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Microchip Embedded - System On Chip (SoC)

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Approvals

Base Product Number

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Clock Frequency-Max

Contact Materials

Contact Sizes

Data RAM Size

Device Logic Gates

Device System Gates

Enclosure

Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

L1 Cache Data Memory

L1 Cache Instruction Memory

Lead Free Status / RoHS Status

Manufacturer

Manufacturer Part Number

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Maximum Operating Supply Voltage

Maximum Operating Temperature

Mfr

Minimum Operating Supply Voltage

Minimum Operating Temperature

Moisture Sensitive

Moisture Sensitivity Levels

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Mounting Styles

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Number of Logic Array Blocks - LABs

Number of Logic Elements

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Operating Temperature-Min

Outside Length

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Supply Voltage-Min

Supply Voltage-Nom

Tradename

Typical Operating Supply Voltage

Voltage Rating DC

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Packaging

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

ECCN Code

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Shell Size - Insert

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Termination Style

JESD-30 Code

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Qualification Status

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Housing Color

Operating Supply Voltage

Panel Cutout Dimensions

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Temperature Grade

Note

Voltage

Speed

RAM Size

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Core Processor

Number of Poles

Peripherals

Program Memory Size

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Architecture

Number of Inputs

Operating Force

Organization

Seated Height-Max

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Product Type

Includes

Contact Timing

Max Frequency

Index Stops

Circuit per Deck

Depth Behind Panel

Speed Grade

Number of Poles per Deck

Angle of Throw

Primary Attributes

Number of Bands

Number of CLBs

Number of Logic Cells

Number of Cores

Number of Equivalent Gates

Flash Size

Features

Product Category

IP Rating

Length

Width

Actuator Length

Material Flammability Rating

REACH SVHC

Flammability Rating

Lead Free

Ratings

A2F500M3G-FG256I
A2F500M3G-FG256I

Microchip

In Stock

-

-

-

-

-

256-LBGA

-

-

-

-

256-FPBGA (17x17)

-

-

-

-

-

A2F500

-

-

-

-

-

-

-

-

-

-

-

-

-

Continental Belt

11/5V2650

-

-

-

Microchip Technology

-

-

-

-

-

-

MCU - 25, FPGA - 66

-

-

-

-

265 Inches

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

-

SmartFusion®

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

80MHz

64KB

-

ARM® Cortex®-M3

-

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, SPI, UART/USART

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

STD

-

-

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11

-

-

-

-

512KB

-

-

-

-

-

-

-

-

-

-

-

A2F500M3G-PQG208
A2F500M3G-PQG208

Microchip

2725
-

-

-

-

208-BFQFP

-

-

-

-

208-PQFP (28x28)

-

-

-

-

-

A2F500

-

-

-

-

-

-

-

2XR8I+2XR8I

-

-

-

-

-

ABB

ACS880-17-1110A-5+B4+C+H-ABBI

-

-

-

Microchip Technology

-

-

-

-

Panel

-

MCU - 22, FPGA - 66

-

-

-

-

-

ACS8802XR8I+2XR8IIP42

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

0°C ~ 85°C (TJ)

-

SmartFusion®

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

80MHz

64KB

-

ARM® Cortex®-M3

-

DMA, POR, WDT

-

Ethernet, I²C, SPI, UART/USART

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

500 Hz

-

-

-

STD

-

-

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

-

-

-

-

-

512KB

-

-

IP42

-

-

-

-

-

-

-

-

M2S090TS-1FGG484M
M2S090TS-1FGG484M

Microchip

640

-

-

-

-

-

484-BGA

YES

-

-

-

484-FPBGA (23x23)

-

-

-

484

CUL, UL

M2S090

-

-

-

-

64 kB

-

-

-

-

MICROSEMI CORP

-

-

-

Cutler Hammer, Div of Eaton Co

DH361UGK

166 MHz

-

-

Microchip Technology

-

-

-

3

-

SMD/SMT

267

-

86316 LE

125 °C

-55 °C

-

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

40

5.8

-

Yes

-

1.26 V

1.14 V

1.2 V

-

-

-

-55°C ~ 125°C (TJ)

-

SmartFusion®2

e1

-

-

3A001.A.2.C

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

Metallic

-

-

8542.39.00.01

-

Field Programmable Gate Arrays

-

CMOS

BOTTOM

-

BALL

-

250

-

1 mm

compliant

30 A

-

-

-

-

S-PBGA-B484

267

Not Qualified

-

-

-

-

1.2 V

MILITARY

-

600 V

166MHz

64KB

-

ARM® Cortex®-M3

3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Heavy Duty

-

MCU, FPGA

267

-

-

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

FPGA - 90K Logic Modules

-

-

86316

1 Core

-

512KB

-

-

-

23 mm

23 mm

-

-

-

-

-

-

M2S060-FGG484
M2S060-FGG484

Microchip

2112
  • 1:$126.232549
  • 10:$119.087310
  • 100:$112.346519
  • 500:$105.987282
    • View all price
-

