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Length

Width

M2S010-1TQG144
M2S010-1TQG144

Microchip Technology

2684
-

-

TQFP-144

YES

144-TQFP (20x20)

144

M2S010

64 kB

-

-

60

1.2, 1.5, 1.8, 2.5, 3.3 V

MICROSEMI CORP

RISC

CAN/Ethernet/Serial I2C/SPI/UART/USB

Yes

-

-

M2S010-1TQG144

166 MHz

-

-

Microchip Technology

-

-

Yes

3

Surface Mount

SMD/SMT

1

84

1007 LAB

12084 LE

85 °C

Tray

PLASTIC/EPOXY

LFQFP

TQFP-144

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Active

Active

40

5.81

Details

Yes

This product may require additional documentation to export from the United States.

TQFP

1.26 V

1.14 V

1.2 V

-

-

0.046530 oz

Commercial grade

0 to 85 °C

Tray

SmartFusion2

-

Pure Matte Tin (Sn)

-

8542.39.00.01

CMOS

QUAD

GULL WING

250

0.5 mm

compliant

144

S-PQFP-G144

84

Not Qualified

0.95, 1.05 V

1.2 V

OTHER

CAN/Ethernet/Serial

166MHz

64 KB

ARM® Cortex®-M3

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

32 Bit

84

1.6 mm

FIELD PROGRAMMABLE GATE ARRAY

Commercial

-

FPGA - 10K Logic Modules

12084

1 Core

256KB

ARM Cortex-M3

20 mm

20 mm

M2S060TS-FCS325
M2S060TS-FCS325

Microchip Technology

2054
  • 1:$128.118855
  • 10:$120.866844
  • 100:$114.025325
  • 500:$107.571061
  • View all price
-

-

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

M2S060

64 kB

-

-

176

-

MICROSEMI CORP

-

-

-

-

-

M2S060TS-FCS325

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

-

-

200

4710 LAB

56520 LE

85 °C

Tray

PLASTIC/EPOXY

TFBGA

TFBGA, BGA325,21X21,20

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

30

5.87

N

No

This product may require additional documentation to export from the United States.

-

1.26 V

1.14 V

1.2 V

SmartFusion2

-

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

-

S-PBGA-B325

200

Not Qualified

-

1.2 V

OTHER

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

200

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

FPGA - 60K Logic Modules

56520

1 Core

256KB

-

11 mm

11 mm

M2S060-1VF400I
M2S060-1VF400I

Microchip Technology

2566
  • 1:$222.433121
  • 10:$209.842567
  • 100:$197.964686
  • 500:$186.759138
  • View all price
-

Production (Last Updated: 2 months ago)

400-LFBGA

-

400-VFBGA (17x17)

-

M2S060

64 kB

-

-

90

-

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

-

-

207

4710 LAB

56520 LE

-

Tray

-

-

-

-

-

-

-

Active

-

-

N

-

This product may require additional documentation to export from the United States.

-

-

-

-

SmartFusion2

-

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 60K Logic Modules

-

1 Core

256KB

-

-

-

M2S010-FG484
M2S010-FG484

Microchip Technology

5000

-

-

-

BGA-484

YES

484-FPBGA (23x23)

484

M2S010

64 kB

400 kbit

64 kB

60

-

MICROSEMI CORP

-

-

-

-

-

M2S010-FG484

166 MHz

1.26 V

+ 85 C

Microchip Technology

1.14 V

0 C

Yes

3

-

SMD/SMT

-

233 I/O

1007 LAB

12084 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

30

5.28

N

No

This product may require additional documentation to export from the United States.

