- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Package Description
- HTS Code
- Number of Terminals
- Package Body Material
- Surface Mount
- Terminal Position
- JESD-30 Code
- Package Shape
- Package Style
Attribute column
Manufacturer
Micro Crystal Interface - Telecom
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Operating Mode | Supply Current-Max | Data Rate | Seated Height-Max | Telecom IC Type | Filter | Companding Law | Standard | ISDN Access Rate | Reference Point | Output High Voltage-Min | Output Low Voltage-Max | Make-break Ratio | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 PM8373-NGI Microsemi Corporation | In Stock | - | Datasheet | YES | 196 | MICROSEMI CORP | 3 | 125 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | Yes | 1.8 V | - | - | - | 8542.39.00.01 | BOTTOM | BALL | - | 1 | 1 mm | compliant | - | - | S-PBGA-B196 | Not Qualified | AUTOMOTIVE | - | - | - | 1.5 mm | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | 15 mm | 15 mm | ||
AK4671EG Asahi Kasei Microsystems Corporation | In Stock | - | Datasheet | YES | 57 | ASAHI KASEI MICRODEVICES CORP | - | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | - | 3.3 V | e1 | TIN SILVER COPPER | - | 8542.39.00.01 | BOTTOM | BALL | - | 1 | 0.5 mm | unknown | - | 57 | S-PBGA-B57 | Not Qualified | OTHER | SYNCHRONOUS | - | - | 1 mm | ADPCM CODEC | YES | A/MU-LAW | - | - | - | - | - | - | 5 mm | 5 mm | ||
UM91214B United Microelectronics Corporation | In Stock | - | Datasheet | NO | 18 | UNITED MICROELECTRONICS CORP | - | 70 °C | -20 °C | PLASTIC/EPOXY | - | , | - | RECTANGULAR | IN-LINE | Obsolete | - | - | 3.5 V | - | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 1 | - | unknown | - | - | R-PDIP-T18 | Not Qualified | COMMERCIAL | - | 2 mA | - | - | TELEPHONE DIALER CIRCUIT | - | - | - | - | - | - | - | 1:2 | - | - | ||
UM82C550 United Microelectronics Corporation | In Stock | - | Datasheet | - | - | UNITED MICROELECTRONICS CORP | - | - | - | - | - | , | - | - | - | Contact Manufacturer | - | - | - | - | - | - | - | - | - | - | - | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 MX641DW CML Microcircuits Plc | In Stock | - | Datasheet | YES | 24 | CML MICROCIRCUITS LTD | - | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP24,.4 | SOP24,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | - | 5 V | - | - | - | 8542.39.00.01 | DUAL | GULL WING | - | 1 | 1.27 mm | unknown | - | 24 | R-PDSO-G24 | Not Qualified | INDUSTRIAL | - | 5 mA | - | 2.65 mm | TONE DECODER CIRCUIT | - | - | - | - | - | - | - | - | 15.4 mm | 7.5 mm | ||
 FX631D5 CML Microcircuits Plc | In Stock | - | Datasheet | YES | 24 | CML MICROCIRCUITS LTD | - | 85 °C | -40 °C | PLASTIC/EPOXY | SSOP | SSOP-24 | - | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Obsolete | SSOP | Yes | - | e3 | MATTE TIN | LG-MAX, WD-MAX | 8542.39.00.01 | DUAL | GULL WING | 260 | 1 | - | compliant | 40 | 24 | R-PDSO-G24 | Not Qualified | INDUSTRIAL | - | 2.2 mA | - | - | TONE DECODER CIRCUIT | - | - | - | - | - | - | - | - | - | - | ||
NLNSE5512DGLC Netlogic Microsystems | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 TK83361MTL-G Asahi Kasei Microsystems Corporation | In Stock | - | Datasheet | YES | 16 | ASAHI KASEI MICRODEVICES CORP | - | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | - | 4 V | - | - | - | 8542.39.00.01 | DUAL | GULL WING | - | 1 | 1.27 mm | unknown | - | 16 | R-PDSO-G16 | - | INDUSTRIAL | - | - | - | 1.94 mm | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | 9.9 mm | 3.9 mm | ||
HM9121 Hualon Microelectronics Corp | In Stock | - | Datasheet | - | - | HUALON MICROELECTRONICS CORP | - | - | - | - | - | , | - | - | - | Contact Manufacturer | - | - | - | - | - | - | - | - | - | - | - | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
SM5032C SamHop Microelectronics Corp. | In Stock | - | Datasheet | YES | 14 | SAMHOP MICROELECTRONICS CORP | - | 70 °C | -10 °C | PLASTIC/EPOXY | SOP | SOP, SOP14(UNSPEC) | SOP14(UNSPEC) | RECTANGULAR | SMALL OUTLINE | Contact Manufacturer | - | - | - | - | - | - | 8542.39.00.01 | DUAL | GULL WING | - | - | - | unknown | - | - | R-PDSO-G14 | Not Qualified | COMMERCIAL | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | - | ||
MT8931BE Microsemi Corporation | In Stock | - | Datasheet | NO | 28 | MICROSEMI CORP | - | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | - | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | - | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | - | 2.54 mm | unknown | - | 28 | R-PDIP-T28 | Not Qualified | INDUSTRIAL | - | - | 192 Mbps | - | - | - | - | ANSI T1.605 | BASIC | S/T | 2.4 V | 0.4 V | - | - | - | ||
 FX469P6 CML Microcircuits Plc | In Stock | - | Datasheet | NO | 22 | CML MICROCIRCUITS LTD | - | 70 °C | -30 °C | PLASTIC/EPOXY | DIP | DIP, DIP22,.4 | DIP22,.4 | RECTANGULAR | IN-LINE | Obsolete | DIP | - | 5 V | - | - | FULL DUPLEX | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | compliant | - | 22 | R-PDIP-T22 | Not Qualified | OTHER | - | - | 4 Mbps | 4.95 mm | MODEM | - | - | - | - | - | - | - | - | 27.685 mm | 10.16 mm | ||
HM8250B Hualon Microelectronics Corp | In Stock | - | Datasheet | - | - | HUALON MICROELECTRONICS CORP | - | - | - | - | - | , | - | - | - | Contact Manufacturer | - | - | - | - | - | - | - | - | - | - | - | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
PM7390-BI-P Microsemi Storage OTN and Networking Solutions | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
HM9113A Hualon Microelectronics Corp | In Stock | - | Datasheet | - | - | HUALON MICROELECTRONICS CORP | - | - | - | - | - | , | - | - | - | Contact Manufacturer | - | - | - | - | - | - | - | - | - | - | - | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
SM5272B SamHop Microelectronics Corp. | In Stock | - | Datasheet | NO | 18 | SAMHOP MICROELECTRONICS CORP | - | - | - | PLASTIC/EPOXY | DIP | DIP, DIP18(UNSPEC) | DIP18(UNSPEC) | RECTANGULAR | IN-LINE | Contact Manufacturer | - | - | - | - | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | - | - | unknown | - | - | R-PDIP-T18 | Not Qualified | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | - | ||
ZL70123MNG7 Microsemi Corporation | In Stock | - | Datasheet | YES | 29 | MICROSEMI CORP | - | 55 °C | - | UNSPECIFIED | LGA | LGA, | - | RECTANGULAR | GRID ARRAY | Transferred | - | - | 3.3 V | - | - | - | 8542.39.00.01 | BOTTOM | BUTT | - | 1 | - | compliant | - | - | R-XBGA-B29 | - | COMMERCIAL | - | - | - | 2.95 mm | RF AND BASEBAND CIRCUIT | - | - | - | - | - | - | - | - | 18 mm | 12 mm | ||
 MX365J CML Microcircuits Plc | In Stock | - | Datasheet | NO | 24 | CML MICROCIRCUITS LTD | - | 85 °C | -30 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | - | 5 V | - | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | unknown | - | 24 | R-GDIP-T24 | Not Qualified | OTHER | - | - | - | 5.84 mm | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | 31.75 mm | 15.24 mm | ||
FX-500-LAC-GNJ-A3-J3 Microsemi Corporation | In Stock | - | Datasheet | YES | 6 | MICROSEMI CORP | 1 | 70 °C | - | PLASTIC/EPOXY | SOJ | PACKAGE-6 | - | RECTANGULAR | SMALL OUTLINE | Transferred | - | Yes | 3.3 V | e4 | NICKEL GOLD | - | 8542.39.00.01 | DUAL | J BEND | 260 | 1 | 2.54 mm | compliant | 30 | - | R-PDSO-J6 | - | COMMERCIAL | - | - | - | 4.69 mm | ATM/SONET/SDH SUPPORT CIRCUIT | - | - | - | - | - | - | - | - | 13.97 mm | 8.89 mm | ||
SA2531AAPA South African Micro-Electronic Systems Ltd | In Stock | - | Datasheet | NO | 28 | SOUTH AFRICAN MICRO-ELECTRONIC SYSTEMS LTD | - | 70 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Contact Manufacturer | - | - | 2.5 V | - | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | - | 2.54 mm | unknown | - | - | R-PDIP-T28 | Not Qualified | OTHER | - | 5 mA | - | - | - | - | - | - | - | - | - | - | - | - | - |