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Microchip Embedded - System On Chip (SoC)

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Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

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L1 Cache Instruction Memory

Manufacturer

Manufacturer Part Number

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Mfr

Minimum Operating Supply Voltage

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Size

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Index Stops

Circuit per Deck

Depth Behind Panel

Speed Grade

Number of Poles per Deck

Angle of Throw

Primary Attributes

Number of Logic Cells

Number of Cores

Flash Size

Constant Current Load - Max

Features

Product Category

Height

Length

Width

Actuator Length

M2S005S-1TQ144
M2S005S-1TQ144

Microchip

In Stock

-

-

-

-

144-LQFP

YES

144-TQFP (20x20)

144

-

-

-

-

-

-

MICROSEMI CORP

-

-

Microsemi Corporation

M2S005S-1TQ144

-

-

-

Microchip Technology

-

-

-

3

-

84

-

-

85 °C

-

Tray

PLASTIC/EPOXY

LFQFP

TQFP-144

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

Obsolete

30

5.88

-

No

-

1.26 V

1.14 V

1.2 V

-

-

-

-

-

0°C ~ 85°C (TJ)

-

SmartFusion®2

-

e0

-

-

-

-

-

-

-

Tin/Lead (Sn/Pb)

-

-

-

8542.39.00.01

Field Programmable Gate Arrays

-

CMOS

-

QUAD

GULL WING

240

0.5 mm

not_compliant

-

-

-

S-PQFP-G144

84

Not Qualified

-

-

-

-

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

-

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

84

-

1.6 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

FPGA - 5K Logic Modules

6060

-

128KB

-

-

-

-

20 mm

20 mm

-

MPFS250T-1FCVG484EES
MPFS250T-1FCVG484EES

Microchip

In Stock

-

-

-

Panel Mount

484-BFBGA, FCBGA

-

484-FCBGA (19x19)

-

-

-

Silver Alloy

-

-

-

-

-

-

-

-

-

-

-

Microchip Technology

-

-

-

-

-

MCU - 136, FPGA - 372

-

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

28V

-

0°C ~ 100°C

-

44

-

-

-

Active

-

-

-

-

10

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1A (AC/DC)

--

Solder Lug

-

-

-

Flatted (6.35mm Dia)

-

-

--

-

-

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

1

MPU, FPGA

-

5.761 ~ 83gfm

-

-

-

-

Shorting (MBB)

Fixed

SP10T

26.04mm

-

1

30°

FPGA - 254K Logic Modules

-

-

128kB

-

Shaft and Panel Sealed

-

-

-

-

11.10mm

M2S090T-FG676I
M2S090T-FG676I

Microchip

2681
  • 1:$403.764071
  • 10:$380.909501
  • 100:$359.348586
  • 500:$339.008100
    • View all price
-

-

-

676-BGA

YES

676-FBGA (27x27)

676

M2S090

-

-

64 kB

-

-

MICROSEMI CORP

-

-

Microsemi Corporation

M2S090T-FG676I

166 MHz

-

-

Microchip Technology

-

-

-

3

SMD/SMT

425

-

86316 LE

-

-

Tray

PLASTIC/EPOXY

BGA

BGA, BGA676,26X26,40

BGA676,26X26,40

SQUARE

GRID ARRAY

Active

Active

30

5.83

-

No

-

1.26 V

1.14 V

1.2 V

-

-

-

-

-

-40°C ~ 100°C (TJ)

-

1500

-

e0

-

Active

-

-

Panel Mount

-

-

Tin/Lead (Sn/Pb)

-

-

-

8542.39.00.01

Field Programmable Gate Arrays

-

CMOS

120VAC

BOTTOM

BALL

240

1 mm

not_compliant

-

-

-

S-PBGA-B676

425

Not Qualified

-

Terminals

-

-

1.2 V

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Terminals

120VAC, 140VAC

-

MCU, FPGA

425

-

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

8.810 L x 7.250 W x 13.000 H (223.77mm x 184.15mm x 330.20mm)

-

-

-

-

-

-

-

-

FPGA - 90K Logic Modules

86316

1 Core

512KB

15A (2.1kVA)

-

-

-

27 mm

27 mm

-

M2S050T-FGG896ES
M2S050T-FGG896ES

Microchip

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Phoenix Contact

1935297

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

M2S025TS-1FGG484M
M2S025TS-1FGG484M

Microchip

2372

-

-

Production (Last Updated: 2 months ago)

-

484-BGA

-

484-FPBGA (23x23)

-

M2S025

-

-

64 kB

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

-

-

SMD/SMT

267

-

27696 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Compliant

-

-

-

-

-

-

-

-

-

-

-55°C ~ 125°C (TJ)

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 25K Logic Modules

-

1 Core

256KB

-

-

-

-

-

-

-

M2S050T-1FGG896
M2S050T-1FGG896

Microchip

2190
  • 1:$259.883425
  • 10:$245.173042
  • 100:$231.295323
  • 500:$218.203135
    • View all price
-

