA

YES

-

-

484-FPBGA (23x23)

-

484

-

M2S010

-

-

-

-

64 kB

MICROSEMI CORP

-

-

-

-

Microsemi Corporation

M2S010T-1FG484

166 MHz

1.26 V

-

Microchip Technology

1.14 V

-

3

-

SMD/SMT

233

12084 LE

85 °C

-

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

-

-

Active

30

5.3

-

No

-

-

1.26 V

1.14 V

1.2 V

1.2000 V

-

0 to 85 °C

SmartFusion®2

e0

-

-

-

-

-

-

-

Tin/Lead (Sn/Pb)

-

-

8542.39.00.01

-

-

Field Programmable Gate Arrays

-

CMOS

BOTTOM

-

BALL

-

240

-

1 mm

not_compliant

-

-

-

-

S-PBGA-B484

233

Not Qualified

-

-

1.2 V

-

OTHER

-

-

-

166MHz

64KB

-

ARM® Cortex®-M3

-

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

233

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

1

FPGA - 10K Logic Modules

-

9744

1 Core

-

256KB

-

-

-

-

23 mm

23 mm

-

-

M2S010T-1VF400I
M2S010T-1VF400I

Microchip

8
-

-

-

-

400-LFBGA

YES

-

-

400-VFBGA (17x17)

-

400

-

M2S010

-

-

-

-

64 kB

MICROSEMI CORP

-

-

-

-

Microsemi Corporation

M2S010T-1VF400I

166 MHz

1.26 V

-

Microchip Technology

1.14 V

-

-

-

SMD/SMT

195

12084 LE

-

-

Tray

PLASTIC/EPOXY

LFBGA

LFBGA, BGA400,20X20,32

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

-

-

Active

30

5.3

-

No

-

-

1.26 V

1.14 V

1.2 V

1.2000 V

-

-40 to 100 °C

SmartFusion®2

e0

-

-

-

-

-

-

-

Tin/Lead (Sn/Pb)

-

-

8542.39.00.01

-

-

Field Programmable Gate Arrays

-

CMOS

BOTTOM

-

BALL

-

240

-

0.8 mm

not_compliant

-

-

-

-

S-PBGA-B400

160

Not Qualified

-

-

1.2 V

-

-

-

-

-

166MHz

64KB

-

ARM® Cortex®-M3

-

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

160

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

1

FPGA - 10K Logic Modules

-

9744

1 Core

-

256KB

-

-

-

-

17 mm

17 mm

-

-

M2S150-1FCG1152I
M2S150-1FCG1152I

Microchip

2446
  • 1:$502.717225
  • 10:$474.261533
  • 100:$447.416541
  • 500:$422.091076
    • View all price
-

-

-

-

1152-BBGA, FCBGA

-

-

-

1152-FCBGA (35x35)

-

-

-

M2S150

-

-

-

-

64 kB

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

-

-

SMD/SMT

574

146124 LE

-

-

Tray

-

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

1.2000 V

-

-40 to 100 °C

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

ARM® Cortex®-M3

-

-

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

-

-

1

FPGA - 150K Logic Modules

-

-

1 Core

-

512KB

-

-

-

-

-

-

-

-

M2S010TS-1VFG400T2
M2S010TS-1VFG400T2

Microchip

2411
  • 1:$115.901936
  • 10:$109.341449
  • 100:$103.152310
  • 500:$97.313500
    • View all price
-

-

-

-

400-LFBGA

-

-

-

400-VFBGA (17x17)

-

-

-

M2S010

-

-

-

-

-

MICROSEMI CORP

-

-

-

-

Microsemi Corporation

M2S010TS-1VFG400T2

-

-

-

Microchip Technology

-

-

-

-

-

195

-

-

-

Tray

-

-

,

-

-

-

Active

-

-

Active

40

5.8

-

Yes

-

-

-

-

-

1.2000 V

-

0 to 85 °C

Automotive, AEC-Q100, SmartFusion®2

e1

Yes

-

-

-

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

-

-

-

-

-

-

-

-

-

250

-

-

compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

ARM® Cortex®-M3

-

-

DDR, PCIe, SERDES

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

-

FIELD PROGRAMMABLE GATE ARRAY

1

FPGA - 10K Logic Modules

-

-

-

-

256KB

-

-

-

-

-

-

-

-

A2F500M3G-1FG256IX94
A2F500M3G-1FG256IX94

Microchip

In Stock

-

-

-

50 microinches Gold Plate

Wall - Front Mount - Thru Holes

-

-

-

Stainless Steel

-

Hard Dielectric

-

-

-

-

-

Copper Alloy

53#20

-

-

H53

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

I

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Yes

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Socket

-

-

Meets IP67

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Electroless Nickel

-

-

-

-

-

-

-

-

-

-

-

-

MPFS250T-FCVG484T2
MPFS250T-FCVG484T2

Microchip

In Stock

-

-

-

-

-

484-BFBGA, FCBGA

-

-

-

484-FCBGA (19x19)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Johnson Controls

