- Length
- JESD-609 Code
- Number of Functions
- Terminal Position
- Width
- Base Part Number
- Factory Lead Time
- Memory Format
- Memory Interface
- Memory Size
- Memory Types
- Moisture Sensitivity Level (MSL)
Attribute column
Manufacturer
Microchip Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer Part Number | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Usage Level | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Page Size | I2C Control Byte | Length | Width |
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 24C00T-I/STG Microchip | In Stock | - | - | - | YES | 8 | - | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24C00T-I/STG | 1 | 16 words | 16 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | SOIC | 40 | 5.15 | - | Yes | 5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 0.003 mA | 16X8 | - | 1.1 mm | 8 | 0.000001 A | 128 bit | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 4 ms | 200 | - | - | - | - | - | - | 1010XXXR | 4.4 mm | 3 mm | ||
25AA256-I/PG Microchip | In Stock | - | - | - | NO | 8 | - | 10 MHz | MICROCHIP TECHNOLOGY INC | 25AA256-I/PG | - | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, MS-001, DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Active | DIP | NOT SPECIFIED | 5.35 | - | Yes | 2.5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.005 mA | 32KX8 | - | 4.32 mm | 8 | 0.000001 A | 262144 bit | - | SERIAL | EEPROM | - | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | - | - | - | - | - | - | 9.46 mm | 7.62 mm | ||
25C320-I/PG Microchip | In Stock | - | - | - | NO | 8 | - | 3 MHz | MICROCHIP TECHNOLOGY INC | 25C320-I/PG | - | 4096 words | 4000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, DIP-8 | - | RECTANGULAR | IN-LINE | Not Recommended | DIP | NOT SPECIFIED | 5.5 | - | Yes | 5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | - | INDUSTRIAL | 4.5 V | SYNCHRONOUS | - | 4KX8 | - | 5.33 mm | 8 | - | 32768 bit | - | SERIAL | EEPROM | - | SPI | - | 5 ms | - | - | - | - | - | - | - | - | 9.27 mm | 7.62 mm | ||
24C00-I/SNG Microchip | In Stock | - | - | - | YES | 8 | - | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24C00-I/SNG | 1 | 16 words | 16 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | 40 | 5.13 | - | Yes | 5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 0.003 mA | 16X8 | - | 1.75 mm | 8 | 0.000001 A | 128 bit | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 4 ms | 200 | - | - | - | - | - | - | 1010XXXR | 4.9 mm | 3.9 mm | ||
24AA16-I/PG Microchip | In Stock | - | - | - | NO | 8 | - | 0.1 MHz | MICROCHIP TECHNOLOGY INC | 24AA16-I/PG | - | 2048 words | 2000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Active | DIP | NOT SPECIFIED | 5.22 | - | Yes | 2.5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.003 mA | 2KX8 | - | 4.32 mm | 8 | 0.000001 A | 16384 bit | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | - | - | - | - | - | 1010MMMR | 9.46 mm | 7.62 mm | ||
34VL02/MNY Microchip | In Stock | - | - | - | YES | 8 | - | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 34VL02/MNY | 1 | 256 words | 256 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | 40 | 5.41 | - | Yes | 2.5 V | - | e4 | Yes | EAR99 | NICKEL PALLADIUM GOLD | - | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 3.6 V | 1.8/3.3 V | OTHER | 1.5 V | SYNCHRONOUS | 0.003 mA | 256X8 | - | 0.8 mm | 8 | 0.000001 A | 2048 bit | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | - | - | - | - | - | 1010DDDR | 3 mm | 2 mm | ||
AT28BV256-25TI Microchip | In Stock | - | - | - | YES | 28 | 250 ns | - | ATMEL CORP | AT28BV256-25TI | 3 | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP28,.53,22 | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | 30 | 5.8 | - | No | 3 V | - | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | AUTOMATIC WRITE | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 0.55 mm | compliant | 28 | R-PDSO-G28 | Not Qualified | 3.6 V | 3/3.3 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.015 mA | 32KX8 | - | 1.2 mm | 8 | 0.00005 A | 262144 bit | - | PARALLEL | EEPROM | 3 V | - | 10000 Write/Erase Cycles | 10 ms | - | - | - | YES | YES | NO | 64 words | - | 11.8 mm | 8 mm | ||
