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Factory Pack QuantityFactory Pack Quantity

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Number of Gates

Speed Grade

Resistance Tolerance

Primary Attributes

Number of CLBs

Number of Logic Cells

Number of Cores

Number of Equivalent Gates

Output Level

Flash Size

Product Category

Length

Width

MPFS160TLS-FCSG536I
MPFS160TLS-FCSG536I

Microchip Technology

2627

-

-

BGA-536

-

536-LFBGA

-

-

-

-

-

-

-

-

-

-

-

-

1

-

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

-

-

SMD/SMT

-

312 I/O

-

161000 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

-

-

-

FPGA - 161K Logic Modules

-

-

5 Core

-

-

128kB

-

-

-

MPFS160T-FCSG536I
MPFS160T-FCSG536I

Microchip Technology

2853

-

-

FCSG-536

-

536-LFBGA

-

-

-

-

-

-

-

-

-

-

-

-

1

-

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

-

-

SMD/SMT

-

312 I/O

-

161000 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

-

-

-

FPGA - 161K Logic Modules

-

-

5 Core

-

-

128kB

-

-

-

MPFS095TLS-FCVG484I
MPFS095TLS-FCVG484I

Microchip Technology

2374

-

-

BGA-484

-

484-FCBGA (19x19)

-

-

-

-

-

-

-

-

-

-

-

-

1

-

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

- 40 C

-

-

-

SMD/SMT

-

276 I/O

-

93000 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire®

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

-

-

-

FPGA - 93K Logic Modules

-

-

5 Core

-

-

128kB

-

-

-

MPFS160TS-1FCVG484I
MPFS160TS-1FCVG484I

Microchip Technology

2526

-

-

BGA-484

-

484-FCBGA (19x19)

-

-

-

-

-

-

-

-

-

-

-

-

1

-

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

-

-

SMD/SMT

-

312 I/O

-

161000 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

-

-

-

FPGA - 161K Logic Modules

-

-

5 Core

-

-

128kB

-

-

-

MPFS250TL-FCG1152I
MPFS250TL-FCG1152I

Microchip Technology

2182

-

-

BGA-1152

-

1152-FCBGA (35x35)

-

-

-

-

-

-

-

-

-

-

-

-

1

-

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

- 40 C

-

-

-

SMD/SMT

-

372 I/O

-

254000 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

-

-

-

FPGA - 254K Logic Modules

-

-

5 Core

-

-

128kB

-

-

-

A2F200M3F-FG484
A2F200M3F-FG484

Microchip Technology

25
-

FPBGA-484

YES

484-FPBGA (23x23)

484

A2F200

-

-

-

-

80 MHz

-

64 kB

-

-

-

60

-

MICROSEMI CORP

-

-

-

A2F200M3F-FG484

80 MHz

-

+ 85 C

Microchip Technology

-

0 C

Yes

3

-

SMD/SMT

-

161 I/O

-

2000 LE

85 °C

-

-

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

-

30

5.24

N

No

-

1.575 V

1.425 V

1.5 V

SmartFusion

-

-

-

0°C ~ 85°C (TJ)

Tray

A2F200

e0

-

-

-

Tin/Lead (Sn/Pb)

-

8542.39.00.01

-

-

CMOS

BOTTOM

BALL

225

1 mm

-

compliant

-

-

S-PBGA-B484

94

Not Qualified

-

1.5,1.8,2.5,3.3 V

OTHER

2 mA

-

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

200000

STD

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

-

256KB

-

23 mm

23 mm

A2F200M3F-1FGG484I
A2F200M3F-1FGG484I

Microchip Technology

25
-

FPBGA-484

YES

484-FPBGA (23x23)

484

A2F200

-

-

-

-

100 MHz

-

64 kB

-

-

-

60

-

MICROSEMI CORP

-

-

-

A2F200M3F-1FGG484I

100 MHz

-

+ 100 C

Microchip Technology

-

- 40 C

Yes

3

-

SMD/SMT

-

161 I/O

-

2000 LE

100 °C

-40 °C

-

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

-

30

5.24

Details

Yes

-

1.575 V

1.425 V

1.5 V

SmartFusion

-

-

-

-40°C ~ 100°C (TJ)

