- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Power Supplies | Temperature Grade | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Core Architecture | Total RAM Bits | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S050T-1FG896 Microchip Technology | 2521 |
| - | - | FPBGA-896 | - | 896-FBGA (31x31) | - | M2S050 | 64 kB | 27 | - | - | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | - | SMD/SMT | - | 377 | 4695 LAB | 56340 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 896 | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 50K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S090-1FG676 Microchip Technology | 2828 |
| - | - | BGA-676 | YES | 676-FBGA (27x27) | 676 | M2S090 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S090-1FG676 | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | - | 425 | 7193 LAB | 86316 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | - | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | ||
M2S060TS-FGG676 Microchip Technology | 2156 |
| - | - | 676-BGA | - | 676-FBGA (27x27) | - | M2S060 | 64 kB | 40 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | - | 387 | 4710 LAB | 56520 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S150-FCVG484 Microchip Technology | 2367 |
| - | - | 484-BFBGA | - | 484-FBGA (19x19) | - | M2S150 | 64 kB | 84 | - | - | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | - | - | - | 273 | 12177 LAB | 146124 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | STD | FPGA - 150K Logic Modules | - | 1 Core | 512KB | - | - | ||
M2S025TS-1FCS325 Microchip Technology | 2821 |
| - | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2S025 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S025TS-1FCS325 | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | - | 180 | 2308 LAB | 27696 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.88 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | - | - | - | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | ||
M2S010TS-VF400I Microchip Technology | 23 |
| - | Production (Last Updated: 1 month ago) | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S010 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S010TS-VF400I | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | - | 195 | 1007 LAB | 12084 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.88 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | - | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 17 mm | 17 mm | ||
M2S090T-FG484 Microchip Technology | 2542 |
| - | - | 484-BGA | - | 484-FPBGA (23x23) | - | M2S090 | 64 kB | 60 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | - | 267 | 7193 LAB | 86316 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | STD | FPGA - 90K Logic Modules | - | 1 Core | 512KB | - | - | ||
M2S010TS-1FG484M Microchip Technology | 2761 |
| - | Production (Last Updated: 1 month ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S010TS-1FG484M | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | - | 233 | 1007 LAB | 12084 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.86 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | - | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | MILITARY | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | ||
M2S150T-1FCS536 Microchip Technology | 2174 |
| - | - | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S150T-1FCS536 | 166 MHz | - | Microchip Technology | - | Yes | - | - | - | 293 | 12177 LAB | 146124 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA536,30X30,20 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | - | not_compliant | - | - | - | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | - | - | ||
M2S010T-FGG484I Microchip Technology | 23 |
| - | - | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S010T-FGG484I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 3 | SMD/SMT | - | 233 | 1007 LAB | 12084 LE | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 2.32 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | - | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | ||
M2S005S-1VFG400 Microchip Technology | 7 |
| - | - | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S005 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S005S-1VFG400 | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | - | 171 | 505 LAB | 6060 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | - | - | S-PBGA-B400 | 171 | Not Qualified | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 171 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 17 mm | 17 mm | ||
M2S090-1FCSG325 Microchip Technology | 2971 |
| - | - | FCBGA-325 | YES | 325-FCBGA (11x13.5) | 325 | M2S090 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S090-1FCSG325 | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | - | 180 | 7193 LAB | 86316 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | - | - | - | R-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | ||
M2S010TS-1VFG400 Microchip Technology | 23 |
| - | Production (Last Updated: 1 month ago) | VFPBGA-400 | - | 400-VFBGA (17x17) | - | M2S010 | 64 kB | 90 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | - | 195 | 1007 LAB | 12084 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 10K Logic Modules | - | 1 Core | 256KB | - | - | ||
A2F500M3G-FG484M Microchip Technology | 570 |
| - | - | 484-BGA | - | 484-FPBGA (23x23) | - | A2F500 | 64 kB | 60 | - | - | - | - | 80 MHz | - | Microchip Technology | - | Yes | - | - | - | MCU - 41, FPGA - 128 | - | 6000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion | - | - | -55°C ~ 125°C (TJ) | Tray | A2F500 | - | - | - | 125 °C | -55 °C | - | - | - | - | - | - | - | - | 80 MHz | - | - | - | - | - | - | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | ARM | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | 1 Core | 512KB | - | - | ||
M2S005-VF400I Microchip Technology | 7 | - | - | - | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S005 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S005-VF400I | 166 MHz | - | Microchip Technology | - | Yes | - | - | - | 169 | 505 LAB | 6060 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | 0.356867 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | - | S-PBGA-B400 | 171 | Not Qualified | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 171 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 17 mm | 17 mm | ||
M2S005-1VFG256 Microchip Technology | 309 | - | - | - | VFPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M2S005 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S005-1VFG256 | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | MSL 3 - 168 hours | 161 | 505 LAB | 6060 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.79 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | - | - | S-PBGA-B256 | 161 | Not Qualified | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 191Kbit | - | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 14 mm | 14 mm | ||
M2S090TS-FCS325I Microchip Technology | 2489 |
| - | - | FCBGA-325 | - | 325-FCBGA (11x13.5) | - | M2S090 | 64 kB | 176 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | - | 180 | 7193 LAB | 86316 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 90K Logic Modules | - | 1 Core | 512KB | - | - | ||
M2S090T-1FGG484I Microchip Technology | 2201 | - | - | - | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S090 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S090T-1FGG484I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 3 | SMD/SMT | - | 267 | 7193 LAB | 86316 LE | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | - | 5.77 | Details | Yes | FPGA - Field Programmable Gate Array M2S090T-1FGG484I | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | 40 | - | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 1 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||
M2S050TS-1FGG896 Microchip Technology | 2737 |
| - | Production (Last Updated: 2 months ago) | FPBGA-896 | - | 896-FBGA (31x31) | - | M2S050 | 64 kB | 27 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | - | 377 | 4695 LAB | 56340 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 50K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S025-1FCS325I Microchip Technology | 2604 |
| - | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2S025 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S025-1FCS325I | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | - | 180 | 2308 LAB | 27696 LE | - | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | - | - | - | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm |