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Micron Technology Memory Cards
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Mount | Surface Mount | Number of Pins | Number of Terminals | Access Time-Max | CAS Latency | Chip Configuration | Chip Density (bit) | Clock Frequency-Max (fCLK) | Data Bus Width (bit) | ECC Support | ECCN (US) | HTS | Ihs Manufacturer | Lead Shape | Manufacturer | Manufacturer Part Number | Max. Access Time (ns) | Maximum Clock Rate (MHz) | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Memory Types | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Module | Module Density | Module Sides | Mounting | Number of Elements | Number of Chip Banks | Number of Chip per Module | Number of Ranks | Number of Words | Number of Words Code | Operating Current (mA) | Operating Temperature-Max | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Height | Package Length | Package Shape | Package Style | Package Width | Part Life Cycle Code | Part Package Code | PC Type | PCB changed | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | SPD EEPROM Support | Standard Package Name | Supplier Package | Supplier Temperature Grade | Supply Voltage-Nom (Vsup) | Typical Operating Supply Voltage (V) | Operating Temperature | Packaging | Published | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Speed | Operating Mode | Supply Current-Max | Access Time | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Density | Standby Current-Max | Memory Density | Max Frequency | PLL | I/O Type | Memory IC Type | Refresh Cycles | Access Mode | Self Refresh | Module Type | Length | Width | Radiation Hardening | RoHS Status |
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 SMC256BFJ6E Micron Technology Inc. | In Stock | - | Datasheet | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | CompactFlash® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C | - | 2008 | - | Obsolete | 1 (Unlimited) | - | - | 85°C | -40°C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 256MB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 SMC04GBFK6E Micron Technology Inc. | In Stock | - | Datasheet | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | CompactFlash® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C | - | 2008 | - | Obsolete | 1 (Unlimited) | - | - | 85°C | -40°C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 4GB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 SMS01GDFB5E Micron Technology Inc. | In Stock | - | - | Socket | - | 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | microSD™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -25°C~85°C | - | 2008 | - | Obsolete | 3 (168 Hours) | - | - | 85°C | -25°C | - | - | - | - | - | - | - | - | - | - | - | - | 3.3V | - | - | - | - | 3.6V | 2.7V | 1GB | - | Class 2 | - | - | - | - | - | - | - | - | 8 Gb | - | - | - | - | - | - | - | - | - | - | - | - | No | ROHS3 Compliant | ||
