- Length
- JESD-609 Code
- Number of Functions
- Terminal Position
- Width
- Base Part Number
- Factory Lead Time
- Memory Format
- Memory Interface
- Memory Size
- Memory Types
- Moisture Sensitivity Level (MSL)
Attribute column
Manufacturer
Microchip Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer Part Number | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Usage Level | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Mode | Supply Current-Max | Access Time | Organization | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Max Frequency | Screening Level | Parallel/Serial | Memory IC Type | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | I2C Control Byte | Reverse Pinout | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 24VL024/MNY Microchip Technology | In Stock | - | - | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24VL024/MNY | 1 | 256 words | 256 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | 40 | 5.41 | - | Yes | 1.8 V | - | e4 | Yes | EAR99 | NICKEL PALLADIUM GOLD | - | - | - | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 3.6 V | 1.8/3.3 V | OTHER | 1.5 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 256X8 | 0.8 mm | 8 | 0.000001 A | 2048 bit | - | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | - | 3 mm | 2 mm | ||
24CW640T-I/MU Microchip | In Stock | - | - | YES | 8 | 1 MHz | MICROCHIP TECHNOLOGY INC | 24CW640T-I/MU | - | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | UDFN-8 | - | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | - | - | 5.6 | - | - | 1.8 V | Automotive grade | - | - | - | - | - | - | - | - | DUAL | NO LEAD | - | 1 | 0.5 mm | compliant | - | R-PDSO-N8 | - | 5.5 V | - | INDUSTRIAL | 1.6 V | - | - | - | - | SYNCHRONOUS | - | - | 8KX8 | 0.55 mm | 8 | - | 65536 bit | - | TS 16949 | SERIAL | EEPROM | SPI | - | 5 ms | - | - | - | - | 3 mm | 2 mm | ||
24LC02B-E/MNY Microchip | In Stock | - | - | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24LC02B-E/MNY | 1 | 256 words | 256 | 125 °C | -40 °C | PLASTIC/EPOXY | HVSSOP | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | Active | DFN | 40 | 5.38 | Compliant | Yes | 5 V | - | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 256X8 | 0.8 mm | 8 | 0.000005 A | 2048 bit | - | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XXXR | - | 3 mm | 2 mm | ||
25LC160B-I/MSG Microchip | In Stock | - | - | YES | 8 | 10 MHz | MICROCHIP TECHNOLOGY INC | 25LC160B-I/MSG | 1 | 2048 words | 2000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 3 X 3 MM, PLASTIC, MSOP-8 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Not Recommended | MSOP | 40 | 5.25 | - | Yes | 5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | - | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | - | - | - | - | SYNCHRONOUS | 0.006 mA | - | 2KX8 | 1.1 mm | 8 | 0.000005 A | 16384 bit | - | - | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | - | - | 3 mm | 3 mm | ||
24LC04BT-E/MSG Microchip | In Stock | - | - | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24LC04BT-E/MSG | 1 | 512 words | 512 | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.19 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | MSOP | 40 | 5.18 | Compliant | Yes | - | - | e3 | Yes | EAR99 | Matte Tin (Sn) | 125 °C | -40 °C | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | I2C | 5.5 V | 2.5 V | 512 B | SYNCHRONOUS | 0.003 mA | 900 ns | 512X8 | 1.1 mm | 8 | 0.000005 A | 4096 bit | 400 kHz | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XXMR | NO | 3 mm | 3 mm | ||
24AA01T-I/MSG Microchip | In Stock | - | - | YES | 8 | 0.1 MHz | MICROCHIP TECHNOLOGY INC | 24AA01T-I/MSG | 1 | 128 words | 128 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.19 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | MSOP | 40 | 5.33 | - | Yes | - | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | - | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 128X8 | 1.1 mm | 8 | 0.000001 A | 1024 bit | - | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XXXR | NO | 3 mm | 3 mm | ||
