- Length
- JESD-609 Code
- Number of Functions
- Terminal Position
- Width
- Base Part Number
- Factory Lead Time
- Memory Format
- Memory Interface
- Memory Size
- Memory Types
- Moisture Sensitivity Level (MSL)
Attribute column
Manufacturer
Microchip Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Contact Plating | Mounting Type | Package / Case | Surface Mount | Number of Pins | Housing Material | Number of Terminals | Access Time-Max | Base Product Number | Boardlocks | Brand | Cable Entry Angle | Clock Frequency-Max (fCLK) | Contact Materials | Data Retention | Dissipation Factor DF | Factory Pack QuantityFactory Pack Quantity | For Use With | Housing / Hood Size | Ihs Manufacturer | Insert / Contact Gender | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of Words | Number of Words Code | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part # Aliases | Part Life Cycle Code | Part Package Code | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Tradename | Unit Weight | Voltage Rated | Voltage Rating DC | Voltage, Rating | Wire Gauge Max | Wire Gauge Min | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | ECCN Code | Temperature Coefficient | Type | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Capacitance | Subcategory | Pitch | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | Termination Style | JESD-30 Code | Qualification Status | Operating Supply Voltage | Failure Rate | Lead Spacing | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Leakage Current | Ripple Current | Test Frequency | Number of Ports | Operating Mode | Lead Style | Accessory Type | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Thread Size | Address Bus Width | Product Type | Density | Standby Current-Max | ESR | Memory Density | Screening Level | Access Time (Max) | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Output Enable | Boot Block | I2C Control Byte | Product | Mounting Angle | Features | Supply Current | Product Category | IP Rating | Diameter | Height | Height Seated (Max) | Length | Width | Thickness (Max) | Radiation Hardening | Ratings |
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![]() 24AA128-I/PRVA Microchip Technology Inc | In Stock | - | Datasheet | - | - | - | NO | - | - | 8 | - | - | - | - | - | 0.4 MHz | - | - | - | - | - | - | MICROCHIP TECHNOLOGY INC | - | - | - | - | - | - | - | - | - | - | - | 16384 words | 16000 | - | - | - | - | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | DIP | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | - | RECTANGULAR | IN-LINE | - | - | Active | DIP | - | - | - | - | - | - | Yes | 2.5 V | - | - | - | - | - | - | - | - | - | - | - | - | e3 | Yes | EAR99 | - | - | - | MATTE TIN | - | - | - | 1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS | 8542.32.00.51 | - | - | - | - | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | compliant | - | - | - | 8 | - | R-PDIP-T8 | Not Qualified | - | - | - | 5.5 V | INDUSTRIAL | 1.7 V | - | - | - | - | - | SYNCHRONOUS | - | - | 0.003 mA | 16KX8 | - | 5.334 mm | 8 | - | - | - | - | - | - | 131072 bit | AEC-Q100 | - | SERIAL | - | EEPROM | - | I2C | - | 5 ms | 200 | HARDWARE | - | - | - | - | - | - | - | - | - | - | - | - | - | 9.271 mm | 7.62 mm | - | - | - | ||
