- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Case Size | Case Style | Center Frequency | Clock Frequency-Max | Connections | Data RAM Size | Device Logic Gates | Device System Gates | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Frequency Aging | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Output Frequency | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Range | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Type | Resistance | Terminal Finish | Additional Feature | HTS Code | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | Frequency Stability | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | Load Capacitance | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Total RAM Bits | Number of Gates | Speed Grade | Resistance Tolerance | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Output Level | Flash Size | Product Category | Length | Width |
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![]() MPFS160TLS-FCSG536I Microchip Technology | 2627 | - | - | BGA-536 | - | 536-LFBGA | - | - | - | - | - | - | - | - | - | - | - | - | 1 | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | - | SMD/SMT | - | 312 I/O | - | 161000 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 5 Core | - | - | 128kB | - | - | - | ||
![]() MPFS160T-FCSG536I Microchip Technology | 2853 | - | - | FCSG-536 | - | 536-LFBGA | - | - | - | - | - | - | - | - | - | - | - | - | 1 | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | - | SMD/SMT | - | 312 I/O | - | 161000 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 5 Core | - | - | 128kB | - | - | - | ||
![]() MPFS095TLS-FCVG484I Microchip Technology | 2374 | - | - | BGA-484 | - | 484-FCBGA (19x19) | - | - | - | - | - | - | - | - | - | - | - | - | 1 | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | - | SMD/SMT | - | 276 I/O | - | 93000 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | 5 Core | - | - | 128kB | - | - | - | ||
![]() MPFS160TS-1FCVG484I Microchip Technology | 2526 | - | - | BGA-484 | - | 484-FCBGA (19x19) | - | - | - | - | - | - | - | - | - | - | - | - | 1 | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | - | SMD/SMT | - | 312 I/O | - | 161000 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 5 Core | - | - | 128kB | - | - | - | ||
![]() MPFS250TL-FCG1152I Microchip Technology | 2182 | - | - | BGA-1152 | - | 1152-FCBGA (35x35) | - | - | - | - | - | - | - | - | - | - | - | - | 1 | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | - | SMD/SMT | - | 372 I/O | - | 254000 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | 5 Core | - | - | 128kB | - | - | - | ||
![]() A2F200M3F-FG484 Microchip Technology | 25 |
| - | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | A2F200 | - | - | - | - | 80 MHz | - | 64 kB | - | - | - | 60 | - | MICROSEMI CORP | - | - | - | A2F200M3F-FG484 | 80 MHz | - | + 85 C | Microchip Technology | - | 0 C | Yes | 3 | - | SMD/SMT | - | 161 I/O | - | 2000 LE | 85 °C | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | - | 30 | 5.24 | N | No | - | 1.575 V | 1.425 V | 1.5 V | SmartFusion | - | - | - | 0°C ~ 85°C (TJ) | Tray | A2F200 | e0 | - | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | - | - | CMOS | BOTTOM | BALL | 225 | 1 mm | - | compliant | - | - | S-PBGA-B484 | 94 | Not Qualified | - | 1.5,1.8,2.5,3.3 V | OTHER | 2 mA | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 94 | 4608 CLBS, 200000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 200000 | STD | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | - | 256KB | - | 23 mm | 23 mm | ||
![]() A2F200M3F-1FGG484I Microchip Technology | 25 |
| - | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | A2F200 | - | - | - | - | 100 MHz | - | 64 kB | - | - | - | 60 | - | MICROSEMI CORP | - | - | - | A2F200M3F-1FGG484I | 100 MHz | - | + 100 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | - | 161 I/O | - | 2000 LE | 100 °C | -40 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | - | 30 | 5.24 | Details | Yes | - | 1.575 V | 1.425 V | 1.5 V | SmartFusion | - | - | - | -40°C ~ 100°C (TJ) | Tray | A2F200 | e1 | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | - | CMOS | BOTTOM | BALL | 250 | 1 mm | - | compliant | - | - | S-PBGA-B484 | 94 | Not Qualified | - | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 1 mA | - | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 94 | 4608 CLBS, 200000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 200000 | - | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | - | 256KB | - | 23 mm | 23 mm | ||
![]() A2F500M3G-FG484I Microchip Technology | 2552 |