Tray

A2F200

e1

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

8542.39.00.01

-

-

CMOS

BOTTOM

BALL

250

1 mm

-

compliant

-

-

S-PBGA-B484

94

Not Qualified

-

1.5,1.8,2.5,3.3 V

INDUSTRIAL

1 mA

-

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

200000

-

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

-

256KB

-

23 mm

23 mm

A2F500M3G-FG484I
A2F500M3G-FG484I

Microchip Technology

2552
  • 1:$146.082046
  • 10:$137.813251
  • 100:$130.012501
  • 500:$122.653303
  • View all price
-

FPBGA-484

-

484-FPBGA (23x23)

-

A2F500

-

-

-

-

-

-

64 kB

-

-

-

60

-

-

-

-

-

-

80 MHz

-

+ 100 C

Microchip Technology

-

- 40 C

Yes

-

-

SMD/SMT

-

204 I/O

-

6000 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

N

-

This product may require additional documentation to export from the United States.

-

-

-

SmartFusion

-

-

-

-40°C ~ 100°C (TJ)

Tray

A2F500

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2 mA

-

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

-

-

-

-

-

-

500000

STD

-

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

-

-

1 Core

-

-

512KB

-

-

-

A2F500M3G-1FG484I
A2F500M3G-1FG484I

Microchip Technology

2257
  • 1:$159.617797
  • 10:$150.582827
  • 100:$142.059271
  • 500:$134.018180
  • View all price
-

FPBGA-484

YES

484-FPBGA (23x23)

484

A2F500

-

-

-

-

100 MHz

-

64 kB

-

-

-

60

-

MICROSEMI CORP

-

-

-

A2F500M3G-1FG484I

100 MHz

1.575 V

+ 100 C

Microchip Technology

1.425 V

- 40 C

Yes

3

-

SMD/SMT

-

204 I/O

-

6000 LE

100 °C

-40 °C

-

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

-

20

5.24

N

No

This product may require additional documentation to export from the United States.

1.575 V

1.425 V

1.5 V

SmartFusion

1.5000 V

-

-

-40 to 100 °C

Tray

A2F500

e0

-

-

-

Tin/Lead (Sn/Pb)

-

8542.39.00.01

-

-

CMOS

BOTTOM

BALL

225

1 mm

-

compliant

-

-

S-PBGA-B484

128

Not Qualified

-

1.5,1.8,2.5,3.3 V

INDUSTRIAL

1 mA

-

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

500000

1

-

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

-

512KB

-

23 mm

23 mm

In Stock

-

-

484-BFBGA, FCBGA

-

484-FCBGA (19x19)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Microchip Technology

-

-

-

-

-

-

-

MCU - 136, FPGA - 108

-

-

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C ~ 125°C (TJ)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

-

-

-

FPGA - 161K Logic Modules

-

-

-

-

-

128KB

-

-

-

In Stock

-

-

536-LFBGA

-

536-BGA (16x16)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Microchip Technology

-

-

-

-

-

-

-

MCU - 136, FPGA - 168

-

-

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C ~ 125°C (TJ)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

-

-

-

FPGA - 254K Logic Modules

-

-

-

-

-

128KB

-

-

-

5000

-

-

484-BGA

YES

484-FPBGA (23x23)

484

M2S005

-

-

-

-

-

-

64 kB

-

-

-

-

-

MICROSEMI CORP

-

-

Microsemi Corporation

M2S005-1FGG484I

166 MHz

-

-

Microchip Technology

-

-

-

3

-

SMD/SMT

MSL 3 - 168 hours

209

-

6060 LE

-

-

-

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

-

40

5.79

-

Yes

-

1.26 V

1.14 V

1.2 V

-

1.2000 V

-

-

-40 to 100 °C

-

SmartFusion®2

e1

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

8542.39.00.01

Field Programmable Gate Arrays

-

CMOS

BOTTOM

BALL

250

1 mm

-

compliant

-

-

S-PBGA-B484

209

Not Qualified

-

1.2 V

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

209

-

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

191Kbit

-

1

-

FPGA - 5K Logic Modules

-

6060

1 Core

-

-

128KB

-

23 mm

23 mm

M2S005-TQ144
M2S005-TQ144

Microchip

In Stock

-

-

144-LQFP

YES

144-TQFP (20x20)