![]() T14M1024A-15J TM Technology Inc | In Stock | - | Datasheet | - | - | - | YES | - | - | 32 | 15 ns | - | - | - | - | - | - | - | - | - | - | - | TM TECHNOLOGY INC | - | - | - | - | - | - | - | - | - | - | - | 131072 words | 128000 | - | - | - | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | SOJ | SOJ, SOJ32,.34 | SOJ32,.34 | RECTANGULAR | SMALL OUTLINE | - | - | Contact Manufacturer | - | - | - | - | - | - | - | - | 5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3A991.B.2.B | - | - | - | - | - | - | - | - | 8542.32.00.41 | - | - | - | - | DUAL | J BEND | - | 1 | 1.27 mm | unknown | - | - | - | - | - | R-PDSO-J32 | Not Qualified | - | - | - | 5.5 V | COMMERCIAL | 4.5 V | - | - | - | - | - | ASYNCHRONOUS | - | - | 0.1 mA | 128KX8 | 3-STATE | 3.556 mm | 8 | - | - | - | - | 0.005 A | - | 1048576 bit | - | - | PARALLEL | COMMON | STANDARD SRAM | - | - | - | - | - | - | 4.5 V | - | - | - | - | - | - | - | - | - | - | - | - | 20.904 mm | 7.62 mm | - | - | - | ||
![]() 93LC66BT-I/OT15KV07 Microchip Technology Inc | In Stock | - | Datasheet | - | - | - | YES | - | - | 6 | - | - | - | - | - | 2 MHz | - | - | - | - | - | - | MICROCHIP TECHNOLOGY INC | - | - | - | - | - | - | - | - | - | - | - | 256 words | 256 | - | - | - | - | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | LSSOP | SOT-23, 6 PIN | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | - | - | Active | - | - | - | - | - | - | - | Yes | 3 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | DUAL | GULL WING | - | 1 | 0.95 mm | compliant | - | - | - | - | - | R-PDSO-G6 | - | - | - | - | 5.5 V | - | 2.5 V | - | - | - | - | - | SYNCHRONOUS | - | - | 0.002 mA | 256X16 | 3-STATE | 1.45 mm | 16 | - | - | - | - | 0.000001 A | - | 4096 bit | TS 16949 | - | SERIAL | - | EEPROM | 3 V | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.9 mm | 1.55 mm | - | - | - | ||
![]() 24LC04BT-E/ST16KV08 Microchip Technology Inc | In Stock | - | Datasheet | - | - | - | YES | - | - | 8 | - | - | - | - | - | 0.4 MHz | - | - | - | - | - | - | MICROCHIP TECHNOLOGY INC | - | - | - | - | - | - | - | - | - | - | - | 512 words | 512 | - | - | - | - | - | - | - | 125 °C | -40 °C | - | PLASTIC/EPOXY | TSSOP | TSSOP-8 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - | Active | - | - | - | - | - | - | - | - | 5 V | - | - | - | - | - | - | - | - | - | - | - | - | e3 | - | EAR99 | - | - | - | Matte Tin (Sn) | - | - | - | - | 8542.32.00.51 | - | - | - | - | DUAL | GULL WING | NOT SPECIFIED | 2 | 0.65 mm | compliant | - | - | NOT SPECIFIED | - | - | R-PDSO-G8 | - | - | - | - | 5.5 V | AUTOMOTIVE | 2.5 V | - | - | - | - | 1 | SYNCHRONOUS | - | - | 0.003 mA | 512X8 | OPEN-DRAIN | 1.2 mm | 8 | - | - | - | - | 0.000005 A | - | 4096 bit | TS 16949 | - | SERIAL | - | EEPROM | 5 V | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | - | - | - | 1010XXMR | - | - | - | - | - | - | - | - | - | 4.4 mm | 3 mm | - | - | - | ||
![]() PDM41256SA25D Paradigm Technology Inc | In Stock | - | Datasheet | - | - | - | NO | - | - | 28 | 25 ns | - | - | - | - | - | - | - | - | - | - | - | PARADIGM TECHNOLOGY INC | - | - | - | - | - | - | - | - | - | - | - | 32768 words | 32000 | - | - | - | - | - | - | - | 70 °C | - | - | CERAMIC, GLASS-SEALED | DIP | DIP, DIP28,.3 | DIP28,.3 | RECTANGULAR | IN-LINE | - | - | Obsolete | - | - | - | - | - | - | - | No | 5 V | - | - | - | - | - | - | - | - | - | - | - | - | e0 | No | EAR99 | - | - | - | TIN LEAD | - | - | - | - | 8542.32.00.41 | - | - | - | - | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | unknown | - | - | - | - | - | R-GDIP-T28 | Not Qualified | - | - | - | 5.5 V | COMMERCIAL | 4.5 V | - | - | - | - | 1 | ASYNCHRONOUS | - | - | 0.15 mA | 