| - | FPBGA-484 | - | 484-FPBGA (23x23) | - | A2F500 | - | - | - | - | - | - | 64 kB | - | - | - | 60 | - | - | - | - | - | - | 80 MHz | - | + 100 C | Microchip Technology | - | - 40 C | Yes | - | - | SMD/SMT | - | 204 I/O | - | 6000 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion | - | - | - | -40°C ~ 100°C (TJ) | Tray | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2 mA | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | - | - | 500000 | STD | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 1 Core | - | - | 512KB | - | - | - | ||
![]() A2F500M3G-1FG484I Microchip Technology | 2257 |
| - | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | A2F500 | - | - | - | - | 100 MHz | - | 64 kB | - | - | - | 60 | - | MICROSEMI CORP | - | - | - | A2F500M3G-1FG484I | 100 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | - | SMD/SMT | - | 204 I/O | - | 6000 LE | 100 °C | -40 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | - | 20 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | - | - | -40 to 100 °C | Tray | A2F500 | e0 | - | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | - | - | CMOS | BOTTOM | BALL | 225 | 1 mm | - | compliant | - | - | S-PBGA-B484 | 128 | Not Qualified | - | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 1 mA | - | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 500000 | 1 | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | - | 512KB | - | 23 mm | 23 mm | ||
![]() MPFS160T-1FCVG484T2 Microchip | In Stock | - | - | 484-BFBGA, FCBGA | - | 484-FCBGA (19x19) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 136, FPGA - 108 | - | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | - | - | - | 128KB | - | - | - | ||
![]() MPFS250T-1FCSG536T2 Microchip | In Stock | - | - | 536-LFBGA | - | 536-BGA (16x16) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 136, FPGA - 168 | - | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | - | - | - | 128KB | - | - | - | ||
![]() M2S005-1FGG484I Microchip | 5000 | - | - | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S005 | - | - | - | - | - | - | 64 kB | - | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-1FGG484I | 166 MHz | - | - | Microchip Technology | - | - | - | 3 | - | SMD/SMT | MSL 3 - 168 hours | 209 | - | 6060 LE | - | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | - | 40 | 5.79 | - | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | - | -40 to 100 °C | - | SmartFusion®2 | e1 | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | Field Programmable Gate Arrays | - | CMOS | BOTTOM | BALL | 250 | 1 mm | - | compliant | - | - | S-PBGA-B484 | 209 | Not Qualified | - | 1.2 V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 209 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 191Kbit | - | 1 | - | FPGA - 5K Logic Modules | - | 6060 | 1 Core | - | - | 128KB | - | 23 mm | 23 mm | ||
![]() M2S005-TQ144 Microchip | In Stock | - | - | 144-LQFP | YES | 144-TQFP (20x20) | 144 | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-TQ144 | - | - | - | Microchip Technology | - | - | - | 3 | - | - | - | 84 | - | - | 85 °C | - | - | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | - | 30 | 5.85 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | e0 | - | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | Field Programmable Gate Arrays | - | CMOS | QUAD | GULL WING | 240 | 0.5 mm | - | not_compliant | - | - | S-PQFP-G144 | 84 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | - | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 5K Logic Modules | - | 6060 | - | - | - | 128KB | - | 20 mm | 20 mm | ||
![]() M2S005S-VFG256I Microchip | 11 |
| - | VFPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M2S005 | Microchip Technology / Atmel | - | - | - | - | - | 64 kB | - | - | - | 119 | - | MICROSEMI CORP | - | - | Microchip | M2S005S-VFG256I | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | - | SMD/SMT | - | 161 | 505 LAB | 6060 LE | - | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | - | 40 | 2.4 | Details | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 50 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | - | - | 8.06 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | SOC - Systems on a Chip | 0.125 W | CMOS | BOTTOM | BALL | 250 | 0.8 mm | General Purpose | compliant | - | - | S-PBGA-B256 | 161 | Not Qualified | - | 1.2 V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | - | - | - | 1 | FPGA - 5K Logic Modules | - | 6060 | 1 Core | - | - | 128KB | SoC FPGA | 14 mm | 14 mm | ||