-

-

896-BGA

-

896-FBGA (31x31)

-

M2S050

-

-

64 kB

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

-

-

SMD/SMT

377

-

56340 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

1.2000 V

-

-

-

0 to 85 °C

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

1

-

-

FPGA - 50K Logic Modules

-

1 Core

256KB

-

-

-

-

-

-

-

M2S060TS-1FG484M
M2S060TS-1FG484M

Microchip

2901
  • 1:$365.879535
  • 10:$345.169373
  • 100:$325.631484
  • 500:$307.199513
    • View all price
-

-

-

BGA-484

YES

484-FPBGA (23x23)

484

M2S060

Microchip Technology / Atmel

-

64 kB

1314 kbit

60

MICROSEMI CORP

-

-

Microchip

M2S060TS-1FG484M

166 MHz

-

+ 125 C

Microchip Technology

-

- 55 C

Yes

3

SMD/SMT

267 I/O

4710 LAB

56520 LE

125 °C

-55 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-484

-

SQUARE

GRID ARRAY

Active

Active

30

5.84

-

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

SmartFusion2

-

0.326090 oz

-

-

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

-

e0

Yes

-

3A001.A.2.C

-

-

-

-

Tin/Lead (Sn/Pb)

-

-

-

8542.39.00.01

SOC - Systems on a Chip

-

-

-

BOTTOM

BALL

240

1 mm

not_compliant

-

-

-

S-PBGA-B484

-

-

-

-

1.2 V

-

-

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

SoC FPGA

-

-

-

-

-

-

-

FPGA - 60K Logic Modules

-

1 Core

256KB

-

-

SoC FPGA

-

23 mm

23 mm

-

M2S050-FG484
M2S050-FG484

Microchip

2300

-

-

-

-

484-BGA

-

484-FPBGA (23x23)

-

M2S050

-

-

64 kB

-

-

-

-

-

-

-

166 MHz

1.26 V

-

Microchip Technology

1.14 V

-

-

-

SMD/SMT

267

-

56340 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

1.2000 V

-

-

-

0 to 85 °C

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

STD

-

-

FPGA - 50K Logic Modules

-

1 Core

256KB

-

-

-

-

-

-

-

M2S005S-VFG400I
M2S005S-VFG400I

Microchip

39

-

-

-

-

400-LFBGA

-

400-VFBGA (17x17)

-

M2S005

-

-

64 kB

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

-

-

-

169

-

6060 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 5K Logic Modules

-

1 Core

128KB

-

-

-

-

-

-

-

M2S005S-TQG144I
M2S005S-TQG144I

Microchip

9
-

-

-

TQFP-144

-

144-TQFP (20x20)

-

M2S005

Microchip Technology / Atmel

-

64 kB

-

60

-

-

-

Microchip

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

SMD/SMT

84

505 LAB

6060 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

0.046530 oz

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

SOC - Systems on a Chip

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

-

-

-

SoC FPGA

-

-

-

-

-

-

-

FPGA - 5K Logic Modules

-

1 Core

128KB

-

-

SoC FPGA

-

-

-

-

M2S010-TQG144
M2S010-TQG144

Microchip

500

-

-

-

-

144-LQFP

-

144-TQFP (20x20)

-

M2S010

Microchip Technology / Atmel

-

64 kB

400 kbit

60

-

-

-

Microchip

-

166 MHz

-

+ 85 C

Microchip Technology

-

0 C

Yes

-

SMD/SMT

84

1007 LAB

12084 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Details

-

-

-

-

-

-

-

0.035380 oz

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

SOC - Systems on a Chip

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.2 V

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

-

-

-

SoC FPGA

-

-

-

-

-

-

-

FPGA - 10K Logic Modules

-

1 Core

256KB

-

-

SoC FPGA

-

-

-

-

M2S060T-1VFG784
M2S060T-1VFG784

Microchip

2451
  • 1:$174.557906
  • 10:$164.677270
  • 100:$155.355915
  • 500:$146.562184
    • View all price
-

-

-

784-FBGA

-

784-VFBGA (23x23)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

+ 85 C

Microchip Technology

-

0 C

-

-

SMD/SMT

-

-

56500 LE

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C ~ 85°C (TJ)

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

-

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 60K Logic Modules

-

-

-

-

-

-

-

-

-

-

M2S010T-1FG484M
M2S010T-1FG484M

Microchip

2741
  • 1:$137.625493
  • 10:$129.835371
  • 100:$122.486199
  • 500:$115.553018
    • View all price
-

-

-

484-BGA

YES

484-FPBGA (23x23)

484

M2S010

-

-

64 kB

-

-

MICROSEMI CORP

-

-

Microsemi Corporation

M2S010T-1FG484M

166 MHz

-

-

Microchip Technology

-

-

-

3

SMD/SMT

233

-

12084 LE

125 °C

-55 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

30

5.81

-

No

-

1.26 V

1.14 V

1.2 V

-

-

-

-

150 V

-55°C ~ 125°C (TJ)

-

SmartFusion®2

1 %

e0

-

-

3A001.A.2.C

50 ppm/°C

-

3.4 Ω

-

Tin/Lead (Sn/Pb)

155 °C

-55 °C

Thin Film

8542.39.00.01

Field Programmable Gate Arrays

250 mW

CMOS

-

BOTTOM

BALL

240

1 mm

not_compliant

-

-

-

S-PBGA-B484

233

Not Qualified

-

-

-

-

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

-

MCU, FPGA

233

-

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

FPGA - 10K Logic Modules

12084

1 Core

256KB

-

-

-

650 µm

23 mm

23 mm

-

MPFS160T-FCVG784E
MPFS160T-FCVG784E

Microchip

2617
  • 1:$222.836462
  • 10:$210.223077
  • 100:$198.323658
  • 500:$187.097790
    • View all price
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784-BFBGA, FCBGA

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784-FCBGA (23x23)

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4 x 32 kB

16 kB, 4 x 32 kB

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667 MHz, 667 MHz

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+ 100 C

Microchip Technology

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0 C

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SMD/SMT

MCU - 136, FPGA - 312

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161000 LE

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Tray

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Active

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100 V

0°C ~ 100°C

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PolarFire™

0.1 %

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100 ppm/°C

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715 Ω

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155 °C

-55 °C

Thin Film

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125 mW

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1 V

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1.4125MB

RISC-V

DMA, PCI, PWM

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CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

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MPU, FPGA

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FPGA - 161K Logic Modules

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5 Core

128kB

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650 µm

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MPFS025TS-1FCSG325I
MPFS025TS-1FCSG325I

Microchip

38
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325-TFBGA

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325-BGA (11x11)

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4 x 32 kB

16 kB, 4 x 32 kB

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667 MHz, 667 MHz

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+ 100 C

Microchip Technology

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- 40 C

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SMD/SMT

MCU - 102, FPGA - 80

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23000 LE

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Tray

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Active

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-40°C ~ 100°C

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1 V

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230.4KB

RISC-V

DMA, PCI, PWM

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CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

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MPU, FPGA

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FPGA - 23K Logic Modules

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5 Core

128KB

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M2S005S-TQG144
M2S005S-TQG144

Microchip

23
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144-LQFP

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144-TQFP (20x20)

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M2S005

Microchip Technology / Atmel

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64 kB

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60

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Microchip

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166 MHz

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Microchip Technology

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Yes

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84

505 LAB

6060 LE

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Tray

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Active

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Details

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This product may require additional documentation to export from the United States.

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1.2000 V

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0 to 85 °C

Tray

SmartFusion2

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SOC - Systems on a Chip

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166MHz

64KB

ARM® Cortex®-M3

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128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

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MCU, FPGA

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SoC FPGA

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STD

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FPGA - 5K Logic Modules

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1 Core

128KB

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SoC FPGA

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A2F060M3E-CSG288I
A2F060M3E-CSG288I

Microchip

In Stock

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MPFS250T-1FCVG484I
MPFS250T-1FCVG484I

Microchip Technology

2306

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FCVG-484

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484-FCBGA (19x19)

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1

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4 x 32 kB

16 kB, 4 x 32 kB

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667 MHz, 667 MHz

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+ 100 C

Microchip Technology

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0 C

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SMD/SMT

372 I/O

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254000 LE

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Tray

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Active

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This product may require additional documentation to export from the United States.

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-40°C ~ 100°C

Tray

PolarFire™

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1 V

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2.2MB

RISC-V

DMA, PCI, PWM

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CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

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MPU, FPGA

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FPGA - 254K Logic Modules

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5 Core

128kB

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MPFS250TL-FCVG784I
MPFS250TL-FCVG784I

Microchip Technology

2024

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BGA-784

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784-FCBGA (23x23)

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1

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4 x 32 kB

16 kB, 4 x 32 kB

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667 MHz, 667 MHz

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+ 100 C

Microchip Technology

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- 40 C

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SMD/SMT

372 I/O

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254000 LE

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Tray

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Active

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This product may require additional documentation to export from the United States.

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-40°C ~ 100°C

Tray

PolarFire™

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1 V

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2.2MB

RISC-V

DMA, PCI, PWM

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CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

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MPU, FPGA

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FPGA - 254K Logic Modules

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5 Core

128kB

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MPFS095TL-FCVG784E
MPFS095TL-FCVG784E

Microchip Technology

2743

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BGA-784

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784-BGA

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1

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4 x 32 kB

16 kB, 4 x 32 kB

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667 MHz, 667 MHz

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+ 100 C

Microchip Technology

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0 C

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SMD/SMT

276 I/O

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93000 LE

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Tray

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Active

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This product may require additional documentation to export from the United States.

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0°C ~ 100°C

Tray

PolarFire®

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1 V

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857.6kB

RISC-V

DMA, PCI, PWM

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CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

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MPU, FPGA

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FPGA - 93K Logic Modules

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5 Core

128kB

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