32KX8 | 3-STATE | - | 8 | - | - | - | - | 0.01 A | - | 262144 bit | - | - | PARALLEL | COMMON | STANDARD SRAM | - | - | - | - | - | - | 4.5 V | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() PDM41024SA25SO Paradigm Technology Inc | In Stock | - | Datasheet | - | - | - | YES | - | - | 32 | 25 ns | - | - | - | - | - | - | - | - | - | - | - | PARADIGM TECHNOLOGY INC | - | - | - | - | - | - | - | - | - | - | - | 131072 words | 128000 | - | - | - | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | SOJ | - | SOJ32,.44 | RECTANGULAR | SMALL OUTLINE | - | - | Obsolete | - | - | - | - | - | - | - | No | 5 V | - | - | - | - | - | - | - | - | - | - | - | - | e0 | No | EAR99 | - | - | - | TIN LEAD | - | - | - | - | 8542.32.00.41 | - | - | - | - | DUAL | J BEND | - | 1 | 1.27 mm | unknown | - | - | - | - | - | R-PDSO-J32 | Not Qualified | - | - | - | 5.5 V | COMMERCIAL | 4.5 V | - | - | - | - | 1 | ASYNCHRONOUS | - | - | 0.145 mA | 128KX8 | 3-STATE | - | 8 | - | - | - | - | 0.01 A | - | 1048576 bit | - | - | PARALLEL | COMMON | STANDARD SRAM | - | - | - | - | - | - | 4.5 V | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() 24C32I/SM Microchip Technology Inc | In Stock | - | Datasheet | - | - | - | YES | - | - | 8 | - | - | - | - | - | 0.4 MHz | - | - | - | - | - | - | MICROCHIP TECHNOLOGY INC | - | - | - | - | - | - | - | - | - | - | - | 4096 words | 4000 | - | - | - | - | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | SOP | 0.207 INCH, EIAJ, PLASTIC, SOIC-8 | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | - | - | Obsolete | SOIC | - | - | - | - | - | - | No | 5 V | - | - | - | - | - | - | - | - | - | - | - | - | e0 | - | EAR99 | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | 8542.32.00.51 | - | - | - | - | DUAL | GULL WING | - | 1 | 1.27 mm | unknown | - | - | - | 8 | - | R-PDSO-G8 | Not Qualified | - | - | - | 5.5 V | INDUSTRIAL | 4.5 V | - | - | - | - | - | SYNCHRONOUS | - | - | 0.003 mA | 4KX8 | 3-STATE | 2.03 mm | 8 | - | - | - | - | 0.000005 A | - | 32768 bit | - | - | SERIAL | - | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | - | - | - | - | 1010DDDR | - | - | - | - | - | - | - | - | - | 5.28 mm | 5.2 mm | - | - | - | ||
![]() 24LC08BT-I/OT15KV02 Microchip Technology Inc | In Stock | - | Datasheet | - | - | - | YES | - | - | 5 | - | - | - | - | - | 0.4 MHz | - | - | - | - | - | - | MICROCHIP TECHNOLOGY INC | - | - | - | - | - | - | - | - | - | - | - | 1024 words | 1000 | - | - | - | - | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | LSSOP | SOT-23, 5 PIN | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | - | - | Active | - | - | - | - | - | - | - | Yes | 5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | DUAL | GULL WING | - | 1 | 0.95 mm | compliant | - | - | - | - | - | R-PDSO-G5 | - | - | - | - | 5.5 V | - | 2.5 V | - | - | - | - | - | SYNCHRONOUS | - | - | 0.003 mA | 1KX8 | - | 1.45 mm | 8 | - | - | - | - | 0.000001 A | - | 8192 bit | TS 16949 | - | SERIAL | - | EEPROM | 5 V | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | - | - | - | 1010XMMR | - | - | - | - | - | - | - | - | - | 2.9 mm | 1.55 mm | - | - | - | ||
