- Length
- JESD-609 Code
- Number of Functions
- Terminal Position
- Width
- Base Part Number
- Factory Lead Time
- Memory Format
- Memory Interface
- Memory Size
- Memory Types
- Moisture Sensitivity Level (MSL)
Attribute column
Manufacturer
Microchip Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Surface Mount | Number of Pins | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer Part Number | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Usage Level | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Mode | Supply Current-Max | Access Time | Organization | Output Characteristics | Seated Height-Max | Memory Width | Density | Standby Current-Max | Memory Density | Max Frequency | Screening Level | Parallel/Serial | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Data Polling | Page Size | I2C Control Byte | Reverse Pinout | Length | Width | Radiation Hardening |
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 24LC16BT-E/OTG Microchip | In Stock | - | - | - | YES | - | 5 | - | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24LC16BT-E/OTG | 1 | 2048 words | 2000 | 125 °C | -40 °C | PLASTIC/EPOXY | LSSOP | ROHS COMPLIANT PLASTIC, SC-74A, SOT-23, 5 PIN | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Active | SOT-23 | 40 | 5.15 | - | Yes | 5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | - | 1 MILLION ERASE/WRITE CYCLES | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.95 mm | compliant | 5 | R-PDSO-G5 | Not Qualified | - | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 2KX8 | - | 1.45 mm | 8 | - | 0.000005 A | 16384 bit | - | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | - | - | 1010MMMR | - | 2.95 mm | 1.63 mm | - | ||
24C01CT-I/MSG Microchip | In Stock | - | - | - | YES | - | 8 | - | - | MICROCHIP TECHNOLOGY INC | 24C01CT-I/MSG | - | 128 words | 128 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | - | TSSOP8,.19 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | - | - | 5.34 | - | Yes | 5 V | - | e3 | Yes | - | Matte Tin (Sn) | - | - | - | - | DUAL | GULL WING | - | - | 0.635 mm | compliant | - | R-PDSO-G8 | Not Qualified | - | - | 5 V | INDUSTRIAL | - | - | - | - | - | - | 0.003 mA | - | 128X8 | - | - | 8 | - | 0.00005 A | 1024 bit | - | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | - | 200 | - | - | - | 1010DDDR | - | - | - | - | ||
24LCS52-I/MSG Microchip | In Stock | - | - | - | YES | - | 8 | - | - | MICROCHIP TECHNOLOGY INC | 24LCS52-I/MSG | - | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | - | TSSOP8,.19 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | - | - | 5.52 | - | Yes | - | - | e3 | - | - | Matte Tin (Sn) | - | - | - | - | DUAL | GULL WING | - | - | 0.635 mm | compliant | - | R-PDSO-G8 | Not Qualified | - | - | 2.5/5 V | INDUSTRIAL | - | - | - | - | - | - | 0.003 mA | - | 256X8 | - | - | 8 | - | 0.000001 A | 2048 bit | - | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | - | 200 | HARDWARE/SOFTWARE | - | - | 1010DDDR | - | - | - | - | ||
24C00T-I/SNG Microchip | In Stock | - | - | - | YES | - | 8 | - | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24C00T-I/SNG | 1 | 16 words | 16 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | 40 | 5.47 | - | Yes | 5 V | - | e3 | Yes | - | Matte Tin (Sn) | - | - | - | - | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | - | 5.5 V | 2/5 V | INDUSTRIAL | 4.5 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 16X8 | - | 1.75 mm | 8 | - | 0.000001 A | 128 bit | - | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 4 ms | 200 | - | - | - | 1010XXXR | - | 4.9 mm | 3.9 mm | - | ||
25AA128T-E/SN Microchip | In Stock | - | - | 18 Weeks | YES | - | 8 | - | - | MICROCHIP TECHNOLOGY INC | 25AA128T-E/SN | - | 16384 words | 16000 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | - | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | - | - | 5.47 | - | Yes | - | - | - | - | - | - | - | - | - | - | DUAL | GULL WING | - | - | 1.27 mm | compliant | - | R-PDSO-G8 | Not Qualified | - | - | 3/5 V | AUTOMOTIVE | - | - | - | - | - | - | 0.005 mA | - | 16KX8 | - | - | 8 | - | 0.000001 A | 131072 bit | - | - | SERIAL | EEPROM | - | SPI | 1000000 Write/Erase Cycles | - | 200 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | ||