![]() A2F500M3G-FGG484I Microchip | 2176 | - | - | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | A2F500 | Microchip Technology / Atmel | - | - | - | 80 MHz | - | 64 kB | - | - | - | 60 | - | MICROSEMI CORP | - | - | Microchip | A2F500M3G-FGG484I | 80 MHz | - | + 100 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | - | 204 I/O | - | 6000 LE | 100 °C | -40 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | - | 30 | 5.22 | Details | Yes | - | 1.575 V | 1.425 V | 1.5 V | SmartFusion | - | 0.062696 oz | - | -40°C ~ 100°C (TJ) | Tray | A2F500 | e1 | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | SOC - Systems on a Chip | - | CMOS | BOTTOM | BALL | 250 | 1 mm | - | compliant | - | - | S-PBGA-B484 | 128 | Not Qualified | 1.5 V | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 16.5 mA | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | - | 500000 | STD | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | - | 512KB | SoC FPGA | 23 mm | 23 mm | ||
![]() A2F500M3G-1FGG484 Microchip | 2946 | - | - | 484-BGA | YES | 484-FPBGA (23x23) | 484 | A2F500 | Microchip Technology / Atmel | - | - | - | 100 MHz | - | 64 kB | - | - | - | 60 | - | MICROSEMI CORP | - | - | Microchip | A2F500M3G-1FGG484 | 100 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | - | SMD/SMT | - | MCU - 41, FPGA - 128 | - | 6000 LE | 85 °C | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | - | 40 | 1.36 | Details | Yes | - | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | 0.534969 oz | - | 0 to 85 °C | Tray | SmartFusion® | e1 | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | SOC - Systems on a Chip | - | CMOS | BOTTOM | BALL | 250 | 1 mm | - | compliant | - | - | S-PBGA-B484 | 128 | Not Qualified | 1.5 V | 1.5,1.8,2.5,3.3 V | OTHER | 16.5 mA | - | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | - | 500000 | 1 | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | - | 512KB | SoC FPGA | 23 mm | 23 mm | ||
![]() M2S010T-FGG484 Microchip | 39 |
| - | 484-BGA | - | 484-FPBGA (23x23) | - | M2S010 | - | - | - | - | - | - | 64 kB | - | - | - | - | - | - | - | - | - | - | 166 MHz | - | + 85 C | Microchip Technology | - | 0 C | - | - | - | SMD/SMT | - | 233 | - | 12084 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | STD | - | FPGA - 10K Logic Modules | - | - | 1 Core | - | - | 256KB | - | - | - | ||
![]() A2F500M3G-FGG484 Microchip | 2771 | - | - | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | A2F500 | Microchip Technology / Atmel | - | - | 40 MHz | 80 MHz | - | 64 kB | 500000 | 500000 | - | 60 | ±2.8(20th) ppm/Year | MICROSEMI CORP | - | - | Microchip | A2F500M3G-FGG484 | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | Surface Mount | SMD/SMT | - | 204 I/O | - | 6000 LE | 85 °C | - | 40 MHz | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | - | 40 | 1.37 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | - | - | -20 to 70 °C | Tray | A2F500 | e1 | - | Temperature Compensated Crystal Oscillator (TCXO) | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | SOC - Systems on a Chip | - | CMOS | BOTTOM | BALL | 250 | 1 mm | - | compliant | 4.6 ppm | 10 | S-PBGA-B484 | 128 | Not Qualified | 3.0000 V | 1.5,1.8,2.5,3.3 V | OTHER | 16.5 mA | 10 pF | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | - | 500000 | STD | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | Clipped Sinewave | 512KB | SoC FPGA | 23 mm | 23 mm | ||
![]() M2S010-TQG144I Microchip | 19 | - | - | TQFP-144 | YES | 144-TQFP (20x20) | 144 | M2S010 | Microchip Technology / Atmel | - | - | - | - | - | 64 kB | - | - | 400 kbit | 60 | - | MICROSEMI CORP | - | - | Cutler Hammer, Div of Eaton Co | DR1-40D8-05 | 166 MHz | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | - | SMD/SMT | - | 84 I/O | 1007 LAB | 12084 LE | - | - | - | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | - | 40 | 5.81 | Details | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | 0.035380 oz | - | -40 to 100 °C | Tray | SmartFusion2 | - | Yes | - | - | Pure Matte Tin (Sn) | - | 8542.39.00.01 | SOC - Systems on a Chip | - | - | QUAD | GULL WING | 250 | 0.5 mm | - | compliant | - | - | S-PQFP-G144 | - | - | 1.2 V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | - | - | STD | - | FPGA - 10K Logic Modules | - | - | 1 Core | - | - | 256KB | SoC FPGA | 20 mm | 20 mm | ||
![]() M2S050T-VFG400 Microchip | 2823 |
| - | 400-LFBGA | - | 400-VFBGA (17x17) | - | M2S050 | - | 2.5 | Lower Mount | - | - | 1/4 NPT | 64 kB | - | - | - | - | - | - | - | - | NOSHOK | 25-410-1500-psi/kg/cm2 | 166 MHz | - | - | Microchip Technology | - | - | - | - | - | SMD/SMT | - | 207 | - | 56340 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | 0-1,500 psi | - | - | - | - | - | - | - | - | - | 1.2000 V | - | - | 0 to 85 °C | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | STD | - | FPGA - 50K Logic Modules | - | - | 1 Core | - | - | 256KB | - | - | - |