- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Data RAM Size | Device Logic Units | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Screening Level | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Device Core | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S060T-1FGG484I Microchip Technology | 2860 |
| - | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 484 | M2S060 | 64 kB | - | - | 60 | - | MICROSEMI CORP | - | - | - | - | - | M2S060T-1FGG484I | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | 3 | - | - | - | 267 | 4710 LAB | 56520 LE | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 1.2000 V | - | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | - | - | 166MHz | 164.3 kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | - | 23 mm | 23 mm | ||
M2S150TS-FCSG536 Microchip Technology | 2271 |
| - | - | 536-LFBGA, CSPBGA | - | - | 536-CSPBGA (16x16) | - | M2S150 | 64 kB | - | - | 90 | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | - | - | - | 293 | 12177 LAB | 146124 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | STD | FPGA - 150K Logic Modules | - | 1 Core | 512KB | - | - | - | ||
M2S150TS-FC1152 Microchip Technology | 2740 |
| - | - | 1152-BBGA, FCBGA | YES | - | 1152-FCBGA (35x35) | 1152 | M2S150 | 64 kB | 146124 | - | 24 | - | MICROSEMI CORP | - | - | - | - | - | M2S150TS-FC1152 | 166 MHz | 574 | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | Surface Mount | - | - | 574 | 12177 LAB | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | FCBGA | 1.26 V | 1.14 V | 1.2 V | - | 1.2 V | Commercial grade | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | 1152 | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | Commercial | STD | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | - | 35 mm | 35 mm | ||
M2S050TS-FG896 Microchip Technology | 2942 |
| - | Production (Last Updated: 2 months ago) | 896-BGA | - | - | 896-FBGA (31x31) | - | M2S050 | 64 kB | - | - | 27 | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | - | - | - | 377 | 4695 LAB | 56340 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 50K Logic Modules | - | 1 Core | 256KB | - | - | - | ||
M2S090-FCS325 Microchip Technology | 2549 |
| - | - | 325-TFBGA, FCBGA | - | - | 325-FCBGA (11x13.5) | - | M2S090 | 64 kB | - | - | 176 | 1.2, 1.5, 1.8, 2.5, 3.3 V | - | RISC | CAN/Ethernet/Serial I2C/SPI/UART/USB | Yes | - | - | - | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | Surface Mount | - | 1 | 180 | 7193 LAB | 86316 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | Commercial grade | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | 325 | - | - | - | 0.95, 1.05 V | - | - | CAN/Ethernet/Serial | 166MHz | 64 KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | - | - | - | Commercial | - | FPGA - 90K Logic Modules | - | 1 Core | 512KB | ARM Cortex-M3 | - | - | ||
M2S150T-1FCSG536 Microchip Technology | 2693 |
| - | - | 536-LFBGA, CSPBGA | - | - | 536-CSPBGA (16x16) | - | M2S150 | 64 kB | - | - | 90 | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | - | - | - | 293 | 12177 LAB | 146124 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | 1 Core | 512KB | - | - | - | ||
M2S090T-FGG676 Microchip Technology | 2316 |
| - | - | 676-BGA | - | - | 676-FBGA (27x27) | - | M2S090 | 64 kB | - | - | 40 | - | - | - | - | - | - | - | - | 166 MHz | - | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | - | - | - | 425 | 7193 LAB | 86316 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | STD | FPGA - 90K Logic Modules | - | 1 Core | 512KB | - | - | - | ||
M2S050T-VF400I Microchip Technology | 2900 |
| - | Production (Last Updated: 2 months ago) | VFPBGA-400 | YES | - | 400-VFBGA (17x17) | 400 | M2S050 | 64 kB | - | - | 90 | - | MICROSEMI CORP | - | - | - | - | - | M2S050T-VF400I | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | - | SMD/SMT | - | 207 | 4695 LAB | 56340 LE | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | S-PBGA-B400 | 207 | Not Qualified | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | - | 17 mm | 17 mm | ||
M2S010TS-1VF256 Microchip Technology | 7 |
| - | Production (Last Updated: 1 month ago) | VFPBGA-256 | YES | - | 256-FPBGA (14x14) | 256 | M2S010 | 64 kB | - | - | 119 | - | MICROSEMI CORP | - | - | - | - | - | M2S010TS-1VF256 | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | - | SMD/SMT | - | 138 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | S-PBGA-B256 | 138 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | - | 14 mm | 14 mm | ||
M2S050T-FGG484 Microchip Technology | 2613 |
| - | - | FPBGA-484 | YES | - | 484-FPBGA (23x23) | 484 | M2S050 | 64 kB | - | - | 60 | - | MICROSEMI CORP | - | - | - | - | - | M2S050T-FGG484 | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | 3 | - | SMD/SMT | - | 267 | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | - | 23 mm | 23 mm | ||
