- Terminal Position
- Memory Size
- Memory Types
- Number of Functions
- Packaging
- Memory Format
- Memory Interface
- Mounting Type
- Operating Temperature
- Package / Case
- Voltage - Supply
- Length
Attribute column
Manufacturer
Micron Technology Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Usage Level | Operating Temperature | Packaging | Published | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Rated DC | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Density | Standby Current-Max | Memory Density | Max Frequency | Screening Level | Access Time (Max) | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Refresh Cycles | Common Flash Interface | Sequential Burst Length | Interleaved Burst Length | Access Mode | Self Refresh | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 N25Q032A13EF640E Micron Technology Inc. | 329 | - | Datasheet | 15 Weeks | - | - | Surface Mount | Surface Mount | 8-VDFN Exposed Pad | - | 8 | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2012 | - | yes | Obsolete | 3 (168 Hours) | 8 | - | - | - | - | - | - | - | - | - | - | - | 2.7V~3.6V | DUAL | - | 260 | 1 | 3V | 1.27mm | - | - | 30 | N25Q032 | - | - | - | - | - | 3/3.3V | - | - | 2.7V | SPI, Serial | - | - | 32Mb 8M x 4 | - | 20mA | - | 108MHz | - | 7 ns | FLASH | SPI | - | 32MX1 | - | - | - | 8ms, 5ms | 22b | 32 Mb | 0.0001A | - | - | - | - | - | - | Synchronous | 8b | - | - | SPI | 100000 Write/Erase Cycles | - | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | 256B | - | - | - | - | - | - | - | - | 850μm | - | 6mm | 5mm | No | No SVHC | ROHS3 Compliant | - | ||
 M25P32-VMW6TG Micron | 1971 | - | - | - | - | - | - | - | - | YES | 8 | - | 8 | - | 50 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | M25P32-VMW6TG | FLASH, NOR | - | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 | SOP8,.31 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 30 | 5.34 | Compliant | Yes | 3 V | - | - | Tape & Reel (TR) | - | - | Yes | - | - | - | - | 3A991.B.1.A | NOR TYPE | - | 85 °C | -40 °C | - | 8542.32.00.51 | Flash Memories | - | CMOS | - | DUAL | GULL WING | 260 | 1 | - | 1.27 mm | compliant | 75 MHz | - | - | 8 | R-PDSO-G8 | Not Qualified | 3.3 V | 3.6 V | 3/3.3 V | INDUSTRIAL | 2.7 V | 2.7 V | SPI, Serial | 3.6 V | 2.7 V | 3.8 MB | - | 12 mA | SYNCHRONOUS | - | 0.015 mA | 8 ns | - | - | - | 4MX8 | TOTEM POLE | 2.5 mm | 8 | - | 22 b | 32 Mb | 0.00005 A | 33554432 bit | - | - | - | SERIAL | - | Synchronous | 8 b | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | - | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | 256 B | - | - | - | - | - | - | - | - | - | - | 5.62 mm | - | No | - | - | - | ||
 MT40A1G4RH-083E:B Micron Technology Inc. | 66 |
| - | - | - | - | - | Surface Mount | 78-TFBGA | YES | - | - | - | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~95°C TC | Tray | 2016 | e1 | - | Obsolete | 3 (168 Hours) | 78 | - | EAR99 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | AUTO/SELF REFRESH | - | - | - | - | 1.14V~1.26V | BOTTOM | - | 260 | 1 | 1.2V | 0.8mm | - | - | 30 | - | - | R-PBGA-B78 | - | 1.2V | 1.26V | - | - | 1.14V | - | - | - | - | 4Gb 1G x 4 | 1 | - | SYNCHRONOUS | 1.2GHz | - | 833 ps | DRAM | Parallel | - | 1GX4 | - | - | 4 | - | - | - | - | 4294967296 bit | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2mm | 10.5mm | 9mm | - | - | ROHS3 Compliant | Lead Free | ||