VG7844GT+423BGA

-

-

-

Microchip Technology

-

-

-

-

-

MCU - 136, FPGA - 108

-

-

-

Tray

-

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-40°C ~ 125°C (TJ)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2.2MB

-

RISC-V

-

-

DMA, PCI, PWM

-

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

MPU, FPGA

-

-

-

-

FPGA - 254K Logic Modules

-

-

-

-

128KB

Threaded

-

-

-

-

-

-

-

M2S050-FGG896
M2S050-FGG896

Microchip

In Stock

-

-

-

-

-

896-BGA

-

-

-

896-FBGA (31x31)

-

-

-

M2S050

10%

-

-

-

64 kB

-

-

-

-

-

-

-

166 MHz

-

+ 85 C

Microchip Technology

-

0 C

-

-

SMD/SMT

377

56340 LE

-

-

Tray

-

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

1.2000 V

-

0 to 85 °C

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

1 uF

-

-

-

-

-

-

-

-

-

-

-

-

-

-

896

-

-

-

-

-

1.2 V

-

-

-

-

-

-

166MHz

64KB

-

ARM® Cortex®-M3

-

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

-

-

STD

FPGA - 50K Logic Modules

-

-

1 Core

-

256KB

-

-

3.2 mm

3.2 x 2.5 x 2.79 mm

-

-

-

-

M2S005-FGG484
M2S005-FGG484

Microchip

81

-

-

-

-

-

484-BGA

YES

-

-

484-FPBGA (23x23)

-

484

-

M2S005

-

-

-

-

64 kB

MICROSEMI CORP

-

-

-

-

Microsemi Corporation

M2S005-FGG484

166 MHz

1.26 V

+ 85 C

Microchip Technology

1.14 V

0 C

3

-

SMD/SMT

209

6060 LE

85 °C

-

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

-

-

Active

40

2.39

-

Yes

-

-

1.26 V

1.14 V

1.2 V

1.2000 V

-

0 to 85 °C

SmartFusion®2

e1

-

-

-

-

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

8542.39.00.01

-

-

Field Programmable Gate Arrays

-

CMOS

BOTTOM

-

BALL

-

250

-

1 mm

compliant

-

-

-

-

S-PBGA-B484

209

Not Qualified

-

1.2 V

1.2 V

-

OTHER

-

-

-

166MHz

64KB

-

ARM® Cortex®-M3

-

-

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

209

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 5K Logic Modules

-

6060

1 Core

-

128KB

-

-

-

-

23 mm

23 mm

-

-

M2S060T-VFG784
M2S060T-VFG784

Microchip

2081
  • 1:$137.697489
  • 10:$129.903292
  • 100:$122.550275
  • 500:$115.613467
    • View all price
-

-

-

-

784-FBGA

-

-

-

784-VFBGA (23x23)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

+ 85 C

Microchip Technology

-

0 C

-

-

-

-

56500 LE

-

-

Tray

-

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

0°C ~ 85°C (TJ)

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

-

-

ARM® Cortex®-M3

-

-

DDR, PCIe, SERDES

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

-

-

-

FPGA - 60K Logic Modules

-

-

-

-

-

-

-

-

-

-

-

-

-

M2S025-FG484I
M2S025-FG484I

Microchip

2512

-

-

Production (Last Updated: 2 months ago)

-

Panel Mount, Through Hole

484-BGA

-

Flange

Aluminum

484-FPBGA (23x23)

-

-

-

TVP00DT

-

Gold

Copper Alloy

-

-

-

-

-

-

-

-

-

-

-

-

Amphenol Aerospace Operations

-

-

-

-

-

267

-

-

-

Bulk

-

-

-

-

-

-

-

-

Metal

Active

-

-

Non-Compliant

-

-

-

-

-

-

-

-

-65°C ~ 175°C

MIL-DTL-38999 Series III, Tri-Start™ HD

-

-

-

-

Solder

Receptacle, Male Pins

-

55

-

-

Military

-

-

Threaded

-

-

-

-

A

-

Shielded

-

Environment Resistant

-

-

-

Durmalon™

-

15-55

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

ARM® Cortex®-M3

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DDR, PCIe, SERDES

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CANbus, Ethernet, I²C, SPI, UART/USART, USB

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MCU, FPGA

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FPGA - 25K Logic Modules

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256KB

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Alignment Disc

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50.0µin (1.27µm)