25AA080B-I/PG Microchip | In Stock | - | - | NO | 8 | 10 MHz | MICROCHIP TECHNOLOGY INC | 25AA080B-I/PG | - | 1024 words | 1000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Not Recommended | DIP | NOT SPECIFIED | 5.38 | - | Yes | 2.5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | - | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | - | - | - | - | SYNCHRONOUS | 0.006 mA | - | 1KX8 | 5.33 mm | 8 | 0.000001 A | 8192 bit | - | - | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | - | - | 9.271 mm | 7.62 mm | ||
24AA00T-I/SNG Microchip | In Stock | - | - | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24AA00T-I/SNG | 1 | 16 words | 16 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | 40 | 5.47 | - | Yes | 2.5 V | - | e3 | Yes | - | Matte Tin (Sn) | - | - | - | - | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 16X8 | 1.75 mm | 8 | 0.000001 A | 128 bit | - | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 4 ms | 200 | - | 1010XXXR | - | 4.9 mm | 3.9 mm | ||
25LC080B-I/PG Microchip | In Stock | - | - | NO | 8 | 10 MHz | MICROCHIP TECHNOLOGY INC | 25LC080B-I/PG | - | 1024 words | 1000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Not Recommended | DIP | NOT SPECIFIED | 5.37 | - | Yes | 5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | - | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | - | - | - | - | SYNCHRONOUS | 0.006 mA | - | 1KX8 | 5.33 mm | 8 | 0.000001 A | 8192 bit | - | - | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | - | - | 9.271 mm | 7.62 mm | ||
24AA52T-I/MSG Microchip | In Stock | - | - | YES | 8 | - | MICROCHIP TECHNOLOGY INC | 24AA52T-I/MSG | - | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | - | TSSOP8,.19 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | - | - | 5.52 | - | Yes | - | - | e3 | - | - | Matte Tin (Sn) | - | - | - | - | DUAL | GULL WING | - | - | 0.635 mm | compliant | - | R-PDSO-G8 | Not Qualified | - | 2/5 V | INDUSTRIAL | - | - | - | - | - | - | 0.003 mA | - | 256X8 | - | 8 | 0.000001 A | 2048 bit | - | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | - | 200 | HARDWARE/SOFTWARE | 1010DDDR | - | - | - | ||
24AA64T-I/SMG Microchip | In Stock | - | - | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24AA64T-I/SMG | 1 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.3 | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | 40 | 5.2 | - | Yes | 2.5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | - | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 8KX8 | 2.03 mm | 8 | 0.000001 A | 65536 bit | - | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | - | 5.245 mm | 5.23 mm | ||
25LC080B-E/PG Microchip | In Stock | - | - | NO | 8 | 10 MHz | MICROCHIP TECHNOLOGY INC | 25LC080B-E/PG | - | 1024 words | 1000 | 125 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Not Recommended | DIP | NOT SPECIFIED | 5.37 | - | Yes | 5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | - | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | - | - | - | - | SYNCHRONOUS | 0.006 mA | - | 1KX8 | 5.33 mm | 8 | 0.000005 A | 8192 bit | - | - | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | - | - | 9.271 mm | 7.62 mm | ||
24LCS52-I/PG Microchip | In Stock | - | - | NO | 8 | - | MICROCHIP TECHNOLOGY INC | 24LCS52-I/PG | - | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | - | DIP8,.3 | RECTANGULAR | IN-LINE | Active | - | - | 5.47 | - | Yes | - | - | e3 | - | - | Matte Tin (Sn) | - | - | - | - | DUAL | THROUGH-HOLE | - | - | 2.54 mm | compliant | - | R-PDIP-T8 | Not Qualified | - | 2.5/5 V | INDUSTRIAL | - | - | - | - | - | - | 0.003 mA | - | 256X8 | - | 8 | 0.000001 A | 2048 bit | - | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | - | 200 | HARDWARE/SOFTWARE | 1010DDDR | - | - | - | ||