 SMC02GBFK6E Micron Technology Inc. | In Stock | - | Datasheet | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | CompactFlash® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C | - | 2008 | - | Obsolete | 1 (Unlimited) | - | - | 85°C | -40°C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2GB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MT36VDDT51272Y-335A2 Micron Technology | In Stock | - | Datasheet | - | - | - | - | - | 2.5 | 256Mx4 | 1G | - | 72 | Yes | EAR99 | - | - | No Lead | - | - | - | 333 | 2.7 | 70 | - | 2.3 | 0 | DRAM Module | 4Gbyte | Double | Socket | - | 4 | 36 | Dual | - | - | 4320 | - | - | - | - | - | 30.63(Max) | 133.5(Max) | - | - | 6.81(Max) | - | - | PC-2700 | 184 | - | - | - | - | - | Yes | DIM | RDIMM | Commercial | - | 2.5 | - | Tray | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 184 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 512Mx72 | - | - | - | - | - | - | - | Yes | - | - | 8K | - | Yes | 184RDIMM | - | - | - | Yes with exemptions | ||
MT18JDF1G72PDZ-1G6D1 Micron Technology | In Stock | - | Datasheet | Socket | NO | 240 | 240 | - | 11 | 512Mx8 | 4G | - | 72 | Yes | EAR99 | - | MICRON TECHNOLOGY INC | No Lead | Micron Technology Inc | MT18JDF1G72PDZ-1G6D1 | - | 1600 | 1.575 | 70 | - | 1.425 | 0 | DRAM Module | 8Gbyte | Double | Socket | 18 | 8 | 18 | Dual | 1073741824 words | 1000000000 | 1863 | 70 °C | UNSPECIFIED | DIMM | DIMM, | - | 18.9(Max) | 133.5(Max) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | 4(Max) | Obsolete | DIMM | PC3-12800 | 240 | NOT SPECIFIED | 5.66 | Compliant | Yes | 8473300002 | Yes | DIM | VLP RDIMM | Commercial | 1.5 V | 1.5 | - | - | - | - | Obsolete | - | EAR99 | - | 70 °C | 0 °C | AUTO/SELF REFRESH | 8542.32.00.36 | CMOS | DUAL | NO LEAD | NOT SPECIFIED | 1 | 1 mm | unknown | 240 | R-XDMA-N240 | - | 1.5 V | 1.575 V | - | COMMERCIAL | 1.425 V | 1.575 V | 1.425 V | - | 1 | - | SYNCHRONOUS | - | - | - | 1Gx72 | - | 18.9 mm | 72 | - | - | 77309411328 bit | 1.6 GHz | Yes | - | DDR DRAM MODULE | 8K | DUAL BANK PAGE BURST | Yes | 240RDIMM | 133.35 mm | - | - | Yes with exemptions | ||
 MT4HTF6464HY-667G1 Micron Technology | In Stock | - | Datasheet | - | - | - | - | - | 5 | 64Mx16 | 1G | - | 64 | No | EAR99 | 8542.32.00.02 | - | No Lead | - | - | - | 667 | 1.9 | 70 | - | 1.7 | 0 | DRAM Module | 512Mbyte | Single | Socket | - | 8 | 4 | Single | - | - | - | - | - | - | - | - | 30(Max) | 67.75(Max) | - | - | 2.45(Max) | - | - | PC2-5300 | 200 | - | - | - | - | - | Yes | DIM | SODIMM | Commercial | - | 1.8 | - | Tray | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 200 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 64Mx64 | - | - | - | - | - | - | - | No | - | - | 8K | - | Yes | 200SODIMM | - | - | - | Yes with exemptions | ||
MT4HTF3264HY-667F1 Micron Technology | In Stock | - | Datasheet | Socket | NO | 200 | 200 | 0.45 ns | 5 | 32Mx16 | 512M | 333 MHz | 64 | No | EAR99 | 8542.32.00.32 | MICRON TECHNOLOGY INC | No Lead | Micron Technology Inc | MT4HTF3264HY-667F1 | - | 667 | 1.9 | 70 | - | 1.7 | 0 | DRAM Module | 256Mbyte | Single | Socket | 4 | 4 | 4 | Single | 33554432 words | 32000000 | 1000 | 70 °C | PLASTIC/EPOXY | DIMM | - | DIMM200,24 | 30(Max) | 67.75(Max) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | 2.45(Max) | Obsolete | - | PC2-5300 | 200 | - | 5.84 | Compliant | Yes | - | Yes | DIM | SODIMM | Commercial | 1.8 V | 1.8 | - | Tray | - | - | Obsolete | - | - | - | 70 °C | 0 °C | - | - | CMOS | DUAL | NO LEAD | - | - | 0.6 mm | unknown | 200 | R-PDMA-N200 | Not Qualified | 1.8 V | - | 1.8 V | COMMERCIAL | - | 1.9 V | 1.7 V | - | - | - | - | 1.4 mA | - | 64 b | 32Mx64 | 3-STATE | - | 64 | - | 0.028 A | 2147483648 bit | 667 MHz | No | COMMON | DDR DRAM MODULE | 8K | - | Yes | 200SODIMM | - | - | No | RoHS Compliant | ||
