- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- JESD-30 Code
- Memory Density
- Memory IC Type
- Memory Width
- Number of Words
- Number of Words Code
- Organization
- Package Body Material
- Package Shape
Attribute column
Manufacturer
Micro Crystal Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Output Enable | Page Size | Ready/Busy | Refresh Cycles | I2C Control Byte | Access Mode | Self Refresh | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 N341256LSJ-15 Nkk Micro Devices Inc | In Stock | - | Datasheet | YES | 28 | 15 ns | - | NKK MICRO DEVICES INC | - | 32768 words | 32000 | 70 °C | - | PLASTIC/EPOXY | SOJ | SOJ, SOJ28,.34 | SOJ28,.34 | RECTANGULAR | SMALL OUTLINE | Obsolete | - | No | 3.3 V | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.41 | DUAL | J BEND | - | - | 1.27 mm | unknown | - | - | R-PDSO-J28 | Not Qualified | - | COMMERCIAL | - | - | ASYNCHRONOUS | 0.09 mA | 32KX8 | 3-STATE | - | 8 | 0.001 A | 262144 bit | - | PARALLEL | COMMON | STANDARD SRAM | - | - | - | - | - | - | 3 V | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 X24C08S14 IC Microsystems Sdn Bhd | In Stock | - | Datasheet | YES | 14 | - | 0.1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 1024 words | 1000 | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, SOP14,.25 | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | unknown | - | 14 | R-PDSO-G14 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | - | SYNCHRONOUS | 0.003 mA | 1KX8 | - | 1.75 mm | 8 | 0.00015 A | 8192 bit | - | SERIAL | - | EEPROM | - | I2C | 100000 Write/Erase Cycles | 10 ms | 100 | - | - | - | - | - | - | - | - | - | - | 1010DMMR | - | - | 8.65 mm | 3.9 mm | ||
NN514265AJ-50 United Microelectronics Corporation | In Stock | - | Datasheet | YES | 40 | 50 ns | - | NIPPON STEEL SEMICONDUCTOR CORP | - | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | SOJ | SOJ, SOJ40,.44 | SOJ40,.44 | RECTANGULAR | SMALL OUTLINE | Obsolete | - | No | 5 V | e0 | - | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | J BEND | - | 1 | 1.27 mm | unknown | - | - | R-PDSO-J40 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.12 mA | 256KX16 | 3-STATE | - | 16 | 0.001 A | 4194304 bit | - | - | COMMON | EDO DRAM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 512 | - | FAST PAGE WITH EDO | NO | - | - | ||
X24026Y IC Microsystems Sdn Bhd | In Stock | - | Datasheet | NO | 8 | - | 0.1 MHz | IC MICROSYSTEMS SDN BHD | - | 256 words | 256 | 70 °C | - | UNSPECIFIED | - | , | - | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | CARD | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | UNSPECIFIED | UNSPECIFIED | - | 1 | - | unknown | - | 8 | R-XXMA-X8 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | - | SYNCHRONOUS | - | 256X8 | - | - | 8 | - | 2048 bit | - | SERIAL | - | EEPROM | - | I2C | - | 10 ms | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
UM6264AM-10L United Microelectronics Corporation | In Stock | - | Datasheet | YES | 28 | 100 ns | - | UNITED MICROELECTRONICS CORP | - | 8192 words | 8000 | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, SOP28,.5 | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | Obsolete | - | No | 5 V | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.41 | DUAL | GULL WING | - | - | 1.27 mm | unknown | - | - | R-PDSO-G28 | Not Qualified | - | COMMERCIAL | - | - | ASYNCHRONOUS | 0.045 mA | 8KX8 | 3-STATE | - | 8 | 0.0001 A | 65536 bit | - | PARALLEL | COMMON | STANDARD SRAM | - | - | - | - | - | - | 2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 WS128K32V-20G2UI Microsemi Corporation | In Stock | - | Datasheet | YES | 68 | 20 ns | - | MICROSEMI CORP | - | 131072 words | 128000 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | QFP | 22.40 X 22.40 MM, CERAMIC, QFP-68 | - | SQUARE | FLATPACK | Transferred | QFP | No | 3.3 V | e4 | No | 3A991.B.2.A | GOLD | ALSO CONFIGURABLE AS 512K X 8 | 8542.32.00.41 | QUAD | GULL WING | - | 1 | 1.27 mm | unknown | - | 68 | S-CQFP-G68 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | - | ASYNCHRONOUS | - | 128KX32 | - | 3.51 mm | 32 | - | 4194304 bit | - | PARALLEL | - | SRAM MODULE | - | - | - | - | - | - | - | 16 | - | - | - | - | - | - | - | - | - | - | 22.36 mm | 22.36 mm | ||
