- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Package Description
- HTS Code
- Number of Terminals
- Package Body Material
- Surface Mount
- Terminal Position
- JESD-30 Code
- Package Shape
- Package Style
Attribute column
Manufacturer
Micro Crystal Interface - Telecom
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Telecom IC Type | Make-break Ratio | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 VSC8147XRE Microsemi Corporation | In Stock | - | Datasheet | - | - | MICROSEMI CORP | - | - | - | - | - | , | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | ||
UM91316C United Microelectronics Corporation | In Stock | - | Datasheet | NO | 18 | UNITED MICROELECTRONICS CORP | - | 70 °C | -20 °C | PLASTIC/EPOXY | - | , | - | RECTANGULAR | IN-LINE | Obsolete | - | - | 2.5 V | - | - | - | SELECTABLE MAKE/BREAK RATIO 1:2 | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 1 | - | unknown | - | - | R-PDIP-T18 | Not Qualified | COMMERCIAL | 2 mA | - | - | TELEPHONE DIALER CIRCUIT | 1:1.5 | - | - | ||
 CM8870C California Micro Devices | In Stock | - | Datasheet | NO | 18 | CALIFORNIA MICRO DEVICES CORP | - | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | - | TIN LEAD | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | unknown | - | 18 | R-CDIP-T18 | Not Qualified | COMMERCIAL | 7 mA | - | - | DTMF SIGNALING CIRCUIT | - | - | - | ||
AU9254A21-UES Alcor Micro Corp | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
SC8206A4 Hangzhou Silan Microelectronics CO LTD | In Stock | - | Datasheet | NO | 18 | HANGZHOU SILAN MICROELECTRONICS CO LTD | - | 70 °C | -10 °C | PLASTIC/EPOXY | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Contact Manufacturer | - | Yes | 5 V | - | - | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | - | 2.54 mm | compliant | - | - | R-PDIP-T18 | Not Qualified | COMMERCIAL | - | - | - | TELECOM CIRCUIT | - | - | - | ||
FX489DW CML Microcircuits Plc | In Stock | - | Datasheet | YES | 24 | CML MICROCIRCUITS LTD | - | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP24(UNSPEC) | SOP24(UNSPEC) | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | - | TIN LEAD | FULL DUPLEX | 8542.39.00.01 | DUAL | GULL WING | - | 1 | 1.27 mm | unknown | - | 24 | R-PDSO-G24 | Not Qualified | INDUSTRIAL | - | 19 Mbps | 2.65 mm | MODEM | - | 15.4 mm | 7.5 mm | ||
 LE75183CFSC Microsemi Corporation | In Stock | - | Datasheet | YES | 28 | MICROSEMI CORP | - | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 5 V | e3 | - | MATTE TIN | - | 8542.39.00.01 | DUAL | GULL WING | - | 1 | 1.27 mm | compliant | - | 28 | R-PDSO-G28 | Not Qualified | INDUSTRIAL | - | - | 2.65 mm | TELECOM CIRCUIT | - | 17.9 mm | 7.5 mm | ||
SC5272-M4 Hangzhou Silan Microelectronics CO LTD | In Stock | - | Datasheet | NO | 18 | HANGZHOU SILAN MICROELECTRONICS CO LTD | - | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Contact Manufacturer | - | Yes | 5 V | - | - | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | - | 2.54 mm | compliant | - | - | R-PDIP-T18 | Not Qualified | COMMERCIAL | - | - | - | TELECOM CIRCUIT | - | - | - | ||
ZL50402GDG Microsemi Corporation | In Stock | - | Datasheet | YES | 208 | ZARLINK SEMICONDUCTOR INC | - | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Transferred | BGA | No | 1.8 V | e0 | No | TIN LEAD | - | 8542.39.00.01 | BOTTOM | BALL | - | 1 | 1 mm | compliant | - | 208 | S-PBGA-B208 | Not Qualified | INDUSTRIAL | - | - | 1.4 mm | LAN SWITCHING CIRCUIT | - | 17 mm | 17 mm | ||
FX-500-LAC-GNJ-A3-E7 Microsemi Corporation | In Stock | - | Datasheet | YES | 6 | MICROSEMI CORP | 1 | 70 °C | - | PLASTIC/EPOXY | SOJ | PACKAGE-6 | - | RECTANGULAR | SMALL OUTLINE | Transferred | - | Yes | 3.3 V | e4 | - | NICKEL GOLD | - | 8542.39.00.01 | DUAL | J BEND | 260 | 1 | 2.54 mm | compliant | 30 | - | R-PDSO-J6 | - | COMMERCIAL | - | - | 4.69 mm | ATM/SONET/SDH SUPPORT CIRCUIT | - | 13.97 mm | 8.89 mm | ||
HM9110C Hualon Microelectronics Corp | In Stock | - | Datasheet | - | - | HUALON MICROELECTRONICS CORP | - | - | - | - | - | , | - | - | - | Contact Manufacturer | - | - | - | - | - | - | - | - | - | - | - | - | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | ||
HM9100A1 Hualon Microelectronics Corp | In Stock | - | Datasheet | - | - | HUALON MICROELECTRONICS CORP | - | - | - | - | - | , | - | - | - | Contact Manufacturer | - | - | - | - | - | - | - | - | - | - | - | - | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - |