• 1:$215.263379
• 10:$203.078659
• 100:$191.583641
• 500:$180.739284
View all price

Production (Last Updated: 2 months ago)

400-LFBGA

YES

400-VFBGA (17x17)

400

M2S060

64 kB

-

90

-

MICROSEMI CORP

-

-

-

M2S060T-1VF400

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

-

207

4710 LAB

56520 LE

85 °C

Tray

PLASTIC/EPOXY

LFBGA

VFBGA-400

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

-

Active

30

5.88

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

SmartFusion2

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

-

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

Not Qualified

-

1.2 V

OTHER

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

FPGA - 60K Logic Modules

56520

1 Core

256KB

17 mm

17 mm

-

-

TQFP-100

-

-

-

-

-

EV06X38A

90

-

-

CAN, Ethernet, USB

-

-

-

120 MHz

-

+ 85 C

Microchip Technology

-

- 40 C

-

-

SMD/SMT

-

81 I/O

-

-

-

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

-

-

-

-

-

-

PIC32CX

Active

-

-

Details

-

-

3.63 V

1.71 V

-

-

-

-

Reel

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.71 V to 3.63 V

-

-

-

-

-

-

-

Flash

1 MB

-

-

-

-

-

- 40 C to + 85 C

-

-

32 Channel

-

-

-

-

-

-

-

-

TQFP-128

-

-

-

-

-

EV06X38A

1000

-

-

CAN, Ethernet, USB

-

-

-

120 MHz

-

+ 125 C

Microchip Technology

-

- 40 C

-

-

SMD/SMT

-

99 I/O

-

-

-

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

-

-

-

-

-

-

PIC32CX

Active

-

-

Details

-

-

3.63 V

1.71 V

-

-

-

-

Reel

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.71 V to 3.63 V

-

-

-

-

-

-

-

Flash

1 MB

-

-

-

-

-

- 40 C to + 125 C

-

-

32 Channel

-

-

-

-

-

-

• 1:$267.116065
• 10:$251.996288
• 100:$237.732347
• 500:$224.275799
View all price

-

536-LFBGA, CSPBGA

-

536-CSPBGA (16x16)

-

M2S150

64 kB

-

-

-

-

-

-

-

-

166 MHz

-

-

PEI-Genesis

-

-

-

-

-

-

293

-

146124 LE

-

Bulk

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

-

*

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

-

FPGA - 150K Logic Modules

-

1 Core

512KB

-

-

• 1:$37.203647
• 10:$35.097780
• 100:$33.111113
• 500:$31.236899
View all price

-

256-LBGA

-

256-FPBGA (17x17)

-

M2S005

-

-

-

-

-

-

-

-

-

-

-

-

Microchip Technology

-

-

-

-

-

MSL 3 - 168 hours

161

-

-

-

Tray

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

-

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

191Kbit

-

-

FPGA - 5K Logic Modules

-

-

128KB

-

-

-

-

TQFP-100

-

-

-

-

-

EV06X38A

90

-

-

CAN, Ethernet, USB

-

-

-

120 MHz

-

+ 125 C

Microchip Technology

-

- 40 C

-

-

SMD/SMT

-

81 I/O

-

-

-

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

-

-

-

-

-

-

PIC32CX

Active

-

-

Details

-

-

3.63 V

1.71 V

-

-

-

-

Reel

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.71 V to 3.63 V

-

-

-

-

-

-

-

Flash

1 MB

-

-

-

-

-

- 40 C to + 125 C

-

-

32 Channel

-

-

-

-

-

-

-

-

TQFP-100

-

-

-

-

-

EV06X38A

1000

-

-

CAN, Ethernet, USB

-

-

-

120 MHz

-

+ 125 C

Microchip Technology

-

- 40 C

-

-

SMD/SMT

-

81 I/O

-

-

-

Tray

-

-

-

-

-

-

-

PIC32CX

Active

-

-

Details

-

-

3.63 V

1.71 V

-

-

-

-

Tray

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.71 V to 3.63 V

-

-

-

-

-

-

-

Flash

1 MB

-

-

-

-

-

- 40 C to + 125 C

-

-

32 Channel

-

-

-

-

-

-

-

-

TQFP-128

-

-

-

-

-

EV06X38A

1000

-

-

CAN, Ethernet, USB

-

-

-

120 MHz

-

+ 85 C

Microchip Technology

-

- 40 C

-

-

SMD/SMT

-

99 I/O

-

-

-

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

-

-

-

-

-

-

PIC32CX

Active

-

-

Details

-

-

3.63 V

1.71 V

-

-

-

-

Reel

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.71 V to 3.63 V

-

-

-

-

-

-

-

Flash

1 MB

-

-

-

-

-

- 40 C to + 85 C

-

-

32 Channel

-

-

-

-

-

-

• 1:$367.956951
• 10:$347.129199
• 100:$327.480376
• 500:$308.943751
View all price

-

FPBGA-484

-

484-FPBGA (23x23)

-

M2S090

64 kB

-

60

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

SMD/SMT

-

267

7193 LAB

86316 LE

-

Tray

-

-

-

-

-

-

-

-

Active

-

-

N

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

1

-

FPGA - 90K Logic Modules

-

1 Core

512KB

-

-

• 1:$218.573880
• 10:$206.201774
• 100:$194.529975
• 500:$183.518844
View all price

Production (Last Updated: 2 months ago)

676-BGA

YES

676-FBGA (27x27)

676

M2S060

64 kB

-

40

-

MICROSEMI CORP

-

-

-

M2S060-1FG676

166 MHz

-

-

Microchip Technology

-

-

Yes

3

-

-

387

4710 LAB

56520 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-676

BGA676,26X26,40

SQUARE

GRID ARRAY

Active

-

Active

30

5.88

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

SmartFusion2

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

-

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

387

Not Qualified

-

1.2 V

OTHER

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

387

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

FPGA - 60K Logic Modules

56520

1 Core

256KB

27 mm

27 mm

• 1:$93.382736
• 10:$88.096921
• 100:$83.110303
• 500:$78.405946
View all price

Production (Last Updated: 2 months ago)

VFPBGA-256

-

256-FPBGA (17x17)

-

M2S025

64 kB

-

119

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

SMD/SMT

-

138

2308 LAB

27696 LE

-

Tray

-

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

-

FPGA - 25K Logic Modules

-

1 Core

256KB

-

-

• 1:$277.665816
• 10:$261.948883
• 100:$247.121588
• 500:$233.133573
View all price

-

FCBGA-325

YES

325-FCBGA (11x13.5)

325

M2S090

64 kB

-

176

1.2, 1.5, 1.8, 2.5, 3.3 V

MICROSEMI CORP

-

-

-

M2S090TS-FCSG325I

166 MHz

-

-

Microchip Technology

-

-

Yes

3

SMD/SMT

-

180

7193 LAB

86316 LE

-

Tray

PLASTIC/EPOXY

TFBGA

FBGA-325

BGA325,21X21,20

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

-

Active

40

5.8

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

R-PBGA-B325

180

Not Qualified

-

1.2 V

-

CAN/Ethernet/Serial

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

-

-

VFPBGA-256

YES

256-FPBGA (17x17)

256

M2S010

64 kB

-

119

-

MICROSEMI CORP

-

-

-

M2S010-1VFG256

166 MHz

-

-

Microchip Technology

-

-

Yes

3

SMD/SMT

-

138

1007 LAB

12084 LE

85 °C

Tray

PLASTIC/EPOXY

LFBGA

VFBGA-256

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

-

Active

40

5.77

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

-

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

Not Qualified

-

1.2 V

OTHER

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

1

-

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

• 1:$166.230467
• 10:$156.821195
• 100:$147.944524
• 500:$139.570306
View all price

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325-FCBGA (11x11)

325

M2S050

64 kB

-

176

-

MICROSEMI CORP

-

-

-

M2S050T-FCS325I

166 MHz

-

-

Microchip Technology

-

-

Yes

-

SMD/SMT

-

200

4695 LAB

56340 LE

-

Tray

PLASTIC/EPOXY

TFBGA

TFBGA, BGA325,21X21,20

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

-

Active

30

5.81

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

Not Qualified

-

1.2 V

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

• 1:$260.577188
• 10:$245.827536
• 100:$231.912770
• 500:$218.785632
View all price

Production (Last Updated: 2 months ago)

896-BGA

-

896-FBGA (31x31)

-

M2S050

64 kB

-

27

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

-

377

4695 LAB

56340 LE

-

Tray

-

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

-

FPGA - 50K Logic Modules

-

1 Core

256KB

-

-

• 1:$51.699670
• 10:$48.773274
• 100:$46.012522
• 500:$43.408040
View all price

-

FPBGA-484

-

484-FPBGA (23x23)

-

M2S005

64 kB

-

60

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

SMD/SMT

-

209

505 LAB

6060 LE

-

Tray

-

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

-

FPGA - 5K Logic Modules

-

1 Core

128KB

-

-

-

-

FPBGA-484

-

484-FPBGA (23x23)

-

M2S090

64 kB

-

60

-

-

-

-

-

-

166 MHz

1.26 V

-

Microchip Technology

1.14 V

-

Yes

-

SMD/SMT

-

267

7193 LAB

86316 LE

-

Tray

-

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

-

1.2 V

0 to 85 °C

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

1

-

FPGA - 90K Logic Modules

-

1 Core

512KB

-

-

• 1:$232.306512
• 10:$219.157087
• 100:$206.751969
• 500:$195.049027
View all price

-

484-BFBGA

YES

484-FBGA (19x19)

484

M2S150

64 kB

-

84

-

MICROSEMI CORP

-

-

-

M2S150-1FCVG484I

166 MHz

-

-

Microchip Technology

-

-

Yes

4

-

-

273

12177 LAB

146124 LE

-

Tray

PLASTIC/EPOXY

FBGA

VFBGA-484

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

Active

-

Active

40

5.77

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B484

273

Not Qualified

-

1.2 V

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

273

3.15 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

FPGA - 150K Logic Modules

146124

1 Core

512KB

19 mm

19 mm

• 1:$188.830184
• 10:$178.141683
• 100:$168.058192
• 500:$158.545464
View all price

-

VFPBGA-400

YES

400-VFBGA (17x17)

400

M2S050

64 kB

-

90

-

MICROSEMI CORP

-

-

-

M2S050T-VF400

166 MHz

-

-

Microchip Technology

-

-

Yes

-

SMD/SMT

-

207

4695 LAB

56340 LE

85 °C

Tray

PLASTIC/EPOXY

LFBGA

VFBGA-400

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

-

Active

30

5.3

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

-

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

Not Qualified

-

1.2 V

OTHER

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

STD

-

FPGA - 50K Logic Modules

48672

1 Core

256KB

17 mm

17 mm

• 1:$127.650951
• 10:$120.425426
• 100:$113.608892
• 500:$107.178200
View all price

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325-FCBGA (11x11)

325

M2S025

64 kB

-

176

-

MICROSEMI CORP

-

-

-

M2S025TS-1FCSG325I

166 MHz

-

-

Microchip Technology

-

-

Yes

3

SMD/SMT

-

180

2308 LAB

27696 LE

-

Tray

PLASTIC/EPOXY

TFBGA

FBGA-325

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

-

Active

40

5.81

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

-

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

180

Not Qualified

-

1.2 V

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm