- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Data RAM Size | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Screening Level | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Device Core | Length | Width |
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![]() M2S010-1TQG144 Microchip Technology | 2684 |
| - | - | TQFP-144 | YES | 144-TQFP (20x20) | 144 | M2S010 | 64 kB | - | - | 60 | 1.2, 1.5, 1.8, 2.5, 3.3 V | MICROSEMI CORP | RISC | CAN/Ethernet/Serial I2C/SPI/UART/USB | Yes | - | - | M2S010-1TQG144 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | Surface Mount | SMD/SMT | 1 | 84 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | TQFP | 1.26 V | 1.14 V | 1.2 V | - | - | 0.046530 oz | Commercial grade | 0 to 85 °C | Tray | SmartFusion2 | - | Pure Matte Tin (Sn) | - | 8542.39.00.01 | CMOS | QUAD | GULL WING | 250 | 0.5 mm | compliant | 144 | S-PQFP-G144 | 84 | Not Qualified | 0.95, 1.05 V | 1.2 V | OTHER | CAN/Ethernet/Serial | 166MHz | 64 KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | Commercial | - | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | ARM Cortex-M3 | 20 mm | 20 mm | ||
![]() M2S060TS-FCS325 Microchip Technology | 2054 |
| - | - | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | 64 kB | - | - | 176 | - | MICROSEMI CORP | - | - | - | - | - | M2S060TS-FCS325 | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | - | - | 200 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | - | 11 mm | 11 mm | ||
![]() M2S060-1VF400I Microchip Technology | 2566 |
| - | Production (Last Updated: 2 months ago) | 400-LFBGA | - | 400-VFBGA (17x17) | - | M2S060 | 64 kB | - | - | 90 | - | - | - | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | - | - | 207 | 4710 LAB | 56520 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | SmartFusion2 | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | - | ||
![]() M2S010-FG484 Microchip Technology | 5000 | - | - | - | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | 400 kbit | 64 kB | 60 | - | MICROSEMI CORP | - | - | - | - | - | M2S010-FG484 | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | - | SMD/SMT | - | 233 I/O | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.28 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | - | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | STD | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | - | 23 mm | 23 mm | ||
![]() M2S010T-VF400 Microchip Technology | 7 |
| - | - | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S010 | 64 kB | - | - | 90 | - | MICROSEMI CORP | - | - | - | - | - | M2S010T-VF400 | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | - | SMD/SMT | - | 195 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | - | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | S-PBGA-B400 | 160 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | STD | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | - | 17 mm | 17 mm | ||
![]() M2S010TS-1FGG484 Microchip Technology | 40 |
| - | Production (Last Updated: 1 month ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | - | - | 60 | - | MICROSEMI CORP | - | - | - | - | - | M2S010TS-1FGG484 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | - | SMD/SMT | - | 233 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | S-PBGA-B484 | 233 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | - | 23 mm | 23 mm | ||
![]() M2S005S-1VF256 Microchip Technology | 7 |
| - | - | VFPBGA-256 | - | 256-FPBGA (14x14) | - | M2S005 | 64 kB | - | - | 119 | - | - | - | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | SMD/SMT | - | 161 | 505 LAB | 6060 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 5K Logic Modules | - | 1 Core | 128KB | - | - | - | ||
![]() M2S010T-FG484 Microchip Technology | 23 |
| - | - | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | - | - | 60 | - | MICROSEMI CORP | - | - | - | - | - | M2S010T-FG484 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | - | SMD/SMT | - | 233 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | - | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | S-PBGA-B484 | 233 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | STD | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | - | 23 mm | 23 mm | ||
![]() M2S025-1FGG484I Microchip Technology | 2098 |
| - | - | FPBGA-484 | - | 484-FPBGA (23x23) | - | M2S025 | 64 kB | - | - | 60 | - | - | - | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | SMD/SMT | - | 267 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | - | ||
![]() M2S025TS-1VF256 Microchip Technology | 2602 |
| - | Production (Last Updated: 2 months ago) | VFPBGA-256 | - | 256-FPBGA (14x14) | - | M2S025 | 64 kB | - | - | 119 | - | - | - | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | SMD/SMT | - | 138 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | - | ||
![]() M2S050T-1FG484I Microchip Technology | 2974 |
| - | - | FPBGA-484 | - | 484-FPBGA (23x23) | - | M2S050 | 64 kB | - | - | 60 | - | - | - | - | - | - | - | - | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | - | SMD/SMT | - | 267 | 4695 LAB | 56340 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 1.2000 V | - | - | -40 to 100 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 50K Logic Modules | - | 1 Core | 256KB | - | - | - | ||
![]() MPFS250TLS-FCVG784I Microchip Technology | 2729 | - | - | - | BGA-784 | - | 784-FCBGA (23x23) | - | - | - | - | - | 1 | - | - | - | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | - | SMD/SMT | - | 372 I/O | - | 254000 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | 5 Core | 128kB | - | - | - | ||
![]() MPFS160TLS-FCVG784I Microchip Technology | 2822 | - | - | - | BGA-784 | - | 784-FCBGA (23x23) | - | - | - | - | - | 1 | - | - | - | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | - | SMD/SMT | - | 312 I/O | - | 161000 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | 5 Core | 128kB | - | - | - | ||
![]() MPFS160TS-1FCSG536I Microchip Technology | 2447 | - | - | - | BGA-536 | - | 536-LFBGA | - | - | - | - | - | 1 | - | - | - | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | - | - | SMD/SMT | - | 312 I/O | - | 161000 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | 5 Core | 128kB | - | - | - | ||
![]() MPFS095TS-1FCVG484I Microchip Technology | 2267 | - | - | - | BGA-484 | - | 484-FCBGA (19x19) | - | - | - | - | - | 1 | - | - | - | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | - | SMD/SMT | - | 276 I/O | - | 93000 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | 5 Core | 128kB | - | - | - | ||
![]() MPFS250TS-FCV784M Microchip | In Stock | - | - | - | 784-BFBGA, FCBGA | - | 784-FCBGA (23x23) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 136, FPGA - 372 | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | 128kB | - | - | - | ||
![]() MPFS160T-FCVG784T2 Microchip | In Stock | - | - | - | 784-BFBGA, FCBGA | - | 784-FCBGA (23x23) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 136, FPGA - 312 | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 128KB | - | - | - | ||
![]() MPFS160T-FCSG536T2 Microchip | In Stock | - | - | - | 536-LFBGA | - | 536-BGA (16x16) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 136, FPGA - 168 | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | 128KB | - | - | - | ||
![]() MPFS250T-FCVG784T2 Microchip | In Stock | - | - | - | 784-BFBGA, FCBGA | - | 784-FCBGA (23x23) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 136, FPGA - 372 | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | 128KB | - | - | - | ||
![]() A2F200M3F-FGG256 Microchip | In Stock | - | - | - | 256-LBGA | - | 256-FPBGA (17x17) | - | A2F200 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 25, FPGA - 66 | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | - | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | - | 256KB | - | - | - |