Production (Last Updated: 2 months ago)

-

-

484-BGA

-

-

-

-

484-FPBGA (23x23)

-

-

-

-

-

M2S060

Microchip Technology / Atmel

-

-

-

64 kB

-

-

-

60

-

-

-

-

Microchip

-

166 MHz

1.26 V

-

Microchip Technology

1.14 V

-

Yes

-

-

-

267

4710 LAB

56520 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

SmartFusion2

1.2 V

-

0 to 85 °C

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

SOC - Systems on a Chip

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

-

-

-

-

SoC FPGA

-

-

-

-

-

-

STD

-

-

FPGA - 60K Logic Modules

-

-

-

1 Core

-

256KB

-

SoC FPGA

-

-

-

-

-

-

-

-

-

A2F200M3F-CSG288I
A2F200M3F-CSG288I

Microchip

In Stock

-

-

-

External

-

288-TFBGA, CSPBGA

-

-

-

-

288-CSP (11x11)

ABS

ABS

-

-

-

A2F200

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Microchip Technology

-

-

-

-

-

-

MCU - 31, FPGA - 78

-

-

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Compliant

-

-

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

-

SmartFusion®

-

-

-

-

-

-

-

-

-

Grey

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

80MHz

64KB

-

ARM® Cortex®-M3

-

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, SPI, UART/USART

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

STD

-

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

-

-

-

-

-

256KB

-

-

-

-

80 mm

-

-

No SVHC

UL94 HB

-

IP65

A2F200M3F-CS288
A2F200M3F-CS288

Microchip

In Stock

-

-

-

-

-

288-TFBGA, CSPBGA

-

-

-

-

288-CSP (11x11)

-

-

-

-

-

A2F200

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Microchip Technology

-

-

-

-

-

-

MCU - 31, FPGA - 78

-

-

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

0°C ~ 85°C (TJ)

-

SmartFusion®

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

80MHz

64KB

-

ARM® Cortex®-M3

-

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, SPI, UART/USART

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

-

-

-

-

-

256KB

-

-

-

-

-

-

-

-

-

-

-

M2S005S-1TQG144T2
M2S005S-1TQG144T2

Microchip

In Stock

-

-

-

-

-

144-LQFP

-

-

-

-

144-TQFP (20x20)

-

-

-

-

-

M2S005

-

-

-

-

-

-

-

-

-

MICROSEMI CORP

-

-

-

Microsemi Corporation

M2S005S-1TQG144T2

-

-

-

Microchip Technology

-

-

-

3

-

-

213

-

-

-

-

-

Tray

-

-

-

-

-

-

Active

Active

40

5.79

-

Yes

-

-

-

-

-

-

-

0°C ~ 85°C (TJ)

-

SmartFusion®2

-

-

-

-

-

-

-

Pure Matte Tin (Sn)