X25080V IC Microsystems Sdn Bhd | In Stock | - | Datasheet | YES | 14 | - | 2 MHz | IC MICROSYSTEMS SDN BHD | 3 | 1024 words | 1000 | 70 °C | - | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP14,.25 | TSSOP14,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 0.65 mm | unknown | - | 14 | R-PDSO-G14 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | - | SYNCHRONOUS | 0.005 mA | 1KX8 | - | 1.2 mm | 8 | 0.000001 A | 8192 bit | - | SERIAL | - | EEPROM | - | SPI | 100000 Write/Erase Cycles | 10 ms | 100 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | - | 5 mm | 4.4 mm | ||
XLS24C04P Exel Microelectronics Inc | In Stock | - | Datasheet | NO | 8 | - | - | EXEL MICROELECTRONICS INC | - | 512 words | 512 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | - | No | 5 V | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | - | - | 2.54 mm | unknown | - | - | R-PDIP-T8 | Not Qualified | - | COMMERCIAL | - | - | - | 0.001 mA | 512X8 | - | - | 8 | 0.000002 A | 4096 bit | - | SERIAL | - | EEPROM | - | I2C | 100000 Write/Erase Cycles | - | 10 | HARDWARE | - | - | - | - | - | - | - | - | - | 1010DDMR | - | - | - | - | ||
X24C02MI-3.5 IC Microsystems Sdn Bhd | In Stock | - | Datasheet | YES | 8 | - | 0.1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.19 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | MSOP | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 0.65 mm | unknown | - | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | INDUSTRIAL | 3.5 V | - | SYNCHRONOUS | 0.002 mA | 256X8 | - | 1.07 mm | 8 | 0.00005 A | 2048 bit | - | SERIAL | - | EEPROM | - | I2C | 100000 Write/Erase Cycles | 10 ms | 100 | HARDWARE | - | - | - | - | - | - | - | - | - | 1010DDDR | - | - | 3 mm | 3 mm | ||
WS512K32-25G2UM Microsemi Corporation | In Stock | - | Datasheet | YES | 68 | 25 ns | - | MICROSEMI CORP | - | 524288 words | 512000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QFP | 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | - | SQUARE | FLATPACK | Transferred | QFP | No | 5 V | e4 | No | 3A001.A.2.C | GOLD | USER CONFIGURABLE AS 2M X 8 | 8542.32.00.41 | QUAD | GULL WING | - | 1 | 1.27 mm | unknown | - | 68 | S-CQFP-G68 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | ASYNCHRONOUS | - | 512KX32 | - | 3.51 mm | 32 | - | 16777216 bit | MIL-STD-883 | PARALLEL | - | SRAM MODULE | - | - | - | - | - | - | - | 16 | - | - | - | - | - | - | - | - | - | - | 22.36 mm | 22.36 mm | ||
 EDI88128LPS35FB Microsemi Corporation | In Stock | - | Datasheet | YES | 32 | 35 ns | - | MICROSEMI CORP | - | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DFP | CERAMIC, DFP-32 | FL32,.4 | RECTANGULAR | FLATPACK | Transferred | DFP | No | 5 V | - | No | 3A001.A.2.C | - | - | 8542.32.00.41 | DUAL | FLAT | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | 32 | R-CDFP-F32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | ASYNCHRONOUS | 0.2 mA | 128KX8 | 3-STATE | 2.9464 mm | 8 | 0.002 A | 1048576 bit | MIL-STD-883 | PARALLEL | COMMON | STANDARD SRAM | - | - | - | - | - | - | 2 V | - | - | - | - | - | - | - | - | - | - | - | 20.828 mm | 10.414 mm | ||
 X24C08P-3.5 IC Microsystems Sdn Bhd | In Stock | - | Datasheet | NO | 8 | - | 0.1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 1024 words | 1000 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | 240 | 1 | 2.54 mm | unknown | - | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | COMMERCIAL | 3.5 V | - | SYNCHRONOUS | 0.003 mA | 1KX8 | - | 4.07 mm | 8 | 0.00015 A | 8192 bit | - | SERIAL | - | EEPROM | - | I2C | 100000 Write/Erase Cycles | 10 ms | 100 | - | - | - | - | - | - | - | - | - | - | 1010DMMR | - | - | 10.03 mm | 7.62 mm | ||
WMS128K8-55CC Microsemi Corporation | In Stock | - | Datasheet | NO | 32 | 55 ns | - | MICROSEMI CORP | - | 131072 words | 128000 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, | - | RECTANGULAR | IN-LINE | Transferred | DIP | No | 5 V | e4 | No | EAR99 | GOLD | - | 8542.32.00.41 | DUAL | THROUGH-HOLE | - | 1 | - | compliant | - | 32 | R-CDIP-T32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | - | ASYNCHRONOUS | - | 128KX8 | - | 5.13 mm | 8 | - | 1048576 bit | - | PARALLEL | - | STANDARD SRAM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 42.2 mm | - | ||