M29F200FB55N3F2 Micron | In Stock | - | - | - | - | - | - | - | - | YES | - | - | 48 | 55 ns | - | MICRON TECHNOLOGY INC | Micron Technology Inc | M29F200FB55N3F2 | - | - | 131072 words | 128000 | 125 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | NOT SPECIFIED | 5.75 | - | Yes | 5 V | Automotive grade | - | - | - | e3 | Yes | - | - | - | - | EAR99 | NOR TYPE | Matte Tin (Sn) | - | - | BOTTOM BOOT BLOCK | 8542.32.00.51 | Flash Memories | - | CMOS | - | DUAL | GULL WING | NOT SPECIFIED | 1 | - | 0.5 mm | compliant | - | - | - | 48 | R-PDSO-G48 | Not Qualified | - | 5.5 V | 5 V | AUTOMOTIVE | 4.5 V | - | - | - | - | - | - | - | ASYNCHRONOUS | - | 0.03 mA | - | - | - | - | 128KX16 | - | 1.2 mm | 16 | - | - | - | 0.00012 A | 2097152 bit | - | AEC-Q100 | - | PARALLEL | - | - | - | FLASH | 5 V | - | - | - | - | - | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | - | YES | BOTTOM | - | YES | - | - | - | - | - | - | 18.4 mm | 12 mm | - | - | - | - | ||
 NAND512W3A2SZAXE Micron Technology Inc. | 1260 | - | Datasheet | 4 Weeks | - | - | - | Surface Mount | 63-TFBGA | YES | 63 | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2012 | - | - | Obsolete | 3 (168 Hours) | 63 | - | - | - | - | - | - | - | - | - | 3.3V | - | 2.7V~3.6V | BOTTOM | - | - | 1 | 3V | 0.8mm | - | - | - | NAND512 | - | - | - | 3V | - | - | - | - | 3.3V | - | - | - | 512Mb 64M x 8 | - | - | - | - | - | - | FLASH | Parallel | - | 64MX8 | - | - | 8 | 50ns | 26b | 512 Mb | 0.00005A | - | - | - | 35 ns | - | - | - | - | - | - | - | - | - | - | - | - | NO | NO | YES | 4K | 16K | 528B | YES | - | - | - | - | - | - | - | - | 1.05mm | 11mm | - | No | - | ROHS3 Compliant | - | ||
 M29W256GL70ZS6E Micron Technology Inc. | 31 | - | Datasheet | - | - | Copper, Silver, Tin | - | Surface Mount | 64-LBGA | YES | 64 | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2013 | e1 | yes | Obsolete | 3 (168 Hours) | 64 | - | 3A991.B.1.A | - | TIN SILVER COPPER | - | - | - | 8542.32.00.51 | - | - | - | 2.7V~3.6V | BOTTOM | - | 260 | 1 | 3V | 1mm | - | - | 30 | M29W256 | 64 | - | - | - | - | 3/3.3V | - | - | 2.7V | - | - | - | 256Mb 32M x 8 16M x 16 | - | 10mA | - | - | - | - | FLASH | Parallel | - | 16MX16 | - | - | 16 | 70ns | - | 256 Mb | 0.0001A | - | - | - | 70 ns | - | - | Asynchronous | - | - | - | - | - | 0.00007ms | - | - | 8 | YES | YES | YES | 256 | 128K | 8/16words | YES | BOTTOM/TOP | - | YES | - | - | - | - | - | 1.4mm | 13mm | 11mm | No | - | ROHS3 Compliant | - | ||
MT48LC8M16A2TG-75IT:G Micron | 8500 | - | - | - | - | - | Surface Mount | - | - | YES | 54 | - | 54 | 5.4 ns | 133 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT48LC8M16A2TG-75IT:G | - | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | 0.400 INCH, PLASTIC, TSOP2-54 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | 30 | 8.28 | Compliant | No | 3.3 V | - | - | - | - | e0 | - | - | - | - | - | EAR99 | - | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | AUTO/SELF REFRESH | 8542.32.00.02 | DRAMs | - | CMOS | - | DUAL | GULL WING | 235 | 1 | - | 0.8 mm | unknown | - | - | - | 54 | R-PDSO-G54 | Not Qualified | 3.3 V | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | - | - | 3.6 V | 3 V | - | 1 | 150 mA | SYNCHRONOUS | - | 0.31 mA | - | - | - | 16 b | 8MX16 | 3-STATE | 1.2 mm | 16 | - | 14 b | 128 Mb | 0.002 A | 134217728 bit | 133 MHz | - | - | - | COMMON | - | - | SYNCHRONOUS DRAM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 4096 | - | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | - | - | 22.22 mm | 10.16 mm | No | - | - | - | ||