-

-

-

-

-

-

-

-

-

-

-

-

250

-

-

compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

ARM® Cortex®-M3

-

-

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

-

-

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

FPGA - 5K Logic Modules

-

-

-

-

-

128KB

-

-

-

-

-

-

-

-

-

-

-

MPFS095TS-1FCSG536I
MPFS095TS-1FCSG536I

Microchip Technology

2358

-

-

-

-

-

BGA-536

-

-

-

-

536-LFBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

- 40 C

-

-

-

SMD/SMT

276 I/O

-

93000 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire®

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

-

857.6kB

-

RISC-V

-

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

MPU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 93K Logic Modules

-

-

-

5 Core

-

128kB

-

-

-

-

-

-

-

-

-

-

-

MPFS160TS-FCSG536I
MPFS160TS-FCSG536I

Microchip Technology

2643

-

-

-

-

-

BGA-536

-

-

-

-

536-LFBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

-

-

SMD/SMT

312 I/O

-

161000 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

-

1.4125MB

-

RISC-V

-

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

MPU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 161K Logic Modules

-

-

-

5 Core

-

128kB

-

-

-

-

-

-

-

-

-

-

-

MPFS160T-1FCVG784I
MPFS160T-1FCVG784I

Microchip Technology

2707

-

-

-

-

-

FCVG-784

-

-

-

-

784-FCBGA (23x23)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

-

-

SMD/SMT

312 I/O

-

161000 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

-

1.4125MB

-

RISC-V

-

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

MPU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 161K Logic Modules

-

-

-

5 Core

-

128kB

-

-

-

-

-

-

-

-

-

-

-

MPFS095T-FCSG325I
MPFS095T-FCSG325I

Microchip Technology

2319

-

-

-

-

-

FCSG-325

-

-

-

-

325-LFBGA (11x14.5)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

-

-

SMD/SMT

276 I/O

-

93000 LE

-

-

-

Bulk

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-40°C ~ 100°C

Tray

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

-

857.6kB

-

RISC-V

-

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

MPU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 93K Logic Modules

-

-

-

5 Core

-

128KB

-

-

-

-

-

-

-

-

-

-

-

MPFS250T-FCSG536I
MPFS250T-FCSG536I

Microchip Technology

2265

-

-

-

-

-

FCSG-536

-

-

-

-

536-LFBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

-

-

SMD/SMT

372 I/O

-

254000 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

-

2.2MB

-

RISC-V

-

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

-

-

MPU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 254K Logic Modules

-

-

-

5 Core

-

128kB

-

-

-

-

-

-

-

-

-

-

-

M2S005-1VF256
M2S005-1VF256

Microchip

11
-

-

-

Panel Mount

256-LFBGA

-

-

-

-

256-FPBGA (14x14)

-

-

-

-

-

M2S005

-

-

Silver Alloy

-

64 kB

-

-

-

-

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

-

-

-

SMD/SMT

161

-

6060 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

28V

0°C ~ 85°C (TJ)

-

44

-

Active

-

-

-

-

4

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1A (AC/DC)

-

-

--

Solder Lug

-

-

-

Flatted (6.35mm Dia)

-

-

--

-

-

-

-

166MHz

64KB

-

ARM® Cortex®-M3

-

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

--

MCU, FPGA

-

5.761 ~ 83gfm

-

-

-

-

-

Shorting (MBB)

-

Fixed

3P4T

--

-

3

30°

FPGA - 5K Logic Modules

-

-

-

1 Core

-

128KB

Shaft and Panel Sealed

-

-

-

-

11.10mm

-

-

-

-

-

A2F200M3F-1FGG256I
A2F200M3F-1FGG256I

Microchip

31

-

-

-

-

-

256-LBGA

YES

-

-

-

256-FPBGA (17x17)

-

-

-

256

-

A2F200

-

100 MHz

-

-

-

200000

200000

-

-

MICROSEMI CORP

-

-

-

ABB

ACH580-BCR-027A-6+E213+K465+L512

-

1.575 V

-

Microchip Technology

1.425 V

-

-

3

-

-

MCU - 25, FPGA - 66

-

-

100 °C

-40 °C

-

Tray

PLASTIC/EPOXY

LBGA

LBGA, BGA256,16X16,40

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

Active

Active

30

5.24

-

Yes

-

1.575 V

1.425 V

1.5 V

-

1.5000 V

-

-40 to 100 °C

-

SmartFusion®

e1

-

-

-

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

8542.39.00.01

-

Field Programmable Gate Arrays

-

CMOS

BOTTOM

-

BALL

-

250

-

1 mm

compliant

-

-

-

-

-

S-PBGA-B256

66

Not Qualified

-

-

-

-

1.5,1.8,2.5,3.3 V

INDUSTRIAL

-

-

100MHz

64KB

-

ARM® Cortex®-M3

-

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, SPI, UART/USART

-

-

MCU, FPGA

66

-

4608 CLBS, 200000 GATES

1.7 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

1

-

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

-

4608

4608

-

200000

256KB

-

-

-

17 mm

17 mm

-

-

-

-

-

-

A2F200M3F-1FG256I
A2F200M3F-1FG256I

Microchip

45

-

-

-

-

-

256-LBGA

-

-

-

-

256-FPBGA (17x17)

-

-

-

-

-

A2F200

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Microchip Technology

-

-

-

-

-

-

MCU - 25, FPGA - 66

-

-

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

-

SmartFusion®

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

100MHz

64KB

-

ARM® Cortex®-M3

-

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, SPI, UART/USART

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

-

-

-

-

-

256KB

-

-

-

-

-

-

-

-

-

-

-

MPF050-1VG400M
MPF050-1VG400M

Microchip

In Stock

-

-

-

-

Free Hanging (In-Line)

-

-

--

Circular

Aluminum Alloy

-

-

-

Plastic

-

-

-

-

-

-

22D

-

-

-

-

-

-

-

-

--

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-65°C ~ 175°C

Bulk

MIL-DTL-38999 Series I, DJT

-

Active

--

-

Plug Housing

For Female Sockets

128

-

-

-

-

-

Bayonet Lock

-

Crimp

-

-

N (Normal)

-

Shielded

-

Environment Resistant

-

-

-

Chromate over Cadmium

25-35

-

-

-

-

-

-

Olive Drab

-

-

-

-

Contacts Not Included

-

-

-

--

-

-

-

-

-

-

-

-

-

-

-

-

-

-

--

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Coupling Nut

-

-

-

-

-

--

-

-

-

-

M2S025-FCS325
M2S025-FCS325

Microchip Technology

7
-

Production (Last Updated: 2 months ago)

-

-

325-TFBGA, FCBGA

-

-

-

-

325-FCBGA (11x11)

-

-

-

-

-

M2S025

-

-

-

-

64 kB

-

-

-

176

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

-

180

2308 LAB

27696 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

N

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 25K Logic Modules

-

-

-

1 Core

-

256KB

-

-

-

-

-

-

-

-

-

-

-

M2S060T-FCS325
M2S060T-FCS325

Microchip Technology

2699
  • 1:$147.250313
  • 10:$138.915390
  • 100:$131.052254
  • 500:$123.634202
    • View all price
-

Production (Last Updated: 2 months ago)

-

-

325-TFBGA, FCBGA

YES

-

-

-

325-FCBGA (11x11)

-

-

-

325

-

M2S060

-

-

-

-

64 kB

-

-

-

176

MICROSEMI CORP

-

-

-

-

M2S060T-FCS325

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

-

200

4710 LAB

56520 LE

85 °C

-

-

Tray

PLASTIC/EPOXY

TFBGA

FBGA-325

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

30

5.87

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

SmartFusion2

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

-

-

-

-

-

-

Tin/Lead (Sn/Pb)

-

-

LG-MIN, WD-MIN

8542.39.00.01

-

-

-

CMOS

BOTTOM

-

BALL

-

240

-

0.5 mm

not_compliant

-

-

-

-

-

S-PBGA-B325

200

Not Qualified

-

-

-

-

1.2 V

OTHER

-

-

166MHz

64KB

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

200

-

-

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

FPGA - 60K Logic Modules

-

-

56520

1 Core

-

256KB

-

-

-

11 mm

11 mm

-

-

-

-

-

-

M2S150-FCSG536I
M2S150-FCSG536I

Microchip Technology

2298
  • 1:$231.067458
  • 10:$217.988168
  • 100:$205.649215
  • 500:$194.008693
    • View all price
-

-

-

-

536-LFBGA, CSPBGA

-

-

-

-

536-CSPBGA (16x16)

-

-

-

-

-

M2S150

-

-

-

-

64 kB

-

-

-

90

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

Yes

-

-

-

293

12177 LAB

146124 LE

-

-

-

Tray

-

-

-

-

-

-

-

Active

-

-

Details

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FPGA - 150K Logic Modules

-

-

-

1 Core

-

512KB

-

-

-

-

-

-

-

-

-

-

-

M2S050-1FCSG325I
M2S050-1FCSG325I

Microchip Technology

2285
  • 1:$171.767071
  • 10:$162.044407
  • 100:$152.872082
  • 500:$144.218945
    • View all price
-

Production (Last Updated: 2 months ago)

-

-

FCBGA-325

YES

-

-

-

325-FCBGA (11x11)

-

-

-

325

-

M2S050

-

-

-

-

64 kB

-

-

-

176

MICROSEMI CORP

-

-

-

-

M2S050-1FCSG325I

166 MHz

-

-

Microchip Technology

-

-

Yes

3

-

SMD/SMT

200

4695 LAB

56340 LE

-

-

-

Tray

PLASTIC/EPOXY

TFBGA

TFBGA, BGA325,21X21,20

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

40

5.76

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

-

1.2000 V

-

-40 to 100 °C

Tray

SmartFusion2

e1

-

-

3A991.D

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

LG-MIN, WD-MIN

8542.39.00.01

-

-

-

CMOS

BOTTOM

-

BALL

-

250

-

0.5 mm

compliant

-

-

-

-

-

S-PBGA-B325

200

Not Qualified

-

-

-

-

1.2 V

-

-

-

166MHz

64KB

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

200

-

-

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

1

-

-

FPGA - 50K Logic Modules

-

-

56340

1 Core

-

256KB

-

-

-

11 mm

11 mm

-

-

-

-

Lead Free

-

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