- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- JESD-30 Code
- Memory Density
- Memory IC Type
- Memory Width
- Number of Words
- Number of Words Code
- Organization
- Package Body Material
- Package Shape
Attribute column
Manufacturer
Micro Crystal Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Output Enable | Page Size | Refresh Cycles | I2C Control Byte | Access Mode | Self Refresh | Length | Width |
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 2114-UCE California Micro Devices | In Stock | - | Datasheet | NO | 18 | 450 ns | - | CALIFORNIA MICRO DEVICES CORP | - | 1024 words | 1000 | 70 °C | - | CERAMIC | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | - | No | 5 V | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.41 | DUAL | THROUGH-HOLE | - | - | 2.54 mm | unknown | - | - | R-XDIP-T18 | Not Qualified | - | COMMERCIAL | - | - | ASYNCHRONOUS | - | 1KX4 | 3-STATE | - | 4 | - | 4096 bit | - | PARALLEL | COMMON | STANDARD SRAM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 X24012SI IC Microsystems Sdn Bhd | In Stock | - | Datasheet | YES | 8 | - | 0.1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 128 words | 128 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | No | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | unknown | - | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | - | SYNCHRONOUS | 0.002 mA | 128X8 | - | 1.75 mm | 8 | 0.00005 A | 1024 bit | - | SERIAL | - | EEPROM | - | I2C | 100000 Write/Erase Cycles | 10 ms | 100 | - | - | - | - | - | - | - | - | - | 1010DDDR | - | - | 4.9 mm | 3.9 mm | ||
UM621024CV-70LL United Microelectronics Corporation | In Stock | - | Datasheet | YES | 32 | 70 ns | - | UNITED MICROELECTRONICS CORP | - | 131072 words | 128000 | 70 °C | - | PLASTIC/EPOXY | - | , | - | RECTANGULAR | SMALL OUTLINE | Obsolete | - | - | 5 V | - | - | EAR99 | - | - | 8542.32.00.41 | DUAL | GULL WING | - | 1 | - | unknown | - | - | R-PDSO-G32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | - | 128KX8 | 3-STATE | - | 8 | - | 1048576 bit | - | PARALLEL | - | STANDARD SRAM | - | - | - | - | - | - | 2 V | - | - | - | - | YES | - | - | - | - | - | - | - | ||
X25040SM IC Microsystems Sdn Bhd | In Stock | - | Datasheet | YES | 8 | - | 1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 512 words | 512 | 125 °C | -55 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | - | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | unknown | - | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | SYNCHRONOUS | 0.003 mA | 512X8 | - | 1.75 mm | 8 | 0.00015 A | 4096 bit | - | SERIAL | - | EEPROM | - | SPI | 100000 Write/Erase Cycles | 10 ms | 100 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | 4.89 mm | 3.9 mm | ||
UM6264DK-70LL United Microelectronics Corporation | In Stock | - | Datasheet | NO | 28 | 70 ns | - | UNITED MICROELECTRONICS CORP | - | 8192 words | 8000 | 70 °C | - | PLASTIC/EPOXY | DIP | , | - | RECTANGULAR | IN-LINE | Obsolete | - | - | 5 V | - | - | EAR99 | - | - | 8542.32.00.41 | DUAL | THROUGH-HOLE | - | 1 | - | unknown | - | - | R-PDIP-T28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | - | 8KX8 | 3-STATE | - | 8 | - | 65536 bit | - | PARALLEL | - | STANDARD SRAM | - | - | - | - | - | - | 2 V | - | - | - | - | YES | - | - | - | - | - | - | - | ||
UM6164DS-15 United Microelectronics Corporation | In Stock | - | Datasheet | YES | 44 | 15 ns | - | UNITED MICROELECTRONICS CORP | - | 8192 words | 8000 | 70 °C | - | PLASTIC/EPOXY | - | , | - | RECTANGULAR | SMALL OUTLINE | Obsolete | - | - | 5 V | - | - | EAR99 | - | - | 8542.32.00.41 | DUAL | GULL WING | - | 1 | - | unknown | - | - | R-PDSO-G44 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | - | 8KX8 | 3-STATE | - | 8 | - | 65536 bit | - | PARALLEL | - | STANDARD SRAM | - | - | - | - | - | - | 3 V | - | - | - | - | YES | - | - | - | - | - | - | - | ||