-

1.26 V

1.14 V

1.2 V

-

1.2000 V

-

-

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

-

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

-

S-PBGA-B484

233

Not Qualified

1.2 V

1.2 V

OTHER

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

233

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

STD

FPGA - 10K Logic Modules

9744

1 Core

256KB

-

23 mm

23 mm

M2S010T-VF400
M2S010T-VF400

Microchip Technology

7
-

-

VFPBGA-400

YES

400-VFBGA (17x17)

400

M2S010

64 kB

-

-

90

-

MICROSEMI CORP

-

-

-

-

-

M2S010T-VF400

166 MHz

1.26 V

-

Microchip Technology

1.14 V

-

Yes

-

-

SMD/SMT

-

195

1007 LAB

12084 LE

85 °C

Tray

PLASTIC/EPOXY

LFBGA

VFBGA-400

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

30

5.3

N

No

This product may require additional documentation to export from the United States.

-

1.26 V

1.14 V

1.2 V

-

1.2000 V

-

-

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

-

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

-

S-PBGA-B400

160

Not Qualified

-

1.2 V

OTHER

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

160

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

-

STD

FPGA - 10K Logic Modules

9744

1 Core

256KB

-

17 mm

17 mm

M2S010TS-1FGG484
M2S010TS-1FGG484

Microchip Technology

40
-

Production (Last Updated: 1 month ago)

FPBGA-484

YES

484-FPBGA (23x23)

484

M2S010

64 kB

-

-

60

-

MICROSEMI CORP

-

-

-

-

-

M2S010TS-1FGG484

166 MHz

-

-

Microchip Technology

-

-

Yes

3

-

SMD/SMT

-

233

1007 LAB

12084 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

40

5.81

Details

Yes

This product may require additional documentation to export from the United States.

-

1.26 V

1.14 V

1.2 V

-

-

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

-

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

-

S-PBGA-B484

233

Not Qualified

-

1.2 V

OTHER

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

233

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

1

FPGA - 10K Logic Modules

12084

1 Core

256KB

-

23 mm

23 mm

M2S005S-1VF256
M2S005S-1VF256

Microchip Technology

7
-

-

VFPBGA-256

-

256-FPBGA (14x14)

-

M2S005

64 kB

-

-

119

-

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

SMD/SMT

-

161

505 LAB

6060 LE

-

Tray

-

-

-

-

-

-

-

Active

-

-

N

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 5K Logic Modules

-

1 Core

128KB

-

-

-

M2S010T-FG484
M2S010T-FG484

Microchip Technology

23
-

-

FPBGA-484

YES

484-FPBGA (23x23)

484

M2S010

64 kB

-

-

60

-

MICROSEMI CORP

-

-

-

-

-

M2S010T-FG484

166 MHz

-

-

Microchip Technology

-

-

Yes

3

-

SMD/SMT

-

233

1007 LAB

12084 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

30

5.84

N

No

This product may require additional documentation to export from the United States.

-

1.26 V

1.14 V

1.2 V

-

1.2000 V

-

-

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

-

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

-

S-PBGA-B484

233

Not Qualified

-

1.2 V

OTHER

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

233

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

STD

FPGA - 10K Logic Modules

9744

1 Core

256KB

-

23 mm

23 mm

M2S025-1FGG484I
M2S025-1FGG484I

Microchip Technology

2098
  • 1:$158.272485
  • 10:$149.313665
  • 100:$140.861948
  • 500:$132.888630
  • View all price
-

-

FPBGA-484

-

484-FPBGA (23x23)

-

M2S025

64 kB

-

-

60

-

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

SMD/SMT

-

267

2308 LAB

27696 LE

-

Tray

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

1

FPGA - 25K Logic Modules

-

1 Core

256KB

-

-

-

M2S025TS-1VF256
M2S025TS-1VF256

Microchip Technology

2602
  • 1:$144.897698
  • 10:$136.695942
  • 100:$128.958435
  • 500:$121.658901
  • View all price
-

Production (Last Updated: 2 months ago)

VFPBGA-256

-

256-FPBGA (14x14)

-

M2S025

64 kB

-

-

119

-

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

SMD/SMT

-

138

2308 LAB

27696 LE

-

Tray

-

-

-

-

-

-

-

Active

-

-

N

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 25K Logic Modules

-

1 Core

256KB

-

-

-

M2S050T-1FG484I
M2S050T-1FG484I

Microchip Technology

2974
  • 1:$154.783860
  • 10:$146.022509
  • 100:$137.757084
  • 500:$129.959513
  • View all price
-