24FC128-I/STG Microchip | In Stock | - | - | - | YES | - | 8 | - | 1 MHz | MICROCHIP TECHNOLOGY INC | 24FC128-I/STG | 1 | 16384 words | 16000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | ROHS COMPLIANT, PLASTIC, TSSOP-8 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | SOIC | 40 | 5.22 | - | Yes | 2.5 V | - | e3 | Yes | EAR99 | Matte Tin (Sn) | - | - | 1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | - | 5.5 V | 3/5 V | INDUSTRIAL | 1.7 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 16KX8 | - | 1.2 mm | 8 | - | 0.000001 A | 131072 bit | - | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | - | - | 1010DDDR | - | 4.4 mm | 3 mm | - | ||
AT24C16BU3-UU-T Microchip | In Stock | - | - | - | YES | - | 8 | - | 1 MHz | ATMEL CORP | AT24C16BU3-UU-T | - | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA8,2X4,40/20 | BGA8,2X4,40/20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | - | 7.88 | - | Yes | 2.5 V | - | - | - | 3A991.B.1.B.1 | - | - | - | - | 8542.32.00.51 | BOTTOM | BALL | - | 1 | 0.5 mm | unknown | 8 | R-PBGA-B8 | Not Qualified | - | 3.6 V | 2/5 V | INDUSTRIAL | 1.8 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 2MX8 | - | 0.91 mm | 8 | - | 0.000001 A | 16777216 bit | - | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE | - | - | 1010MMMR | - | 2 mm | 1.5 mm | - | ||
X28HC64JI-70 Microchip | In Stock | - | - | - | YES | - | 32 | 70 ns | - | ROCHESTER ELECTRONICS LLC | X28HC64JI-70 | 3 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | - | RECTANGULAR | CHIP CARRIER | Active | QFJ | NOT SPECIFIED | 5.72 | - | No | 5 V | - | e0 | No | - | TIN LEAD | - | - | SOFTWARE DATA PROTECTION; 64 BYTE PAGE WRITE; 100 YEARS DATA RETENTION | - | QUAD | J BEND | 225 | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | COMMERCIAL | - | 5.5 V | - | INDUSTRIAL | 4.5 V | - | - | - | - | ASYNCHRONOUS | - | - | 8KX8 | - | 3.55 mm | 8 | - | - | 65536 bit | - | - | PARALLEL | EEPROM | 5 V | - | - | 5 ms | - | - | - | - | - | - | 13.97 mm | 11.43 mm | - | ||
34LC02-I/MNY Microchip | In Stock | - | - | - | YES | 8 | 8 | - | 1 MHz | MICROCHIP TECHNOLOGY INC | 34LC02-I/MNY | 1 | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | VSON | VSON, SOLCC8,.11,20 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | Active | DFN | 40 | 5.46 | Compliant | Yes | 2.5 V | - | e4 | Yes | EAR99 | NICKEL PALLADIUM GOLD | 85 °C | -40 °C | - | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 5 V | 5.5 V | 2.5/5 V | INDUSTRIAL | 2.2 V | I2C, Serial | 5.5 V | 2.2 V | 256 B | SYNCHRONOUS | 0.003 mA | 400 ns | 256X8 | - | 0.8 mm | 8 | 2 kb | 0.000001 A | 2048 bit | 1 MHz | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | - | - | 1010DDDR | - | 3 mm | 2 mm | No | ||
24LC32AF-I/MNY Microchip | In Stock | - | - | - | YES | - | 8 | - | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24LC32AF-I/MNY | 1 | 4096 words | 4000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, | - | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | 40 | 5.34 | - | Yes | 5 V | - | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | - | 5.5 V | - | INDUSTRIAL | 2.5 V | - | - | - | - | SYNCHRONOUS | - | - | 4KX8 | - | 0.8 mm | 8 | - | - | 32768 bit | - | - | SERIAL | EEPROM | - | I2C | - | 5 ms | - | - | - | - | - | - | 3 mm | 2 mm | - | ||
24LC16BH-E/MNY Microchip | In Stock | - | - | - | YES | 8 | 8 | - | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24LC16BH-E/MNY | - | 256 words | 256 | 125 °C | -40 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE | Active | DFN | - | 5.12 | Compliant | Yes | 2.5 V | - | - | - | EAR99 | - | 125 °C | -40 °C | - | 8542.32.00.51 | DUAL | NO LEAD | - | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 5 V | 5.5 V | 3/5 V | AUTOMOTIVE | 1.7 V | I2C, Serial | 5.5 V | 2.5 V | 2 kB | SYNCHRONOUS | 0.003 mA | 900 ns | 256X8 | - | 0.8 mm | 8 | 16 kb | 0.000005 A | 2048 bit | 400 kHz | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | - | - | 1010MMMR | - | 3 mm | 2 mm | No | ||
24LC04BH-I/MNY Microchip | In Stock | - | - | - | YES | - | 8 | - | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24LC04BH-I/MNY | - | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, SOLCC8,.11,20 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | - | 5.35 | - | Yes | - | Automotive grade | e4 | - | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | 8542.32.00.51 | DUAL | NO LEAD | - | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | - | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 256X8 | OPEN-DRAIN | 0.8 mm | 8 | - | 0.000005 A | 4096 bit | - | ISO/TS-16949 | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | YES | 16 words | 1010XXMR | NO | 3 mm | 2 mm | - | ||