 X24026W IC Microsystems Sdn Bhd | In Stock | - | Datasheet | YES | - | - | 0.1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 256 words | 256 | 70 °C | - | UNSPECIFIED | DIE | DIE, WAFER | WAFER | UNSPECIFIED | UNCASED CHIP | Obsolete | WAFER | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | UPPER | NO LEAD | 240 | 1 | - | unknown | - | - | X-XUUC-N | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | - | SYNCHRONOUS | 0.002 mA | 256X8 | - | - | 8 | 0.00005 A | 2048 bit | - | SERIAL | - | EEPROM | - | I2C | 100000 Write/Erase Cycles | 10 ms | 100 | - | - | - | - | - | - | - | - | - | 1010DDDR | - | - | - | - | ||
X25020SI-3 IC Microsystems Sdn Bhd | In Stock | - | Datasheet | YES | 8 | - | 1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | No | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | unknown | - | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | INDUSTRIAL | 3 V | - | SYNCHRONOUS | 0.003 mA | 256X8 | - | 1.75 mm | 8 | 0.00001 A | 2048 bit | - | SERIAL | - | EEPROM | - | SPI | 100000 Write/Erase Cycles | 10 ms | 100 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | 4.89 mm | 3.9 mm | ||
X24C16S8-3 IC Microsystems Sdn Bhd | In Stock | - | Datasheet | YES | 8 | - | 0.1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 2048 words | 2000 | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.3 V | - | - | EAR99 | - | - | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | unknown | - | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | COMMERCIAL | 3 V | - | SYNCHRONOUS | 0.003 mA | 2KX8 | - | 1.75 mm | 8 | 0.00005 A | 16384 bit | - | SERIAL | - | EEPROM | - | I2C | 100000 Write/Erase Cycles | 10 ms | 100 | - | - | - | - | - | - | - | - | - | 1010MMMR | - | - | 4.89 mm | 3.9 mm | ||
 WS512K32V-17G2UI Microsemi Corporation | In Stock | - | Datasheet | YES | 68 | 17 ns | - | MICROSEMI CORP | - | 524288 words | 512000 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | QFP | 22.40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68 | QFP68,.99SQ,50 | SQUARE | FLATPACK | Transferred | QFP | No | 3.3 V | e4 | No | 3A991.B.2.A | GOLD | USER CONFIGURABLE AS 2 X 512K X 16 OR 4 X 512K X 8 | 8542.32.00.41 | QUAD | GULL WING | - | 1 | 1.27 mm | unknown | - | 68 | S-CQFP-G68 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | - | ASYNCHRONOUS | 0.4 mA | 512KX32 | 3-STATE | 3.51 mm | 32 | 0.2 A | 16777216 bit | - | PARALLEL | COMMON | SRAM MODULE | - | - | - | - | - | - | 3 V | - | - | - | - | - | - | - | - | - | - | 22.36 mm | 22.36 mm | ||
XLS2816AC-300 Exel Microelectronics Inc | In Stock | - | Datasheet | NO | 24 | 300 ns | - | EXEL MICROELECTRONICS INC | - | 2048 words | 2000 | 70 °C | - | CERAMIC, GLASS-SEALED | DIP | - | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | - | No | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | unknown | - | - | R-GDIP-T24 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | - | ASYNCHRONOUS | - | 2KX8 | - | - | 8 | - | 16384 bit | - | PARALLEL | - | EEPROM | 5 V | - | 10000 Write/Erase Cycles | 10 ms | - | - | - | - | YES | NO | NO | - | - | - | - | - | - | - | - | ||
XLS2864AC-250 Exel Microelectronics Inc | In Stock | - | Datasheet | NO | 28 | 250 ns | - | EXEL MICROELECTRONICS INC | - | 8192 words | 8000 | 70 °C | - | CERAMIC, GLASS-SEALED | DIP | - | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | - | No | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | AUTOMATIC WRITE;PAGE WRITE | - | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | unknown | - | - | R-GDIP-T28 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | - | ASYNCHRONOUS | 0.11 mA | 8KX8 | - | - | 8 | - | 65536 bit | - | PARALLEL | - | EEPROM | 5 V | - | 10000 Write/Erase Cycles | 10 ms | - | - | - | - | YES | NO | NO | - | 32 words | - | - | - | - | - | - | ||
XLS28C16BP-250 Exel Microelectronics Inc | In Stock | - | Datasheet | NO | 24 | 250 ns | - | EXEL MICROELECTRONICS INC | - | 2048 words | 2000 | 70 °C | - | PLASTIC/EPOXY | DIP | - | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | - | No | 5 V | e0 | - | - | TIN LEAD | AUTOMATIC WRITE | - | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | unknown | - | - | R-PDIP-T24 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | - | ASYNCHRONOUS | 0.03 mA | 2KX8 | 3-STATE | - | 8 | 0.0001 A | 16384 bit | - | PARALLEL | - | EEPROM | 5 V | - | - | - | - | - | - | - | YES | NO | NO | - | 16 words | - | - | - | - | - | - | ||