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MPFS095T-FCSG536T2
MPFS095T-FCSG536T2

Microchip

In Stock

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Panel Mount

536-LFBGA

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536-BGA (16x16)

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--

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Microchip Technology

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MCU - 136, FPGA - 168

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Tray

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Active

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-40°C ~ 125°C (TJ)

UPG

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Obsolete

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--

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Toggle

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--

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857.6KB

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RISC-V

1

--

DMA, PCI, PWM

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CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

Magnetic (Hydraulic Delay)

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MPU, FPGA

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-

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-

FPGA - 93K Logic Modules

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-

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128KB

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-

-

-

-

-

-

-

M2S090T-1FG676I
M2S090T-1FG676I

Microchip

2524
  • 1:$452.473214
  • 10:$426.861523
  • 100:$402.699550
  • 500:$379.905236
    • View all price
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676-BGA

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676-FBGA (27x27)

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M2S090

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64 kB

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-

-

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166 MHz

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Microchip Technology

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SMD/SMT

425

86316 LE

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Tray

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-

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Active

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1.2000 V

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-40 to 100 °C

SmartFusion®2

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166MHz

64KB

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ARM® Cortex®-M3

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-

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

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MCU, FPGA

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1

FPGA - 90K Logic Modules

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1 Core

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512KB

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M2S050T-1FG484
M2S050T-1FG484

Microchip

2638
  • 1:$215.329933
  • 10:$203.141446
  • 100:$191.642874
  • 500:$180.795164
    • View all price
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484-BGA

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484-FPBGA (23x23)

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M2S050

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64 kB

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166 MHz

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Microchip Technology

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SMD/SMT

267

56340 LE

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Tray

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Active

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1.2000 V

-

0 to 85 °C

SmartFusion®2

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166MHz

64KB

-

ARM® Cortex®-M3

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-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

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MCU, FPGA

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1

FPGA - 50K Logic Modules

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1 Core

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256KB

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-

-

-

-

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M2S050T-VFG400I
M2S050T-VFG400I

Microchip

2383
  • 1:$204.948453
  • 10:$193.347597
  • 100:$182.403394
  • 500:$172.078673
    • View all price
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400-LFBGA

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400-VFBGA (17x17)

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M2S050

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64 kB

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166 MHz

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Microchip Technology

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SMD/SMT

207

56340 LE

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Tray

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Active

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-40°C ~ 100°C (TJ)

SmartFusion®2

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166MHz

64KB

-

ARM® Cortex®-M3

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DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

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MCU, FPGA

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-

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FPGA - 50K Logic Modules

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1 Core

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256KB

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-

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M2S150T-1FCV484I
M2S150T-1FCV484I

Microchip

2975
  • 1:$247.424622
  • 10:$233.419455
  • 100:$220.207033
  • 500:$207.742484
    • View all price
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484-BFBGA

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484-FBGA (19x19)

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M2S150

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64 kB

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166 MHz

1.26 V

-

Microchip Technology

1.14 V

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-

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-

273

146124 LE

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Tray

-

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Active

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1.2000 V

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-40 to 100 °C

SmartFusion®2

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166MHz

64KB

-

ARM® Cortex®-M3

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-

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

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MCU, FPGA

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1

FPGA - 150K Logic Modules

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1 Core

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512KB

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-

-

-

-

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M2S060-FGG676
M2S060-FGG676

Microchip

2972
  • 1:$182.019018
  • 10:$171.716055
  • 100:$161.996278
  • 500:$152.826677
    • View all price
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Production (Last Updated: 2 months ago)

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676-BGA

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676-FBGA (27x27)

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M2S060

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64 kB

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-

-

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-

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166 MHz

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Microchip Technology

-

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-

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387

56520 LE

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Tray

-

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Active

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Non-Compliant

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1.2000 V

-

0 to 85 °C

SmartFusion®2

-

-

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-

-

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-

-

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166MHz

64KB

-

ARM® Cortex®-M3

-

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

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MCU, FPGA

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-

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STD

FPGA - 60K Logic Modules

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1 Core

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256KB

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-

-

-

-

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M2S010-1VFG400I
M2S010-1VFG400I

Microchip

22
-

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400-LFBGA

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400-VFBGA (17x17)

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M2S010

-

-

-

-

-

-

-

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Microchip Technology

-

-

-

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195

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Tray

-

-

-

-

-

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Active

-

-

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-40°C ~ 100°C (TJ)

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

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-

-

-

-

-

-

-

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-

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166MHz

64KB

-

ARM® Cortex®-M3

-

-

DDR, PCIe, SERDES

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

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MCU, FPGA

-

-

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1

FPGA - 10K Logic Modules

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-

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256KB

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-

-

-

-

-

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