- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Data RAM Size | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Total RAM Bits | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Flash Size | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPFS250T-1FCG1152I Microchip Technology | 2168 | - | - | BGA-1152 | - | 1152-FCBGA (35x35) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | 372 I/O | - | 254000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | 5 Core | 128kB | - | - | ||
M2S025-1VF400I Microchip | 2980 |
| - | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S025 | - | 64 kB | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | M2S025-1VF400I | 166 MHz | - | - | Microchip Technology | - | - | - | - | SMD/SMT | - | 207 | - | 27696 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.3 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | S-PBGA-B400 | 160 | Not Qualified | - | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 25K Logic Modules | - | 23988 | 1 Core | 256KB | 17 mm | 17 mm | ||
MPFS160T-1FCVG784T2 Microchip | In Stock | - | - | 784-BFBGA, FCBGA | - | 784-FCBGA (23x23) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | MCU - 136, FPGA - 312 | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | - | 128KB | - | - | ||
MPFS025TLS-FCVG484I Microchip Technology | 31 | - | - | 484-BFBGA | - | 484-FBGA (19x19) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | - | 108 I/O | - | 23000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | -40°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 23K Logic Modules | - | - | 5 Core | 128KB | - | - | ||
MPFS025T-1FCVG484I Microchip Technology | 36 | - | - | FCVG-484 | - | 484-FCBGA (19x19) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | MSL 3 - 168 hours | 108 I/O | - | 23000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | -40°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | 1843.2Kbit | - | FPGA - 23K Logic Modules | - | - | 5 Core | 128KB | - | - | ||
MPFS025TS-FCVG484I Microchip Technology | 30 | - | - | 484-BFBGA | - | 484-FBGA (19x19) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | - | 108 I/O | - | 23000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | -40°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 23K Logic Modules | - | - | 5 Core | 128KB | - | - | ||
MPFS025TLS-FCSG325I Microchip Technology | 15 | - | - | 325-TFBGA | - | 325-BGA (11x11) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | - | 108 I/O | - | 23000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | -40°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 23K Logic Modules | - | - | 5 Core | 128KB | - | - | ||
MPFS025TL-FCVG484I Microchip Technology | 17 | - | - | 484-BFBGA | - | 484-FBGA (19x19) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | - | 108 I/O | - | 23000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | -40°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 23K Logic Modules | - | - | 5 Core | 128KB | - | - | ||
MPFS025T-FCSG325E Microchip Technology | 19 | - | - | FCSG-325 | - | 325-BGA (11x11) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | MSL 3 - 168 hours | 108 I/O | - | 23000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 0°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | 1843.2Kbit | - | FPGA - 23K Logic Modules | - | - | 5 Core | 128KB | - | - | ||
MPFS095TS-FCSG325I Microchip Technology | 2622 | - | - | BGA-325 | - | 325-LFBGA (11x14.5) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | - | 276 I/O | - | 93000 LE | Bulk | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | -40°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | 5 Core | 128KB | - | - | ||
MPFS095T-1FCVG484I Microchip Technology | 2682 | - | - | BGA-484 | - | 484-FCBGA (19x19) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | 276 I/O | - | 93000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | 5 Core | 128kB | - | - | ||
MPFS160TL-FCVG484E Microchip Technology | 2014 | - | - | BGA-484 | - | 484-FCBGA (19x19) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | 312 I/O | - | 161000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | 0°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 5 Core | 128kB | - | - | ||
MPFS095TS-1FCSG325I Microchip Technology | 2563 | - | - | BGA-325 | - | 325-LFBGA (11x14.5) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | - | 276 I/O | - | 93000 LE | Bulk | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | -40°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | 5 Core | 128KB | - | - | ||
MPFS160TL-FCVG484I Microchip Technology | 2245 | - | - | BGA-484 | - | 484-FCBGA (19x19) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | 312 I/O | - | 161000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 5 Core | 128kB | - | - | ||
MPFS160TL-FCSG536I Microchip Technology | 2739 | - | - | BGA-536 | - | 536-LFBGA | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | 312 I/O | - | 161000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 5 Core | 128kB | - | - | ||
MPFS160TL-FCSG536E Microchip Technology | 2328 | - | - | BGA-536 | - | 536-LFBGA | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | 312 I/O | - | 161000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | 0°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 5 Core | 128kB | - | - | ||
MPFS095TL-FCSG325E Microchip Technology | 2330 | - | - | BGA-325 | - | 325-LFBGA (11x14.5) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | 276 I/O | - | 93000 LE | Bulk | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | 0°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | 5 Core | 128KB | - | - | ||
MPFS095T-FCVG784E Microchip Technology | 2313 | - | - | FCVG-784 | - | 784-BGA | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | 276 I/O | - | 93000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | 0°C ~ 100°C | Tray | PolarFire® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | 5 Core | 128kB | - | - | ||
M2S050T-1FG896I Microchip Technology | 2182 |
| - | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | M2S050 | 50 MHz | 64 kB | - | - | 27 | MICROSEMI CORP | - | - | - | M2S050T-1FG896I | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | - | 377 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.74 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | - | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | 896 | S-PBGA-B896 | 377 | Not Qualified | - | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 48672 CLBS | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 50K Logic Modules | 48672 | 48672 | 1 Core | 256KB | 31 mm | 31 mm | ||
M2S005-FG484 Microchip Technology | 7 |
| - | BGA-484 | - | 484-FPBGA (23x23) | - | M2S005 | - | 64 kB | 191 kbit | 64 kB | 60 | - | - | - | - | - | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | Yes | - | SMD/SMT | - | 209 I/O | 505 LAB | 6060 LE | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | STD | FPGA - 5K Logic Modules | - | - | 1 Core | 128KB | - | - |