144

-

-

-

-

-

-

-

-

-

-

-

-

-

MICROSEMI CORP

-

-

Microsemi Corporation

M2S005-TQ144

-

-

-

Microchip Technology

-

-

-

3

-

-

-

84

-

-

85 °C

-

-

Tray

PLASTIC/EPOXY

LFQFP

TQFP-144

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

Obsolete

-

30

5.85

-

No

-

1.26 V

1.14 V

1.2 V

-

-

-

-

0°C ~ 85°C (TJ)

-

SmartFusion®2

e0

-

-

-

Tin/Lead (Sn/Pb)

-

8542.39.00.01

Field Programmable Gate Arrays

-

CMOS

QUAD

GULL WING

240

0.5 mm

-

not_compliant

-

-

S-PQFP-G144

84

Not Qualified

-

1.2 V

OTHER

-

-

166MHz

64KB

ARM® Cortex®-M3

-

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

84

-

1.6 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

FPGA - 5K Logic Modules

-

6060

-

-

-

128KB

-

20 mm

20 mm

11
-

VFPBGA-256

YES

256-FPBGA (17x17)

256

M2S005

Microchip Technology / Atmel

-

-

-

-

-

64 kB

-

-

-

119

-

MICROSEMI CORP

-

-

Microchip

M2S005S-VFG256I

166 MHz

-

-

Microchip Technology

-

-

Yes

3

-

SMD/SMT

-

161

505 LAB

6060 LE

-

-

-

Tray

PLASTIC/EPOXY

LFBGA

VFBGA-256

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

-

40

2.4

Details

Yes

-

1.26 V

1.14 V

1.2 V

-

-

-

50 V

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

-

-

8.06

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

SOC - Systems on a Chip

0.125 W

CMOS

BOTTOM

BALL

250

0.8 mm

General Purpose

compliant

-

-

S-PBGA-B256

161

Not Qualified

-

1.2 V

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

161

-

1.56 mm

FIELD PROGRAMMABLE GATE ARRAY

SoC FPGA

-

-

-

1

FPGA - 5K Logic Modules

-

6060

1 Core

-

-

128KB

SoC FPGA

14 mm

14 mm

2176

-

-

FPBGA-484

YES

484-FPBGA (23x23)

484

A2F500

Microchip Technology / Atmel

-

-

-

80 MHz

-

64 kB

-

-

-

60

-

MICROSEMI CORP

-

-

Microchip

A2F500M3G-FGG484I

80 MHz

-

+ 100 C

Microchip Technology

-

- 40 C

Yes

3

-

SMD/SMT

-

204 I/O

-

6000 LE

100 °C

-40 °C

-

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

-

30

5.22

Details

Yes

-

1.575 V

1.425 V

1.5 V

SmartFusion

-

0.062696 oz

-

-40°C ~ 100°C (TJ)

Tray

A2F500

e1

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

8542.39.00.01

SOC - Systems on a Chip

-

CMOS

BOTTOM

BALL

250

1 mm

-

compliant

-

-

S-PBGA-B484

128

Not Qualified

1.5 V

1.5,1.8,2.5,3.3 V

INDUSTRIAL

16.5 mA

-

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

SoC FPGA

-

500000

STD

-

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

-

512KB

SoC FPGA

23 mm

23 mm

2946

-

-

484-BGA

YES

484-FPBGA (23x23)

484

A2F500

Microchip Technology / Atmel

-

-

-

100 MHz

-

64 kB

-

-

-

60

-

MICROSEMI CORP

-

-

Microchip

A2F500M3G-1FGG484

100 MHz

1.575 V

+ 85 C

Microchip Technology

1.425 V

0 C

Yes

3

-

SMD/SMT

-

MCU - 41, FPGA - 128

-

6000 LE

85 °C

-

-

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

-

40

1.36

Details

Yes

-

1.575 V

1.425 V

1.5 V

SmartFusion

1.5000 V

0.534969 oz

-

0 to 85 °C

Tray

SmartFusion®

e1

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

8542.39.00.01

SOC - Systems on a Chip

-

CMOS

BOTTOM

BALL

250

1 mm

-

compliant

-

-

S-PBGA-B484

128

Not Qualified

1.5 V

1.5,1.8,2.5,3.3 V

OTHER

16.5 mA

-

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

SoC FPGA

-

500000

1

-

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

-

512KB

SoC FPGA

23 mm

23 mm

39
-

484-BGA

-

484-FPBGA (23x23)