 N25Q128A13ESE40E Micron Technology Inc. | 9000 | - | Datasheet | - | - | - | - | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | YES | 8 | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2012 | - | yes | Obsolete | 3 (168 Hours) | 8 | - | 3A991.B.1.A | - | - | - | - | - | - | - | - | - | 2.7V~3.6V | DUAL | - | 260 | 1 | 3V | 1.27mm | - | - | 30 | N25Q128 | 8 | - | - | - | - | 3/3.3V | - | - | 2.7V | SPI, Serial | - | - | 128Mb 32M x 4 | - | 20mA | - | 108MHz | - | 7 ns | FLASH | SPI | - | - | TOTEM POLE | - | 8 | 8ms, 5ms | 1b | 128 Mb | 0.0001A | - | - | - | - | - | - | Synchronous | - | - | - | SPI | 100000 Write/Erase Cycles | - | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | 256B | - | - | - | - | - | - | - | - | - | 2.16mm | - | - | No | - | ROHS3 Compliant | - | ||
 M29F800FB5AN6E2 Micron Technology Inc. | 1152 | - | Datasheet | 5 Weeks | - | Tin | - | Surface Mount | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Automotive grade | -40°C~85°C TA | Tray | 2009 | e3 | yes | Obsolete | 3 (168 Hours) | 48 | - | EAR99 | - | - | - | - | BOTTOM BOOT BLOCK | 8542.32.00.51 | - | - | - | 4.5V~5.5V | DUAL | - | 260 | 1 | 5V | 0.5mm | - | - | 30 | M29F800 | 48 | - | - | 5V | - | 5V | - | - | 4.5V | - | - | - | 8Mb 1M x 8 512K x 16 | - | 20mA | - | - | - | - | FLASH | Parallel | - | 512KX16 | - | - | 16 | 55ns | - | 8 Mb | 0.00012A | - | - | AEC-Q100 | 55 ns | - | - | Asynchronous | - | - | - | - | - | - | - | - | 8 | YES | YES | YES | 12115 | 16K8K32K64K | - | YES | BOTTOM | - | YES | - | - | - | - | - | 1.2mm | 18.4mm | 12mm | No | - | ROHS3 Compliant | - | ||
N25Q256A13E1240F Micron | In Stock | - | - | - | - | - | - | - | - | YES | - | - | 24 | - | 108 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | N25Q256A13E1240F | - | - | 268435456 words | 256000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | TBGA, BGA24,5X5,40 | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | - | NOT SPECIFIED | 5.74 | - | Yes | 3 V | - | - | - | - | e1 | Yes | - | - | - | - | - | NOR TYPE | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | - | - | CMOS | - | BOTTOM | BALL | NOT SPECIFIED | 1 | - | 1 mm | compliant | - | - | - | - | R-PBGA-B24 | Not Qualified | - | 3.6 V | - | INDUSTRIAL | 2.7 V | - | - | - | - | - | - | - | SYNCHRONOUS | - | 0.02 mA | - | - | - | - | 256MX1 | - | 1.2 mm | 1 | - | - | - | 0.00025 A | 268435456 bit | - | - | - | SERIAL | - | - | - | FLASH | 3 V | SPI | - | - | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8 mm | 6 mm | - | - | - | - | ||
 JS28F128M29EWHA Micron Technology Inc. | 19 | - | Datasheet | 16 Weeks | - | - | - | Surface Mount | 56-TFSOP (0.724, 18.40mm Width) | - | 56 | 56-TSOP | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2012 | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | 85°C | -40°C | - | - | - | - | - | 2.7V~3.6V | - | - | - | - | - | - | - | - | - | JS28F128 | - | - | - | - | - | - | - | - | - | Parallel | - | - | 128Mb 16M x 8 8M x 16 | - | - | - | - | - | 70ns | FLASH | Parallel | - | - | - | - | - | 70ns | - | 128 Mb | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No | - | ROHS3 Compliant | - | ||
 MT28EW128ABA1HPC-1SIT Micron Technology Inc. | In Stock | - | Datasheet | - | - | - | - | Surface Mount | 64-LBGA | YES | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | - | e1 | - | Obsolete | 3 (168 Hours) | 64 | - | 3A991.B.1.A | - | TIN SILVER COPPER | - | - | - | 8542.32.00.51 | - | - | - | 2.7V~3.6V | BOTTOM | - | 260 | 1 | 3V | 1mm | - | - | 30 | - | - | R-PBGA-B64 | - | - | 3.6V | - | - | 2.7V | - | - | - | - | 128Mb 16M x 8 8M x 16 | - | - | ASYNCHRONOUS | - | - | 95ns | FLASH | Parallel | - | 8MX16 | - | - | 16 | 60ns | - | - | - | 134217728 bit | - | - | - | - | - | - | - | - | 3V | - | - | - | - | - | 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4mm | 13mm | 11mm | - | - | ROHS3 Compliant | - | ||