-

FPBGA-484

-

484-FPBGA (23x23)

-

M2S050

64 kB

-

-

60

-

-

-

-

-

-

-

-

166 MHz

1.26 V

-

Microchip Technology

1.14 V

-

Yes

-

-

SMD/SMT

-

267

4695 LAB

56340 LE

-

Tray

-

-

-

-

-

-

-

Active

-

-

N

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

1.2000 V

-

-

-40 to 100 °C

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

1

FPGA - 50K Logic Modules

-

1 Core

256KB

-

-

-

MPFS250TLS-FCVG784I
MPFS250TLS-FCVG784I

Microchip Technology

2729

-

-

-

BGA-784

-

784-FCBGA (23x23)

-

-

-

-

-

1

-

-

-

-

-

4 x 32 kB

16 kB, 4 x 32 kB

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

- 40 C

-

-

-

SMD/SMT

-

372 I/O

-

254000 LE

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

FPGA - 254K Logic Modules

-

5 Core

128kB

-

-

-

MPFS160TLS-FCVG784I
MPFS160TLS-FCVG784I

Microchip Technology

2822

-

-

-

BGA-784

-

784-FCBGA (23x23)

-

-

-

-

-

1

-

-

-

-

-

4 x 32 kB

16 kB, 4 x 32 kB

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

-

-

SMD/SMT

-

312 I/O

-

161000 LE

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

FPGA - 161K Logic Modules

-

5 Core

128kB

-

-

-

MPFS160TS-1FCSG536I
MPFS160TS-1FCSG536I

Microchip Technology

2447

-

-

-

BGA-536

-

536-LFBGA

-

-

-

-

-

1

-

-

-

-

-

4 x 32 kB

16 kB, 4 x 32 kB

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

-

-

SMD/SMT

-

312 I/O

-

161000 LE

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

FPGA - 161K Logic Modules

-

5 Core

128kB

-

-

-

MPFS095TS-1FCVG484I
MPFS095TS-1FCVG484I

Microchip Technology

2267

-

-

-

BGA-484

-

484-FCBGA (19x19)

-

-

-

-

-

1

-

-

-

-

-

4 x 32 kB

16 kB, 4 x 32 kB

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

- 40 C

-

-

-

SMD/SMT

-

276 I/O

-

93000 LE

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire®

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

FPGA - 93K Logic Modules

-

5 Core

128kB

-

-

-

In Stock

-

-

-

784-BFBGA, FCBGA

-

784-FCBGA (23x23)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Microchip Technology

-

-

-

-

-

-

-

MCU - 136, FPGA - 372

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

FPGA - 254K Logic Modules

-

-

128kB

-

-

-

In Stock

-

-

-

784-BFBGA, FCBGA

-

784-FCBGA (23x23)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Microchip Technology

-

-

-

-

-

-

-

MCU - 136, FPGA - 312

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C ~ 125°C (TJ)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

FPGA - 161K Logic Modules

-

-

128KB

-

-

-

In Stock

-

-

-

536-LFBGA

-

536-BGA (16x16)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Microchip Technology

-

-

-

-

-

-

-

MCU - 136, FPGA - 168

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C ~ 125°C (TJ)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

FPGA - 161K Logic Modules

-

-

128KB

-

-

-

In Stock

-

-

-

784-BFBGA, FCBGA

-

784-FCBGA (23x23)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Microchip Technology

-

-

-

-

-

-

-

MCU - 136, FPGA - 372

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C ~ 125°C (TJ)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

FPGA - 254K Logic Modules

-

-

128KB

-

-

-

In Stock

-

-

-

256-LBGA

-

256-FPBGA (17x17)

-

A2F200

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Microchip Technology

-

-

-

-

-

-

-

MCU - 25, FPGA - 66

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C ~ 85°C (TJ)

-

SmartFusion®

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

-

-

-

-

-

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

-

-

256KB

-

-

-