X24164P-2.7 IC Microsystems Sdn Bhd | In Stock | - | Datasheet | NO | 8 | - | 0.1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 2048 words | 2000 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | - | - | EAR99 | - | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | 240 | 1 | 2.54 mm | unknown | - | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | COMMERCIAL | 2.7 V | - | SYNCHRONOUS | 0.003 mA | 2KX8 | - | 4.32 mm | 8 | 0.00005 A | 16384 bit | - | SERIAL | - | EEPROM | - | I2C | 100000 Write/Erase Cycles | 10 ms | 100 | - | - | - | - | - | - | - | - | - | - | 1DDDMMMR | - | - | 10.03 mm | 7.62 mm | ||
X25642SI-2.7 IC Microsystems Sdn Bhd | In Stock | - | Datasheet | YES | 14 | - | 2 MHz | IC MICROSYSTEMS SDN BHD | 3 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP14,.25 | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | unknown | - | 14 | R-PDSO-G14 | Not Qualified | 5.5 V | INDUSTRIAL | 2.7 V | - | SYNCHRONOUS | 0.005 mA | 8KX8 | - | 1.75 mm | 8 | 0.000001 A | 65536 bit | - | SERIAL | - | EEPROM | - | SPI | 100000 Write/Erase Cycles | 10 ms | 100 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | - | 8.65 mm | 3.9 mm | ||
XLS24C02P Exel Microelectronics Inc | In Stock | - | Datasheet | NO | 8 | - | - | EXEL MICROELECTRONICS INC | - | 256 words | 256 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | - | No | 5 V | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | - | - | 2.54 mm | unknown | - | - | R-PDIP-T8 | Not Qualified | - | COMMERCIAL | - | - | - | 0.001 mA | 256X8 | - | - | 8 | 0.000002 A | 2048 bit | - | SERIAL | - | EEPROM | - | I2C | 100000 Write/Erase Cycles | - | 10 | HARDWARE | - | - | - | - | - | - | - | - | - | 1010DDDR | - | - | - | - | ||
NN511664J-50 United Microelectronics Corporation | In Stock | - | Datasheet | YES | 40 | 50 ns | - | NIPPON STEEL SEMICONDUCTOR CORP | - | 65536 words | 64000 | 70 °C | - | PLASTIC/EPOXY | SOJ | SOJ, SOJ40,.44 | SOJ40,.44 | RECTANGULAR | SMALL OUTLINE | Obsolete | - | No | 5 V | e0 | - | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | J BEND | - | 1 | 1.27 mm | unknown | - | - | R-PDSO-J40 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.14 mA | 64KX16 | 3-STATE | - | 16 | 0.001 A | 1048576 bit | - | - | COMMON | FAST PAGE DRAM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 256 | - | FAST PAGE | NO | - | - | ||
UM62257AM-70LL United Microelectronics Corporation | In Stock | - | Datasheet | YES | 28 | 70 ns | - | UNITED MICROELECTRONICS CORP | - | 32768 words | 32000 | 70 °C | - | PLASTIC/EPOXY | SOP | , | - | RECTANGULAR | SMALL OUTLINE | Obsolete | - | - | 5 V | - | - | EAR99 | - | - | 8542.32.00.41 | DUAL | GULL WING | - | 1 | - | unknown | - | - | R-PDSO-G28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | - | 32KX8 | 3-STATE | - | 8 | - | 262144 bit | - | PARALLEL | - | STANDARD SRAM | - | - | - | - | - | - | 2 V | - | - | - | - | NO | - | - | - | - | - | - | - | - | ||
XLS2865AC-250 Exel Microelectronics Inc | In Stock | - | Datasheet | NO | 28 | 250 ns | - | EXEL MICROELECTRONICS INC | - | 8192 words | 8000 | 70 °C | - | CERAMIC, GLASS-SEALED | DIP | - | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | - | No | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | AUTOMATIC WRITE;PAGE WRITE | - | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | unknown | - | - | R-GDIP-T28 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | - | ASYNCHRONOUS | 0.11 mA | 8KX8 | - | - | 8 | - | 65536 bit | - | PARALLEL | - | EEPROM | 5 V | - | 10000 Write/Erase Cycles | 10 ms | - | - | - | - | YES | NO | NO | - | 32 words | YES | - | - | - | - | - | - | ||
 EDI88512CA25NI Microsemi Corporation | In Stock | - | Datasheet | YES | 32 | 25 ns | - | MICROSEMI CORP | - | 524288 words | 512000 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | SOJ | CERAMIC, SOJ-32 | - | RECTANGULAR | SMALL OUTLINE | Transferred | SOJ | No | 5 V | - | - | 3A991.B.2.A | - | TTL COMPATIBLE INPUTS/OUTPUTS | 8542.32.00.41 | DUAL | J BEND | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | 32 | R-CDSO-J32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | - | ASYNCHRONOUS | - | 512KX8 | - | 3.937 mm | 8 | - | 4194304 bit | - | PARALLEL | - | STANDARD SRAM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 21.082 mm | 11.0998 mm |