- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S010S-TQG144 Microchip Technology | 23 |
| - | - | TQFP-144 | - | 144-TQFP (20x20) | - | M2S010 | 64 kB | 400 kbit | 60 | - | - | - | - | 166 MHz | - | + 85 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | 84 I/O | 1007 LAB | 12084 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | STD | FPGA - 10K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S150TS-FCVG484I Microchip Technology | 850 |
| - | - | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | M2S150 | 64 kB | - | 84 | MICROSEMI CORP | - | - | M2S150TS-FCVG484I | 166 MHz | - | - | Microchip Technology | - | - | Yes | 4 | - | 273 | 12177 LAB | 146124 LE | - | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | - | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 40 | 5.82 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | - | S-PBGA-B484 | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 150K Logic Modules | - | 1 Core | 512KB | 19 mm | 19 mm | ||
M2S010-VF400I Microchip Technology | 40 |
| - | - | VFPBGA-400 | - | 400-VFBGA (17x17) | - | M2S010 | 64 kB | - | 90 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 195 | 1007 LAB | 12084 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 10K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S050TS-FCSG325 Microchip Technology | 2866 |
| - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | - | 325-FCBGA (11x11) | - | M2S050 | 64 kB | - | 176 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 200 | 4695 LAB | 56340 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 50K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S025T-VF400 Microchip Technology | 3000 |
| - | - | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S025 | 64 kB | - | 90 | MICROSEMI CORP | - | - | M2S025T-VF400 | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | - | 207 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.3 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | S-PBGA-B400 | 160 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 25K Logic Modules | 23988 | 1 Core | 256KB | 17 mm | 17 mm | ||
M2S010-VF256I Microchip Technology | 23 | - | - | - | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2S010 | 64 kB | - | 119 | MICROSEMI CORP | - | - | M2S010-VF256I | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 138 | 1007 LAB | 12084 LE | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA256,16X16,32 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | S-PBGA-B256 | 138 | Not Qualified | - | 1.2 V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | ||
M2S060-VFG400I Microchip Technology | 2206 | - | - | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S060 | 64 kB | - | 90 | MICROSEMI CORP | - | - | M2S060-VFG400I | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | - | 207 | 4710 LAB | 56520 LE | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 1.2000 V | - | -40 to 100 °C | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | - | S-PBGA-B400 | 207 | Not Qualified | - | 1.2 V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | ||
M2S050T-FCS325 Microchip Technology | 2530 |
| - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S050 | 64 kB | - | 176 | MICROSEMI CORP | - | - | M2S050T-FCS325 | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 200 | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | - | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | - | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | ||
M2S060TS-1VF400 Microchip Technology | 2067 |
| - | Production (Last Updated: 2 months ago) | 400-LFBGA | - | 400-VFBGA (17x17) | - | M2S060 | 64 kB | - | 90 | - | - | - | - | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | - | 207 | 4710 LAB | 56520 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | 1.2 V | - | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | 1 | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S010-VFG256 Microchip Technology | 264 |
| - | - | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S010 | 64 kB | - | 119 | MICROSEMI CORP | - | - | M2S010-VFG256 | 166 MHz | - | + 85 C | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 138 I/O | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | 0.406091 oz | 0 to 85 °C | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | - | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | ||
M2S005-VF400 Microchip Technology | 23 |
| - | - | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S005 | 64 kB | - | 90 | MICROSEMI CORP | - | - | M2S005-VF400 | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | - | 169 | 505 LAB | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.3 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | S-PBGA-B400 | 160 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 5K Logic Modules | 4956 | 1 Core | 128KB | 17 mm | 17 mm | ||
M2S060-FCS325 Microchip Technology | 2681 |
| - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | 64 kB | - | 176 | MICROSEMI CORP | - | - | M2S060-FCS325 | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 200 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | - | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | ||
M2S025-1FCSG325I Microchip Technology | 23 |
| - | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2S025 | 64 kB | - | 176 | MICROSEMI CORP | - | - | M2S025-1FCSG325I | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | 180 | 2308 LAB | 27696 LE | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | 8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/85 | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | - | - | S-PBGA-B325 | 180 | Not Qualified | - | 1.2 V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | ||
M2S005-1TQG144 Microchip Technology | 23 |
| - | - | TQFP-144 | - | 144-TQFP (20x20) | - | M2S005 | 64 kB | - | 60 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 84 | 505 LAB | 6060 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0.046530 oz | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 5K Logic Modules | - | 1 Core | 128KB | - | - | ||
M2S060T-FG484I Microchip Technology | 2593 |
| - | Production (Last Updated: 2 months ago) | 484-BGA | - | 484-FPBGA (23x23) | - | M2S060 | 64 kB | - | 60 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 267 | 4710 LAB | 56520 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S060T-1FGG484 Microchip Technology | 2912 |
| - | Production (Last Updated: 2 months ago) | 484-BGA | - | 484-FPBGA (23x23) | - | M2S060 | 64 kB | - | 60 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 267 | 4710 LAB | 56520 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S060TS-1VFG400 Microchip Technology | 2541 |
| - | - | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S060 | 64 kB | - | 90 | MICROSEMI CORP | - | - | M2S060TS-1VFG400 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | - | 207 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | - | 5.81 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | 40 | - | S-PBGA-B400 | 207 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | ||
M2S050-1FG896 Microchip Technology | 2303 |
| - | - | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | M2S050 | 64 kB | - | 27 | MICROSEMI CORP | - | - | M2S050-1FG896 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | 377 | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | 896 | S-PBGA-B896 | 377 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 50K Logic Modules | 48672 | 1 Core | 256KB | 31 mm | 31 mm | ||
M2S050TS-FGG484 Microchip Technology | 2526 |
| - | Production (Last Updated: 2 months ago) | 484-BGA | - | 484-FPBGA (23x23) | - | M2S050 | 64 kB | - | 60 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 267 | 4695 LAB | 56340 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 50K Logic Modules | - | 1 Core | 256KB | - | - | ||
M2S005S-FG484 Microchip Technology | 7 |
| - | - | 484-BGA | - | 484-FPBGA (23x23) | - | M2S005 | 64 kB | - | 60 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 209 | 505 LAB | 6060 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 5K Logic Modules | - | 1 Core | 128KB | - | - |