MT42L64M64D2KH-18IT:A Micron | In Stock | - | - | - | - | - | - | - | - | YES | - | - | 216 | - | - | MICRON TECHNOLOGY INC | Micron Technology Inc | MT42L64M64D2KH-18IT:A | - | - | 67108864 words | 64000000 | - | - | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | - | NOT SPECIFIED | 5.57 | - | Yes | 1.8 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SELF REFRESH; IT ALSO REQUIRES 1.2V NOM | - | - | - | CMOS | - | BOTTOM | BALL | NOT SPECIFIED | 1 | - | 0.4 mm | compliant | - | - | - | - | S-PBGA-B216 | - | - | 1.95 V | - | - | 1.7 V | - | - | - | - | - | 1 | - | SYNCHRONOUS | - | - | - | - | - | - | 64MX64 | - | 0.8 mm | 64 | - | - | - | - | 4294967296 bit | - | - | - | - | - | - | - | DDR DRAM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MULTI BANK PAGE BURST | YES | - | - | 12 mm | 12 mm | - | - | - | - | ||
MT46H8M32LFB5-10IT:A Micron | In Stock | - | - | - | - | - | - | - | - | YES | - | - | 90 | 7 ns | - | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46H8M32LFB5-10IT:A | - | - | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | - | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 30 | 5.69 | - | Yes | 1.8 V | - | - | - | - | e1 | - | - | - | - | - | EAR99 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | AUTO/SELF REFRESH | 8542.32.00.24 | - | - | CMOS | - | BOTTOM | BALL | 260 | 1 | - | 0.8 mm | unknown | - | - | - | 90 | R-PBGA-B90 | Not Qualified | - | 1.95 V | - | INDUSTRIAL | 1.7 V | - | - | - | - | - | 1 | - | SYNCHRONOUS | - | - | - | - | - | - | 8MX32 | - | 1 mm | 32 | - | - | - | - | 268435456 bit | - | - | - | - | - | - | - | DDR DRAM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FOUR BANK PAGE BURST | YES | - | - | 13 mm | 8 mm | - | - | - | - | ||
MT41K256M32SLD-125M:E Micron | In Stock | - | - | - | - | - | - | - | - | YES | - | - | 136 | - | - | MICRON TECHNOLOGY INC | Micron Technology Inc | MT41K256M32SLD-125M:E | - | - | 268435456 words | 256000000 | 85 °C | - | PLASTIC/EPOXY | TFBGA | TFBGA, | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | - | 5.72 | - | - | 1.35 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | AUTO/SELF REFRESH | - | - | - | CMOS | - | BOTTOM | BALL | - | 1 | - | 0.8 mm | compliant | - | - | - | - | R-PBGA-B136 | - | - | 1.45 V | - | OTHER | 1.283 V | - | - | - | - | - | 1 | - | SYNCHRONOUS | - | - | - | - | - | - | 256MX32 | - | 1.2 mm | 32 | - | - | - | - | 8 | - | - | - | - | - | - | - | DDR DRAM MODULE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SINGLE BANK PAGE BURST | YES | - | - | 14 mm | 10 mm | - | - | - | - | ||
 M29W800DT70ZE6E Micron Technology Inc. | 2900 | - | Datasheet | 4 Weeks | - | - | - | Surface Mount | 48-TFBGA | - | 48 | 48-TFBGA (6x8) | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2004 | - | - | Obsolete | 3 (168 Hours) | - | SMD/SMT | - | - | - | 85°C | -40°C | - | - | - | - | - | 2.7V~3.6V | - | - | - | - | - | - | - | - | - | M29W800 | - | - | - | - | - | - | - | - | 2.7V | Parallel | 3.6V | 2.7V | 8Mb 1M x 8 512K x 16 | - | 10mA | - | - | - | 70ns | FLASH | Parallel | - | - | - | - | - | 70ns | - | 8 Mb | - | - | - | - | - | - | - | Asynchronous | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No | No SVHC | ROHS3 Compliant | - | ||