AT28C64B-25JI Microchip | In Stock | - | - | - | YES | 32 | 250 ns | - | ATMEL CORP | AT28C64B-25JI | 2 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | 30 | 8.48 | - | No | 5 V | - | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | 100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE | 8542.32.00.51 | QUAD | J BEND | 225 | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.04 mA | 8KX8 | 3-STATE | 3.556 mm | 8 | 0.0001 A | 65536 bit | - | PARALLEL | EEPROM | 5 V | - | 100000 Write/Erase Cycles | 10 ms | 10 | - | - | YES | YES | NO | 64 words | - | 13.97 mm | 11.43 mm | ||
AT28LV010-25PI Microchip | In Stock | - | - | - | NO | 32 | 250 ns | - | ATMEL CORP | AT28LV010-25PI | 1 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | 30 | 5.27 | - | No | 3.3 V | - | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE | 8542.32.00.51 | DUAL | THROUGH-HOLE | 225 | 1 | 2.54 mm | compliant | 32 | R-PDIP-T32 | Not Qualified | 3.63 V | 3.3 V | INDUSTRIAL | 2.97 V | ASYNCHRONOUS | 0.015 mA | 128KX8 | 3-STATE | 4.826 mm | 8 | 0.00005 A | 1048576 bit | - | PARALLEL | EEPROM | 3 V | - | 100000 Write/Erase Cycles | 10 ms | 10 | - | - | YES | YES | NO | 128 words | - | 42.037 mm | 15.24 mm | ||
AT28LV010-25JI Microchip | In Stock | - | - | - | YES | 32 | 250 ns | - | ATMEL CORP | AT28LV010-25JI | 2 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | 30 | 5.45 | - | No | 3.3 V | - | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE | 8542.32.00.51 | QUAD | J BEND | 225 | 1 | 1.27 mm | compliant | 32 | R-PQCC-J32 | Not Qualified | 3.63 V | 3.3 V | INDUSTRIAL | 2.97 V | ASYNCHRONOUS | 0.015 mA | 128KX8 | 3-STATE | 3.556 mm | 8 | 0.00005 A | 1048576 bit | - | PARALLEL | EEPROM | 3 V | - | 100000 Write/Erase Cycles | 10 ms | 10 | - | - | YES | YES | NO | 128 words | - | 13.97 mm | 11.43 mm | ||
AT28C010E-20JC Microchip | In Stock | - | - | - | YES | 32 | 200 ns | - | ATMEL CORP | AT28C010E-20JC | 2 | 131072 words | 128000 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | 30 | 5.76 | - | No | 5 V | - | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | AUTOMATIC WRITE | 8542.32.00.51 | QUAD | J BEND | 225 | 1 | 1.27 mm | compliant | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | 5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.04 mA | 128KX8 | 3-STATE | 3.556 mm | 8 | 0.0002 A | 1048576 bit | - | PARALLEL | EEPROM | 5 V | - | 100000 Write/Erase Cycles | 10 ms | - | - | - | YES | YES | NO | 128 words | - | 13.97 mm | 11.43 mm | ||
93LC76CT-E/SNG15KVAO Microchip | In Stock | - | - | Production (Last Updated: 2 years ago) | YES | 8 | - | 3 MHz | MICROCHIP TECHNOLOGY INC | 93LC76CT-E/SNG15KVAO | - | 512 words | 512 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Active | - | - | 5.15 | Non-Compliant | - | 5 V | Automotive grade | - | - | - | - | - | - | DUAL | GULL WING | - | 1 | 1.27 mm | compliant | - | R-PDSO-G8 | - | 5.5 V | - | AUTOMOTIVE | 4.5 V | SYNCHRONOUS | - | 512X16 | - | 1.75 mm | 16 | - | 8192 bit | AEC-Q100; TS 16949 | SERIAL | EEPROM | - | MICROWIRE | - | 5 ms | - | - | 8 | - | - | - | - | - | 4.9 mm | 3.9 mm | ||
93AA46BT-I/STG Microchip | In Stock | - | - | - | YES | 8 | - | 1 MHz | MICROCHIP TECHNOLOGY INC | 93AA46BT-I/STG | 1 | 64 words | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | SOIC | 40 | 5.43 | - | Yes | 2.5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.002 mA | 64X16 | - | 1.2 mm | 16 | 0.000001 A | 1024 bit | - | SERIAL | EEPROM | - | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | - | - | - | - | - | - | 4.4 mm | 3 mm | ||
93AA66A-I/STG Microchip | In Stock | - | - | - | YES | 8 | - | 1 MHz | MICROCHIP TECHNOLOGY INC | 93AA66A-I/STG | 1 | 512 words | 512 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | SOIC | 40 | 5.26 | - | Yes | 2.5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.002 mA | 512X8 | - | 1.2 mm | 8 | 0.000001 A | 4096 bit | - | SERIAL | EEPROM | - | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | - | - | - | - | - | - | 4.4 mm | 3 mm | ||