24LC64F-I/MNY Microchip Technology | In Stock | - | - | - | YES | - | 8 | - | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24LC64F-I/MNY | 1 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, | - | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | 40 | 5.36 | - | Yes | 5 V | - | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | - | 5.5 V | - | INDUSTRIAL | 2.5 V | - | - | - | - | SYNCHRONOUS | - | - | 8KX8 | - | 0.8 mm | 8 | - | - | 65536 bit | - | - | SERIAL | EEPROM | - | I2C | - | 5 ms | - | - | - | - | - | - | 2 mm | 3 mm | - | ||
24AA64F-I/MNY Microchip | In Stock | - | - | - | YES | - | 8 | - | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24AA64F-I/MNY | 1 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, | - | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | 40 | 5.5 | - | Yes | 5 V | - | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | - | 5.5 V | - | INDUSTRIAL | 1.7 V | - | - | - | - | SYNCHRONOUS | - | - | 8KX8 | - | 0.8 mm | 8 | - | - | 65536 bit | - | - | SERIAL | EEPROM | - | I2C | - | 5 ms | - | - | - | - | - | - | 2 mm | 3 mm | - | ||
24VL024H/MNY Microchip Technology | In Stock | - | - | - | YES | - | 8 | - | 0.1 MHz | MICROCHIP TECHNOLOGY INC | 24VL024H/MNY | - | 256 words | 256 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE | Active | DFN | NOT SPECIFIED | 5.41 | - | Yes | 1.8 V | - | e4 | - | EAR99 | - | - | - | - | 8542.32.00.51 | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | - | 3.6 V | 1.8/3.3 V | OTHER | 1.5 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 256X8 | - | 0.8 mm | 8 | - | 0.000001 A | 2048 bit | - | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | - | - | 1010DDDR | - | 3 mm | 2 mm | - | ||
24LC64-I/MNY Microchip Technology | In Stock | - | - | - | YES | 8 | 8 | - | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24LC64-I/MNY | 1 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | VSON | VSON, SOLCC8,.11,20 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | Active | DFN | 40 | 5.36 | Compliant | Yes | 5 V | - | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 85 °C | -40 °C | - | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 5 V | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | I2C, Serial | 5.5 V | 2.5 V | 8 kB | SYNCHRONOUS | 0.003 mA | 900 ns | 8KX8 | - | 0.8 mm | 8 | 64 kb | 0.000001 A | 65536 bit | 400 kHz | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | - | - | 1010DDDR | - | 3 mm | 2 mm | No | ||
24AA04-I/MNY Microchip | In Stock | - | - | - | YES | - | 8 | - | 0.1 MHz | MICROCHIP TECHNOLOGY INC | 24AA04-I/MNY | 1 | 512 words | 512 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, SOLCC8,.11,20 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | 40 | 5.39 | - | Yes | - | - | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | - | 5.5 V | - | INDUSTRIAL | 1.7 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 512X8 | - | 0.8 mm | 8 | - | 0.000001 A | 4096 bit | - | - | SERIAL | EEPROM | - | I2C | - | 5 ms | 200 | HARDWARE | - | - | - | NO | 3 mm | 2 mm | - | ||
24AA64-I/MNY Microchip Technology | In Stock | - | - | - | YES | - | 8 | - | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24AA64-I/MNY | 1 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | VSON | VSON, SOLCC8,.11,20 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | Active | DFN | 40 | 5.36 | - | Yes | 2.5 V | - | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | - | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 8KX8 | - | 0.8 mm | 8 | - | 0.000001 A | 65536 bit | - | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | - | - | 1010DDDR | - | 3 mm | 2 mm | - | ||
24VL025/MNY Microchip Technology | In Stock | - | - | - | YES | - | 8 | - | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24VL025/MNY | 1 | 256 words | 256 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | 40 | 5.6 | - | Yes | 1.8 V | - | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | - | 3.6 V | 1.8/3.3 V | OTHER | 1.5 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 256X8 | - | 0.8 mm | 8 | - | 0.000001 A | 2048 bit | - | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | SOFTWARE | - | - | 1010DDDR | - | 3 mm | 2 mm | - | ||
24VL014/MNY Microchip Technology | In Stock | - | - | - | YES | - | 8 | - | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24VL014/MNY | 1 | 128 words | 128 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | 40 | 5.58 | - | Yes | 1.8 V | - | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | - | 3.6 V | 1.8/3.3 V | OTHER | 1.5 V | - | - | - | - | SYNCHRONOUS | 0.003 mA | - | 128X8 | - | 0.8 mm | 8 | - | 0.000001 A | 1024 bit | - | - | SERIAL | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | - | - | 1010DDDR | - | 3 mm | 2 mm | - |