![]() AT24C256U2-10UU-2.7 Microchip Technology Inc | In Stock | - | Datasheet | - | - | - | YES | - | - | 8 | - | - | - | - | - | 1 MHz | - | - | - | - | - | - | MICROCHIP TECHNOLOGY INC | - | - | - | - | - | - | - | - | 1 | - | - | 32768 words | 32000 | - | - | - | - | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | VFBGA | 2.35 X 3.73 MM, 0.75 MM PITCH, GREEN, DBGA-8 | BGA8,2X4,30 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | - | Obsolete | - | - | - | - | - | - | - | Yes | 3 V | - | - | - | - | - | - | - | - | - | - | - | - | e1 | - | EAR99 | - | - | - | TIN SILVER COPPER | - | - | - | - | 8542.32.00.51 | - | - | - | - | BOTTOM | BALL | - | 1 | 0.75 mm | compliant | - | - | - | - | - | R-PBGA-B8 | Not Qualified | - | - | - | 5.5 V | INDUSTRIAL | 2.7 V | - | - | - | - | - | SYNCHRONOUS | - | - | 0.003 mA | 32KX8 | - | 1 mm | 8 | - | - | - | - | 5e-7 A | - | 262144 bit | - | - | SERIAL | - | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 10 ms | 40 | HARDWARE | - | - | - | 10100DDR | - | - | - | - | - | - | - | - | - | 3.73 mm | 2.35 mm | - | - | - | ||
![]() T14L256A-12J TM Technology Inc | In Stock | - | Datasheet | - | - | - | YES | - | - | 28 | 12 ns | - | - | - | - | - | - | - | - | - | - | - | TM TECHNOLOGY INC | - | - | - | - | - | - | - | - | - | - | - | 32768 words | 32000 | - | - | - | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | SOJ | SOJ, SOJ28,.34 | SOJ28,.34 | RECTANGULAR | SMALL OUTLINE | - | - | Contact Manufacturer | - | - | - | - | - | - | - | No | 3.3 V | - | - | - | - | - | - | - | - | - | - | - | - | e0 | - | EAR99 | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | 8542.32.00.41 | - | - | - | - | DUAL | J BEND | - | - | 1.27 mm | unknown | - | - | - | - | - | R-PDSO-J28 | Not Qualified | - | - | - | - | COMMERCIAL | - | - | - | - | - | - | ASYNCHRONOUS | - | - | 0.09 mA | 32KX8 | 3-STATE | - | 8 | - | - | - | - | 0.002 A | - | 262144 bit | - | - | PARALLEL | COMMON | STANDARD SRAM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() AT24C256BY7-YH-T Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 40 | - | - | - | - | - | - | Serial (2-Wire) | - | - | - | - | - | - | - | Surface Mount | - | - | - | 5.5(V) | 1.8(V) | 2.5/3.3/5(V) | -40C to 85C | 85C | -40C | Industrial | - | - | - | - | - | - | - | - | - | UTSAP EP | - | - | - | - | Yes | No | - | - | - | - | - | - | - | - | - | - | - | - | - | Tape and Reel | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.4(MHz) | - | 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 32Kx8 | - | - | - | - | - | - | 262144(Bit) | - | - | - | - | 900(ns) | - | - | - | - | - | - | - | - | Yes | - | - | - | - | - | - | - | 3(mA) | - | - | - | - | - | - | - | - | - | - | ||
![]() WS512K32NV-17H1C Microchip | In Stock | - | - | - | - | - | NO | - | - | 66 | 17 ns | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | WS512K32NV-17H1C | - | - | - | - | - | - | - | 524288 words | 512000 | - | - | - | - | - | - | - | 70 °C | - | - | CERAMIC, METAL-SEALED COFIRED | PGA | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | - | SQUARE | GRID ARRAY | - | - | Active | PGA | - | - | - | NOT SPECIFIED | 5.15 | - | No | 3.3 V | - | - | - | - | - | - | - | - | - | - | - | - | e4 | No | 3A991.B.2.A | - | - | - | GOLD | - | - | - | USER CONFIGURABLE AS 2 X 512K X 16 OR 4 X 512K X 8 | 8542.32.00.41 | - | - | - | CMOS | PERPENDICULAR | PIN/PEG | NOT SPECIFIED | 1 | 2.54 mm | unknown | - | - | - | 66 | - | S-CPGA-P66 | Not Qualified | - | - | - | 3.6 V | COMMERCIAL | 3 V | - | - | - | - | - | ASYNCHRONOUS | - | - | - | 512KX32 | - | 4.6 mm | 32 | - | - | - | - | - | - | 16777216 bit | - | - | PARALLEL | - | SRAM MODULE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 27.3 mm | 27.3 mm | - | - | - | ||