M29W128GH70N6F Micron | 120000 | - | - | - | EOL (Last Updated: 2 years ago) | - | - | - | - | YES | 56 | - | 56 | 70 ns | - | STMICROELECTRONICS | STMicroelectronics | M29W128GH70N6F | FLASH, NOR | - | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 14 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | TSOP | 40 | 5.34 | Compliant | Yes | 3 V | - | - | Tape & Reel | - | e3/e6 | - | - | - | - | - | 3A991.B.1.A | NOR TYPE | MATTE TIN/TIN BISMUTH | 85 °C | -40 °C | - | 8542.32.00.51 | Flash Memories | - | CMOS | - | DUAL | GULL WING | 260 | 1 | - | 0.5 mm | compliant | - | - | - | 56 | R-PDSO-G56 | Not Qualified | - | 3.6 V | 3/3.3 V | INDUSTRIAL | 2.7 V | 3 V | Parallel | 3.6 V | 2.7 V | - | - | 10 mA | ASYNCHRONOUS | - | 0.02 mA | 70 ns | - | - | - | 8MX16 | - | 1.2 mm | 16 | - | - | 128 Mb | 0.0001 A | 134217728 bit | - | - | - | PARALLEL | - | Asynchronous | - | FLASH | 3 V | - | - | - | - | - | 8 | YES | YES | YES | 128 | 128K | 8/16 words | YES | - | - | YES | - | - | - | - | - | - | 18.4 mm | 14 mm | No | - | - | - | ||
 M29W800DB45N6E Micron Technology Inc. | In Stock | - | Datasheet | 20 Weeks | - | - | - | Surface Mount | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2008 | e3 | yes | Obsolete | 3 (168 Hours) | 48 | SMD/SMT | EAR99 | - | MATTE TIN | - | - | BOTTOM BOOT BLOCK | 8542.32.00.51 | - | - | - | 2.7V~3.6V | DUAL | - | 260 | 1 | 3.3V | 0.5mm | - | - | 30 | M29W800 | 48 | - | - | - | - | 3.3V | - | - | 2.7V | - | - | - | 8Mb 1M x 8 512K x 16 | - | 10mA | - | - | - | - | FLASH | Parallel | - | 512KX16 | - | - | 16 | 45ns | - | 8 Mb | 0.0001A | - | - | - | 45 ns | - | - | Asynchronous | - | - | - | - | - | - | - | - | 8 | YES | YES | YES | 12115 | 16K8K32K64K | - | YES | BOTTOM | - | YES | - | - | - | - | - | 1.2mm | 18.4mm | 12mm | No | No SVHC | ROHS3 Compliant | - | ||
 N25Q512A13G1240E Micron Technology Inc. | 2134 | - | Datasheet | - | - | - | - | Surface Mount | 24-TBGA | YES | 24 | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2013 | e1 | yes | Obsolete | 3 (168 Hours) | 24 | - | 3A991.B.1.A | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.32.00.51 | - | - | - | 2.7V~3.6V | BOTTOM | - | - | 1 | 3V | 1mm | - | - | - | N25Q512 | - | - | - | 3V | - | - | - | - | 2.7V | SPI, Serial | - | - | 512Mb 128M x 4 | - | 20mA | - | 108MHz | - | - | FLASH | SPI | - | 64MX8 | - | - | 8 | 8ms, 5ms | 1b | 512 Mb | 0.0005A | - | - | - | - | - | - | Synchronous | - | - | - | SPI | 100000 Write/Erase Cycles | - | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | 256B | - | - | - | - | - | - | - | - | - | 1.2mm | 8mm | - | No | - | ROHS3 Compliant | - | ||
MT45V512KW16PEGA-70WT Micron | In Stock | - | - | - | - | - | - | - | - | YES | - | - | 48 | 70 ns | - | MICRON TECHNOLOGY INC | Micron Technology Inc | MT45V512KW16PEGA-70WT | - | - | 524288 words | 512000 | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA48,6X8,30 | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | - | 5.84 | - | Yes | 3 V | - | - | - | - | e1 | - | - | - | - | - | 3A991.B.2.A | - | TIN SILVER COPPER | - | - | - | 8542.32.00.41 | Other Memory ICs | - | CMOS | - | BOTTOM | BALL | - | 1 | - | 0.75 mm | unknown | - | - | - | 48 | R-PBGA-B48 | Not Qualified | - | 3.6 V | 3/3.3 V | OTHER | 2.7 V | - | - | - | - | - | - | - | ASYNCHRONOUS | - | 0.03 mA | - | - | - | - | 512KX16 | 3-STATE | 1 mm | 16 | - | - | - | 0.00015 A | 8388608 bit | - | - | - | PARALLEL | COMMON | - | - | PSEUDO STATIC RAM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8 mm | 6 mm | - | - | - | - |