WS512K32-55G2UMA Microsemi Corporation | In Stock | - | Datasheet | YES | 68 | 55 ns | - | MICROSEMI CORP | - | 524288 words | 512000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QFP | 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | - | SQUARE | FLATPACK | Transferred | QFP | No | 5 V | - | No | 3A001.A.2.C | - | USER CONFIGURABLE AS 2M X 8 | 8542.32.00.41 | QUAD | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | 68 | S-CQFP-G68 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | ASYNCHRONOUS | - | 512KX32 | - | 3.51 mm | 32 | - | 16777216 bit | MIL-STD-883 | PARALLEL | - | SRAM MODULE | - | - | - | - | - | - | - | 16 | - | - | - | - | - | - | - | - | - | 22.36 mm | 22.36 mm | ||
X25170S8-2.5 IC Microsystems Sdn Bhd | In Stock | - | Datasheet | YES | 8 | - | 5 MHz | IC MICROSYSTEMS SDN BHD | 3 | 2048 words | 2000 | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 2.7 V | e0 | No | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | unknown | - | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | COMMERCIAL | 2.5 V | - | SYNCHRONOUS | 0.005 mA | 2KX8 | - | 1.75 mm | 8 | 0.000001 A | 16384 bit | - | SERIAL | - | EEPROM | - | SPI | 100000 Write/Erase Cycles | 10 ms | 100 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | 4.9 mm | 3.9 mm | ||
NN511662TT-50 United Microelectronics Corporation | In Stock | - | Datasheet | YES | 40 | 50 ns | - | NIPPON STEEL SEMICONDUCTOR CORP | - | 65536 words | 64000 | 70 °C | - | PLASTIC/EPOXY | TSOP | TSOP, TSOP40/44,.46,32 | TSOP40/44,.46,32 | RECTANGULAR | SMALL OUTLINE | Obsolete | - | No | 5 V | e0 | - | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | GULL WING | - | 1 | 0.8 mm | unknown | - | - | R-PDSO-G40 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.14 mA | 64KX16 | 3-STATE | - | 16 | 0.001 A | 1048576 bit | - | - | COMMON | EDO DRAM | - | - | - | - | - | - | - | - | - | - | - | - | - | 256 | - | FAST PAGE WITH EDO | NO | - | - | ||
PRN280 California Micro Devices | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
XL93LC56AP Exel Microelectronics Inc | In Stock | - | Datasheet | NO | 8 | - | 1 MHz | EXEL MICROELECTRONICS INC | - | 128 words | 128 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | - | No | 5 V | e0 | - | - | TIN LEAD | AUTOMATIC WRITE | - | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | unknown | - | - | R-PDIP-T8 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | - | SYNCHRONOUS | 0.005 mA | 128X16 | 3-STATE | - | 16 | 0.000002 A | 2048 bit | - | SERIAL | - | EEPROM | - | MICROWIRE | 100000 Write/Erase Cycles | 10 ms | 10 | SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
X25057MI IC Microsystems Sdn Bhd | In Stock | - | Datasheet | YES | 8 | - | - | IC MICROSYSTEMS SDN BHD | 3 | 512 words | 512 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.19 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | MSOP | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 0.65 mm | unknown | - | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | - | SYNCHRONOUS | 0.003 mA | 512X8 | - | 1.07 mm | 8 | 0.000001 A | 4096 bit | - | SERIAL | - | EEPROM | - | SPI | 100000 Write/Erase Cycles | 10 ms | 100 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | 3 mm | 3 mm | ||
X24C04PM IC Microsystems Sdn Bhd | In Stock | - | Datasheet | NO | 8 | - | 0.1 MHz | IC MICROSYSTEMS SDN BHD | - | 512 words | 512 | 125 °C | -55 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | unknown | - | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | SYNCHRONOUS | 0.003 mA | 512X8 | - | 4.32 mm | 8 | 0.00015 A | 4096 bit | - | SERIAL | - | EEPROM | - | I2C | 100000 Write/Erase Cycles | 10 ms | 100 | SOFTWARE | - | - | - | - | - | - | - | - | 1010DDMR | - | - | 10.03 mm | 7.62 mm |