24C02C-I/MSG Microchip | In Stock | - | - | YES | 8 | - | MICROCHIP TECHNOLOGY INC | 24C02C-I/MSG | - | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | - | TSSOP8,.19 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | - | - | 5.32 | - | Yes | 5 V | - | e3 | Yes | - | Matte Tin (Sn) | - | - | - | - | DUAL | GULL WING | - | - | 0.635 mm | compliant | - | R-PDSO-G8 | Not Qualified | - | 5 V | INDUSTRIAL | - | - | - | - | - | - | 0.003 mA | - | 256X8 | - | 8 | 0.00005 A | 2048 bit | - | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | - | 200 | HARDWARE | 1010DDDR | - | - | - | ||
24AA52-I/MSG Microchip | In Stock | - | - | YES | 8 | - | MICROCHIP TECHNOLOGY INC | 24AA52-I/MSG | - | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | - | TSSOP8,.19 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | - | - | 5.52 | - | Yes | - | - | e3 | - | - | Matte Tin (Sn) | - | - | - | - | DUAL | GULL WING | - | - | 0.635 mm | compliant | - | R-PDSO-G8 | Not Qualified | - | 2/5 V | INDUSTRIAL | - | - | - | - | - | - | 0.003 mA | - | 256X8 | - | 8 | 0.000001 A | 2048 bit | - | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | - | 200 | HARDWARE/SOFTWARE | 1010DDDR | - | - | - | ||
24C01C-I/SNG Microchip | In Stock | - | - | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24C01C-I/SNG | 1 | 128 words | 128 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | 40 | 5.13 | - | Yes | 5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | - | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 4.5 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 128X8 | 1.75 mm | 8 | 0.00005 A | 1024 bit | - | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 1 ms | 200 | - | 1010DDDR | - | 4.9 mm | 3.9 mm | ||
24FC512-I/PG Microchip | In Stock | - | - | NO | 8 | 1 MHz | MICROCHIP TECHNOLOGY INC | 24FC512-I/PG | - | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Active | DIP | NOT SPECIFIED | 5.45 | - | Yes | 2.5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | - | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 1.7 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 64KX8 | 5.334 mm | 8 | 0.000001 A | 524288 bit | - | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | - | 9.271 mm | 7.62 mm | ||
24FC128-I/PG Microchip | In Stock | - | - | NO | 8 | 1 MHz | MICROCHIP TECHNOLOGY INC | 24FC128-I/PG | - | 16384 words | 16000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Active | DIP | NOT SPECIFIED | 5.39 | - | Yes | 2.5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | - | 1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 1.7 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 16KX8 | 5.334 mm | 8 | 0.000001 A | 131072 bit | - | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | - | 9.271 mm | 7.62 mm | ||
24AA014-I/PG Microchip | In Stock | - | - | NO | 8 | 0.1 MHz | MICROCHIP TECHNOLOGY INC | 24AA014-I/PG | - | 128 words | 128 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Active | DIP | NOT SPECIFIED | 5.4 | - | Yes | 2.5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | - | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 128X8 | 5.334 mm | 8 | 0.000001 A | 1024 bit | - | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | - | 9.271 mm | 7.62 mm | ||
24C01C-I/MSG Microchip | In Stock | - | - | YES | 8 | - | MICROCHIP TECHNOLOGY INC | 24C01C-I/MSG | - | 128 words | 128 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | - | TSSOP8,.19 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | - | - | 5.34 | - | Yes | 5 V | - | e3 | Yes | - | Matte Tin (Sn) | - | - | - | - | DUAL | GULL WING | - | - | 0.635 mm | compliant | - | R-PDSO-G8 | Not Qualified | - | 5 V | INDUSTRIAL | - | - | - | - | - | - | 0.003 mA | - | 128X8 | - | 8 | 0.00005 A | 1024 bit | - | - | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | - | 200 | - | 1010DDDR | - | - | - |