![]() WMS512K8-20CM Microchip | In Stock | - | - | - | - | - | NO | - | - | 32 | 20 ns | - | - | - | - | - | - | - | - | - | - | - | WHITE MICROELECTRONICS | - | - | White Microelectronics | WMS512K8-20CM | - | - | - | - | - | - | - | 524288 words | 512000 | - | - | - | - | - | - | - | 125 °C | -55 °C | - | CERAMIC, METAL-SEALED COFIRED | - | 0.600 INCH, CERAMIC, DIP-32 | - | RECTANGULAR | IN-LINE | - | - | Transferred | - | - | - | - | - | 5.57 | - | - | 5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | BATTERY BACKUP | - | - | - | - | CMOS | DUAL | THROUGH-HOLE | - | 1 | - | unknown | - | - | - | - | - | R-CDIP-T32 | Not Qualified | - | - | - | 5.5 V | MILITARY | 4.5 V | - | - | - | - | 1 | ASYNCHRONOUS | - | - | - | 512KX8 | 3-STATE | - | 8 | - | - | - | - | - | - | 4194304 bit | - | - | PARALLEL | - | STANDARD SRAM | - | - | - | - | - | - | 2 V | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() WEDPZ512K72V-100BI Microchip | In Stock | - | - | - | - | - | YES | - | - | 152 | 5 ns | - | - | TE Connectivity / AMP | - | - | - | - | - | 1 | - | - | MERCURY SYSTEMS INC | - | - | TE Connectivity | WEDPZ512K72V-100BI | - | - | - | - | - | - | - | 524288 words | 512000 | - | - | - | - | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | 17 X 23 MM, PLASTIC, BGA-152 | - | RECTANGULAR | GRID ARRAY | - | - | Contact Manufacturer | - | - | - | - | NOT SPECIFIED | 5.63 | - | - | 3.3 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3A991.B.2.A | - | - | - | - | - | - | - | PIPELINED ARCHITECTURE | 8542.32.00.41 | - | - | - | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | - | unknown | - | - | - | - | - | R-PBGA-B152 | Not Qualified | - | - | - | 3.465 V | INDUSTRIAL | 3.135 V | - | - | - | - | - | SYNCHRONOUS | - | - | - | 512KX72 | - | - | 72 | - | - | - | - | - | - | 37748736 bit | - | - | PARALLEL | - | ZBT SRAM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | TE Connectivity | - | - | - | - | - | - | - | - | - | ||
![]() WF128K32-120G2UM5 Microchip | In Stock | - | - | - | - | - | - | - | Zinc | - | - | - | - | TE Connectivity / AMP | Top | - | - | - | - | 10 | Size 1 Inserts | 1 | - | - | - | TE Connectivity | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | HTS | - | - | - | - | - | - | - | Bulk | HDC | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Power Connectors | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | PG11 | - | Heavy Duty Power Connectors | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Hood | - | - | - | Heavy Duty Power Connectors | - | - | - | - | - | - | - | - | - | ||
![]() WF4M32-120G2TM5 Microchip | In Stock | - | - | - | - | - | - | 2 Pin | - | - | - | - | - | Cornell Dubilier - CDE | - | - | - | - | - | 100 | - | - | - | - | - | Cornell Dubilier | - | + 105 C | NOR | - | - 40 C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | EET-HC2D681HA EET-HC2D681BA | - | - | - | - | - | - | - | Details | - | - | - | 0.846575 oz | - | 200 VDC | - | - | - | - | Bulk | 381LQ | - | 20 % | - | - | - | - | High Ripple Snap Mount Capacitors | - | - | 125 °C | -55 °C | - | - | - | 680 uF | Capacitors | - | - | - | - | - | - | - | - | - | - | - | - | Snap In | - | - | 5 V | - | 10 mm | - | - | - | Parallel | - | 1.75 A | 120 Hz | - | - | - | - | - | - | - | - | - | - | 22 b | Electrolytic Capacitors | 128 Mb | - | 293 mOhms | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Aluminum Electrolytic Capacitors | - | - | - | Aluminum Electrolytic Capacitors - Snap In | - | 22 mm | - | - | 40 mm | - | - | No | - | ||
![]() WMS512K8-20DEC Microchip | In Stock | - | - | - | - | - | YES | - | - | 32 | 20 ns | - | - | - | - | - | - | - | - | - | - | - | WHITE MICROELECTRONICS | - | - | White Microelectronics | WMS512K8-20DEC | - | - | - | - | - | - | - | 524288 words | 512000 | - | - | - | - | - | - | - | 70 °C | - | - | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, SOJ-32 | - | RECTANGULAR | SMALL OUTLINE | - | - | Transferred | - | - | - | - | - | 5.57 | - | - | 5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | BATTERY BACKUP | - | - | - | - | CMOS | DUAL | J BEND | - | 1 | - | unknown | - | - | - | - | - | R-CDSO-J32 | Not Qualified | - | - | - | 5.5 V | COMMERCIAL | 4.5 V | - | - | - | - | 1 | ASYNCHRONOUS | - | - | - | 512KX8 | 3-STATE | - | 8 | - | - | - | - | - | - | 4194304 bit | - | - | PARALLEL | - | STANDARD SRAM | - | - | - | - | - | - | 2 V | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() USB2601-NU-02 Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | Glenair | - | - | - | - | - | - | - | - | - | - | - | Glenair | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Circular Connectors | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Circular MIL Spec Connector | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Circular MIL Spec Connector | - | - | - | - | - | - | - | - | - | ||
![]() WF1M32B-100G2TM3 Microchip | In Stock | - | - | - | - | - | YES | - | - | 68 | 100 ns | 055935 | - | - | - | - | - | - | - | - | - | - | WHITE MICROELECTRONICS | - | - | White Microelectronics | WF1M32B-100G2TM3 | - | - | Molex | - | - | - | - | 1048576 words | 1000000 | - | - | - | - | - | - | - | 125 °C | -55 °C | Bulk | CERAMIC, METAL-SEALED COFIRED | - | , | - | SQUARE | FLATPACK | - | - | Transferred | - | Active | - | - | - | 5.69 | - | - | 3.3 V | - | - | - | - | - | - | - | - | - | * | - | - | - | - | - | - | NOR TYPE | - | - | - | - | - | USER CONFIGURABLE 1M X 32; 1000000 ERASE/PROGRAM CYCLES; MINIMUM 20 YEARS DATA RETENTION | - | - | - | - | CMOS | QUAD | GULL WING | - | 1 | - | unknown | - | - | - | - | - | S-CQFP-G68 | Not Qualified | - | - | - | 3.6 V | MILITARY | 3 V | - | - | - | - | - | ASYNCHRONOUS | - | - | - | 1MX32 | 3-STATE | - | 32 | - | - | - | - | - | - | 33554432 bit | - | - | PARALLEL | - | FLASH MODULE | 3.3 V | - | - | - | 20 | - | - | - | BOTTOM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() WMF128K8-90DEM5 Microchip | In Stock | - | - | - | Surface Mount, MLCC | 0603 (1608 Metric) | YES | - | - | 32 | 90 ns | - | - | - | - | - | - | - | - | - | - | - | WHITE MICROELECTRONICS | - | - | White Microelectronics | WMF128K8-90DEM5 | - | - | Vishay Vitramon | - | - | - | - | 131072 words | 128000 | - | - | - | - | - | - | - | 125 °C | -55 °C | Tape & Reel (TR) | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, SOJ-32 | - | RECTANGULAR | SMALL OUTLINE | - | - | Transferred | - | Active | - | - | - | 5.66 | - | - | 5 V | - | - | 25V | - | - | - | - | -55°C ~ 150°C | - | GA | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±5% | - | - | - | X7R | NOR TYPE | - | - | - | - | Automotive | - | - | 0.033 µF | - | - | CMOS | DUAL | J BEND | - | 1 | - | unknown | - | - | - | - | - | R-CDSO-J32 | Not Qualified | - | - | - | 5.5 V | MILITARY | 4.5 V | - | - | - | - | - | ASYNCHRONOUS | - | - | - | 128KX8 | 3-STATE | - | 8 | - | - | - | - | - | - | 1048576 bit | - | - | PARALLEL | - | FLASH | 5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.038 (0.97mm) | - | AEC-Q200 |