-

M2S010

-

-

-

-

-

-

64 kB

-

-

-

-

-

-

-

-

-

-

166 MHz

-

+ 85 C

Microchip Technology

-

0 C

-

-

-

SMD/SMT

-

233

-

12084 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C ~ 85°C (TJ)

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.2 V

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

-

STD

-

FPGA - 10K Logic Modules

-

-

1 Core

-

-

256KB

-

-

-

2771

-

-

FPBGA-484

YES

484-FPBGA (23x23)

484

A2F500

Microchip Technology / Atmel

-

-

40 MHz

80 MHz

-

64 kB

500000

500000

-

60

±2.8(20th) ppm/Year

MICROSEMI CORP

-

-

Microchip

A2F500M3G-FGG484

80 MHz

1.575 V

+ 85 C

Microchip Technology

1.425 V

0 C

Yes

3

Surface Mount

SMD/SMT

-

204 I/O

-

6000 LE

85 °C

-

40 MHz

Tray

PLASTIC/EPOXY

BGA

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

-

40

1.37

Details

Yes

This product may require additional documentation to export from the United States.

1.575 V

1.425 V

1.5 V

SmartFusion

1.5000 V

-

-

-20 to 70 °C

Tray

A2F500

e1

-

Temperature Compensated Crystal Oscillator (TCXO)

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

8542.39.00.01

SOC - Systems on a Chip

-

CMOS

BOTTOM

BALL

250

1 mm

-

compliant

4.6 ppm

10

S-PBGA-B484

128

Not Qualified

3.0000 V

1.5,1.8,2.5,3.3 V

OTHER

16.5 mA

10 pF

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

SoC FPGA

-

500000

STD

-

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

Clipped Sinewave

512KB

SoC FPGA

23 mm

23 mm

19

-

-

TQFP-144

YES

144-TQFP (20x20)

144

M2S010

Microchip Technology / Atmel

-

-

-

-

-

64 kB

-

-

400 kbit

60

-

MICROSEMI CORP

-

-

Cutler Hammer, Div of Eaton Co

DR1-40D8-05

166 MHz

1.26 V

+ 100 C

Microchip Technology

1.14 V

- 40 C

Yes

3

-

SMD/SMT

-

84 I/O

1007 LAB

12084 LE

-

-

-

Tray

PLASTIC/EPOXY

LFQFP

LFQFP,

-

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Active

Active

-

40

5.81

Details

Yes

-

1.26 V

1.14 V

1.2 V

-

1.2000 V

0.035380 oz

-

-40 to 100 °C

Tray

SmartFusion2

-

Yes

-

-

Pure Matte Tin (Sn)

-

8542.39.00.01

SOC - Systems on a Chip

-

-

QUAD

GULL WING

250

0.5 mm

-

compliant

-

-

S-PQFP-G144

-

-

1.2 V

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

1.6 mm

FIELD PROGRAMMABLE GATE ARRAY

SoC FPGA

-

-

STD

-

FPGA - 10K Logic Modules

-

-

1 Core

-

-

256KB

SoC FPGA

20 mm

20 mm

2823
  • 1:$122.298270
  • 10:$115.375726
  • 100:$108.845025
  • 500:$102.683985
  • View all price
-

400-LFBGA

-

400-VFBGA (17x17)

-

M2S050

-

2.5

Lower Mount

-

-

1/4 NPT

64 kB

-

-

-

-

-

-

-

-

NOSHOK

25-410-1500-psi/kg/cm2

166 MHz

-

-

Microchip Technology

-

-

-

-

-

SMD/SMT

-

207

-

56340 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

0-1,500 psi

-

-

-

-

-

-

-

-

-

1.2000 V

-

-

0 to 85 °C

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

-

STD

-

FPGA - 50K Logic Modules

-

-

1 Core

-

-

256KB

-

-

-