93LC66C-I/STG Microchip | In Stock | - | - | - | YES | 8 | - | 3 MHz | MICROCHIP TECHNOLOGY INC | 93LC66C-I/STG | 1 | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | SOIC | 40 | 5.09 | - | Yes | 3 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | ALSO CONFIGURABLE AS 512 X 8 | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.002 mA | 256X16 | - | 1.2 mm | 16 | 0.000001 A | 4096 bit | - | SERIAL | EEPROM | - | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 8 | - | - | - | - | - | 4.4 mm | 3 mm | ||
AT24C512BU2-UU-T Microchip | In Stock | - | - | - | YES | 8 | - | 0.4 MHz | ATMEL CORP | AT24C512BU2-UU-T | - | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA8,2X4,30 | BGA8,2X4,30 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | - | 5.7 | - | Yes | 2.5 V | - | e4 | - | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | 8542.32.00.51 | BOTTOM | BALL | - | 1 | 0.75 mm | unknown | 8 | R-PBGA-B8 | Not Qualified | 3.6 V | 2/5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.003 mA | 64KX8 | - | 1 mm | 8 | 0.000001 A | 524288 bit | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE | - | - | - | - | - | 1010DDDR | 3.73 mm | 2.35 mm | ||
AT28C256E-20SI Microchip | In Stock | - | - | - | YES | 28 | 200 ns | - | ATMEL CORP | AT28C256E-20SI | 2 | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.4 | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 30 | 5.74 | - | No | 5 V | Military grade | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | AUTOMATIC WRITE | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | compliant | 28 | R-PDSO-G28 | Not Qualified | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 32KX8 | 3-STATE | 2.65 mm | 8 | 0.0002 A | 262144 bit | MIL-STD-883 | PARALLEL | EEPROM | 5 V | - | 100000 Write/Erase Cycles | 10 ms | - | - | - | YES | YES | NO | 64 words | - | 17.9 mm | 7.5 mm | ||
AT28C64B-25TI Microchip | In Stock | - | - | - | YES | 28 | 250 ns | - | ATMEL CORP | AT28C64B-25TI | 3 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP28,.53,22 | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | 30 | 8.69 | - | No | 5 V | - | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | 100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 0.55 mm | compliant | 28 | R-PDSO-G28 | Not Qualified | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.04 mA | 8KX8 | 3-STATE | 1.2 mm | 8 | 0.0001 A | 65536 bit | - | PARALLEL | EEPROM | 5 V | - | 100000 Write/Erase Cycles | 10 ms | 10 | - | - | YES | YES | NO | 64 words | - | 11.8 mm | 8 mm | ||
AT28C256-20SI Microchip | In Stock | - | - | - | YES | 28 | 200 ns | - | ATMEL CORP | AT28C256-20SI | 2 | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.4 | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 30 | 5.72 | - | No | 5 V | Military grade | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | AUTOMATIC WRITE | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | compliant | 28 | R-PDSO-G28 | Not Qualified | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 32KX8 | 3-STATE | 2.65 mm | 8 | 0.0002 A | 262144 bit | MIL-STD-883 | PARALLEL | EEPROM | 5 V | - | 10000 Write/Erase Cycles | 10 ms | - | - | - | YES | YES | NO | 64 words | - | 17.9 mm | 7.5 mm | ||
AT25256AU2-10UU-1.8 Microchip | In Stock | - | - | - | YES | 8 | - | 5 MHz | ATMEL CORP | AT25256AU2-10UU-1.8 | 1 | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA8,2X4,30 | BGA8,2X4,30 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 40 | 5.61 | - | Yes | 2.7 V | - | e1 | - | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | - | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.75 mm | unknown | 8 | R-PBGA-B8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.01 mA | 32KX8 | - | 1 mm | 8 | 0.000003 A | 262144 bit | - | SERIAL | EEPROM | - | SPI | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE/SOFTWARE | - | - | - | - | - | - | 3.73 mm | 2.35 mm |