M2S025TS-FGG484 Microchip Technology | 2155 |
| - | Production (Last Updated: 2 months ago) | 484-BGA | - | - | 484-FPBGA (23x23) | - | M2S025 | 64 kB | - | - | 60 | - | - | - | - | - | - | - | - | 166 MHz | - | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | - | - | - | 267 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | STD | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | - | ||
M2S010S-1TQG144 Microchip Technology | 23 |
| - | - | TQFP-144 | - | - | 144-TQFP (20x20) | - | M2S010 | 64 kB | - | 400 kbit | 60 | - | - | - | - | - | - | - | - | 166 MHz | - | - | + 85 C | Microchip Technology | - | 0 C | - | - | - | SMD/SMT | - | 84 I/O | 1007 LAB | 12084 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 10K Logic Modules | - | 1 Core | 256KB | - | - | - | ||
M2S050TS-1VF400I Microchip Technology | 2849 |
| - | - | VFPBGA-400 | YES | - | 400-VFBGA (17x17) | 400 | M2S050 | 64 kB | - | - | 90 | - | MICROSEMI CORP | - | - | - | - | - | M2S050TS-1VF400I | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | - | SMD/SMT | - | 207 | 4695 LAB | 56340 LE | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | S-PBGA-B400 | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 50K Logic Modules | - | 1 Core | 256KB | - | 17 mm | 17 mm | ||
M2S060T-FG676I Microchip Technology | 2850 |
| - | Production (Last Updated: 2 months ago) | 676-BGA | - | - | 676-FBGA (27x27) | - | M2S060 | 64 kB | - | - | 40 | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | - | - | - | 387 | 4710 LAB | 56520 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | SmartFusion2 | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | - | ||
M2S025T-1VF400I Microchip Technology | 2268 |
| - | - | VFPBGA-400 | YES | - | 400-VFBGA (17x17) | 400 | M2S025 | 64 kB | - | - | 90 | - | MICROSEMI CORP | - | - | - | - | - | M2S025T-1VF400I | 166 MHz | - | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | - | SMD/SMT | - | 207 | 2308 LAB | 27696 LE | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | S-PBGA-B400 | 160 | Not Qualified | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 25K Logic Modules | 23988 | 1 Core | 256KB | - | 17 mm | 17 mm | ||
M2S150TS-1FCG1152I Microchip Technology | 2241 | - | - | - | FCBGA-1152 | - | - | 1152-FCBGA (35x35) | - | M2S150 | 64 kB | - | - | 24 | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | - | SMD/SMT | - | 574 | 12177 LAB | 146124 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 1.2000 V | - | -40 to 100 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 150K Logic Modules | - | 1 Core | 512KB | - | - | - | ||
M2S090TS-FCS325 Microchip Technology | 2020 |
| - | - | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x13.5) | 325 | M2S090 | 64 kB | - | - | 176 | - | MICROSEMI CORP | - | - | - | - | - | M2S090TS-FCS325 | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | - | - | - | 180 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.83 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | - | R-PBGA-B325 | 180 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | - | STD | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | - | 13.5 mm | 11 mm | ||
M2S050-1VF400I Microchip Technology | 2282 |
| - | - | VFPBGA-400 | YES | - | 400-VFBGA (17x17) | 400 | M2S050 | 64 kB | - | - | 90 | - | MICROSEMI CORP | - | - | - | - | - | M2S050-1VF400I | 166 MHz | - | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | - | SMD/SMT | - | 207 | 4695 LAB | 56340 LE | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.77 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | S-PBGA-B400 | 160 | Not Qualified | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 50K Logic Modules | 48672 | 1 Core | 256KB | - | 17 mm | 17 mm | ||
M2S060-FGG676I Microchip Technology | 2764 |
| - | - | 676-BGA | YES | - | 676-FBGA (27x27) | 676 | M2S060 | 64 kB | - | - | 40 | - | MICROSEMI CORP | - | - | - | - | - | M2S060-FGG676I | 166 MHz | - | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | 3 | - | - | - | 387 | 4710 LAB | 56520 LE | - | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Details | Yes | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 1.2000 V | - | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | S-PBGA-B676 | 387 | Not Qualified | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | STD | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | - | 27 mm | 27 mm | ||
M2S060-FCSG325 Microchip Technology | 2677 |
| - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x11) | 325 | M2S060 | 64 kB | - | - | 176 | - | MICROSEMI CORP | - | - | - | - | - | M2S060-FCSG325 | 166 MHz | - | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | 3 | - | - | - | 200 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | STD | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | - | 11 mm | 11 mm |