- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Data RAM Size | Data RAM Type | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | JESD-609 Code | Type | Terminal Finish | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Frequency | Operating Supply Voltage | Power Supplies | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Output Power | Data Rate | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Utilized IC / Part | Programmable Logic Type | Operating Temperature Range | Protocol | Power - Output | Speed Grade | RF Family/Standard | Antenna Type | Sensitivity | Number of ADC Channels | Primary Attributes | Serial Interfaces | Current - Receiving | Current - Transmitting | Number of Logic Cells | Number of Timers | Modulation | Number of Cores | Flash Size | Length | Width |
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![]() M2S060TS-1VFG784I Microchip | 2510 |
| - | - | 784-FBGA | - | 784-VFBGA (23x23) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | - | - | - | - | - | - | - | - | ||
![]() MPFS250TS-FC1152M Microchip | In Stock | - | - | - | 1152-BBGA, FCBGA | - | 1152-FCBGA (35x35) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | MCU - 136, FPGA - 372 | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | - | - | - | - | - | 128kB | - | - | ||
![]() MPFS250TL-FCVG484I Microchip | 2429 |
| - | - | 484-BFBGA, FCBGA | - | 484-FCBGA (19x19) | - | - | - | - | - | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - 40 C | - | SMD/SMT | MCU - 136, FPGA - 372 | 254000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C | - | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | - | - | - | - | 5 Core | 128kB | - | - | ||
![]() A2F200M3F-1FGG256 Microchip | In Stock | - | - | - | 256-LBGA | - | 256-FPBGA (17x17) | - | A2F200 | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | MCU - 25, FPGA - 66 | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | 1 | - | - | - | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | - | - | - | - | - | - | 256KB | - | - | ||
![]() A2F500M3G-PQG208I Microchip | In Stock | - | - | - | 208-BFQFP | - | 208-PQFP (28x28) | - | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | MCU - 22, FPGA - 66 | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | - | - | Ethernet, I²C, SPI, UART/USART | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | - | - | - | - | - | 512KB | - | - | ||
![]() MPFS095T-1FCSG325T2 Microchip | In Stock | - | - | - | 325-TFBGA | - | 325-BGA (11x11) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | MCU - 102, FPGA - 80 | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 857.6KB | RISC-V | DMA, PCI, PWM | - | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | - | - | - | - | - | 128KB | - | - | ||
![]() M2S060T-1VFG784I Microchip | 2030 |
| - | - | 784-FBGA | - | 784-VFBGA (23x23) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | - | - | - | - | - | - | - | - | ||
![]() A2F500M3G-FGG256 Microchip | 35 | - | - | - | 256-LBGA | - | 256-FPBGA (17x17) | - | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | MCU - 25, FPGA - 66 | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | STD | - | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | - | - | - | - | - | 512KB | - | - | ||
![]() MPFS460T-1FCG1152IPP Microchip | In Stock | - | - | - | 1152-BBGA, FCBGA | - | 1152-FCBGA (35x35) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | MCU - 136, FPGA - 468 | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C | - | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.95MB | RISC-V | DMA, PCI, PWM | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 461K Logic Modules | - | - | - | - | - | - | - | 128kB | - | - | ||
![]() M2S060TS-1VFG784 Microchip | 2565 |
| - | - | 784-FBGA | - | 784-VFBGA (23x23) | - | - | - | - | - | - | - | - | - | - | - | - | - | + 85 C | Microchip Technology | 0 C | - | PCB Mount | 395 | 56500 LE | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | - | - | - | - | - | 256KB | - | - | ||
![]() WBZ451PE-I Microchip Technology | 74 | - | - | Surface Mount | LGA-39 | - | - | - | - | 128 kB | SRAM | 1 | - | GPIO, I2C, QSPI, SPI, UART | - | - | - | - | 64 MHz | 2 Mb/s | + 85 C | Microchip Technology | - 40 C | - | SMD/SMT | 29 I/O | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | 40.6 mA | 96.7 mA | 3.6 V | 1.9 V | - | -40°C ~ 85°C | Tray | - | - | Bluetooth, Zigbee | - | - | - | - | 1.9V ~ 3.6V | - | - | - | - | - | 2.4GHz | - | - | - | 2.4 GHz | 1.9 V to 3.6 V | - | 1MB Flash | - | - | - | - | Flash | 1 MB | - | 12 dBm | 2Mbps | - | 32 bit | - | - | - | - | - 40 C to + 85 C | Bluetooth v5.2, Zigbee® | 12dBm | - | 802.15.4, Bluetooth | PCB Trace | -103dBm | 8 Channel | - | GPIO, HCI, I²C, IrDA, JTAG, PWM, SPI, UART, USART | - | - | - | 4 Timer | O-QPSK | - | - | - | - | ||
![]() M2S005S-1TQ144I Microchip | In Stock | - | - | - | 144-LQFP | YES | 144-TQFP (20x20) | 144 | - | - | - | - | MICROSEMI CORP | - | - | - | Microsemi Corporation | M2S005S-1TQ144I | - | - | - | Microchip Technology | - | 3 | - | 84 | - | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.88 | - | No | - | - | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | e0 | - | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | - | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | - | S-PQFP-G144 | 84 | Not Qualified | - | - | 1.2 V | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | - | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | - | 84 | 1.6 mm | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | FPGA - 5K Logic Modules | - | - | - | 6060 | - | - | - | 128KB | 20 mm | 20 mm | ||
![]() MPFS250TS-1FCSG536I Microchip | 510 |
| - | - | 536-LFBGA, CSPBGA | - | 536-LFBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | MCU - 136, FPGA - 372 | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C | - | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 254K Logic Modules | - | - | - | - | - | - | - | 128kB | - | - |