 MT8JTF51264HDZ-1G4D1 Micron Technology | In Stock | - | Datasheet | - | - | - | - | - | 9 | 256Mx16 | 4G | - | 64 | No | EAR99 | 8473.30.11.40 | - | No Lead | - | - | - | 1333 | 1.575 | 70 | - | 1.425 | 0 | DRAM Module | 4Gbyte | Double | Socket | - | 8 | 8 | Dual | - | - | 1040 | - | - | - | - | - | 30.15(Max) | 67.75(Max) | - | - | 3.8(Max) | - | - | PC3-10600 | 204 | - | - | - | - | - | Yes | DIM | SODIMM | Commercial | - | 1.5 | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 204 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 512Mx64 | - | - | - | - | - | - | - | No | - | - | 8K | - | Yes | 204SODIMM | - | - | - | Yes with exemptions | ||
MT8HTF12864HZ-800G1 Micron Technology | In Stock | - | Datasheet | - | - | - | - | - | 6 | 128Mx8 | 1G | - | 64 | No | EAR99 | - | - | No Lead | - | - | - | 800 | 1.9 | 70 | - | 1.7 | 0 | DRAM Module | 1Gbyte | Double | Socket | - | 8 | 8 | Single | - | - | 1280 | - | - | - | - | - | 30.15(Max) | 67.75(Max) | - | - | 3.8(Max) | - | - | PC2-6400 | 200 | - | - | - | - | - | Yes | DIM | SODIMM | Commercial | - | 1.8 | - | Tray | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 200 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 128Mx64 | - | - | - | - | - | - | - | No | - | - | 8K | - | Yes | 200SODIMM | - | - | - | Yes with exemptions | ||
MT16KTF1G64AZ-1G4E1 Micron Technology | In Stock | - | Datasheet | - | NO | - | 240 | - | 9 | 512Mx8 | 4G | - | 64 | No | EAR99 | - | MICRON TECHNOLOGY INC | No Lead | Micron Technology Inc | MT16KTF1G64AZ-1G4E1 | - | 1333 | 1.45/1.575 | 70 | - | 1.283/1.425 | 0 | DRAM Module | 8Gbyte | Double | Socket | - | - | 18 | Dual | 1073741824 words | 1000000000 | 1248 | 70 °C | UNSPECIFIED | DIMM | DIMM, | - | 30.5(Max) | 133.5(Max) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | 4(Max) | Obsolete | DIMM | PC3-10600 | 240 | - | 5.67 | - | - | - | Yes | DIM | UDIMM | Commercial | 1.35 V | 1.35/1.5 | - | - | - | e4 | Obsolete | - | EAR99 | GOLD | - | - | AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX | 8542.32.00.36 | CMOS | DUAL | NO LEAD | - | 1 | 1 mm | unknown | 240 | R-XDMA-N240 | - | - | 1.45 V | - | COMMERCIAL | 1.283 V | - | - | - | 1 | - | SYNCHRONOUS | - | - | - | 1Gx64 | - | 30.5 mm | 64 | - | - | 68719476736 bit | - | No | - | DDR DRAM MODULE | 8K | DUAL BANK PAGE BURST | Yes | 240UDIMM | 133.35 mm | 4 mm | - | Supplier Unconfirmed | ||
MT18KSF51272HZ-1G4K1 Micron Technology | In Stock | - | Datasheet | - | NO | - | 204 | - | 9 | 256Mx8 | 2G | - | 72 | Yes | EAR99 | - | MICRON TECHNOLOGY INC | No Lead | Micron Technology Inc | MT18KSF51272HZ-1G4K1 | - | 1333 | 1.45 | 70 | - | 1.283 | 0 | DRAM Module | 4Gbyte | Double | Socket | - | 8 | 18 | Dual | 536870912 words | 512000000 | 873 | 70 °C | UNSPECIFIED | DIMM | HALOGEN FREE, SODIMM-204 | - | 30.15(Max) | 67.75(Max) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | 3.8(Max) | Active | - | PC3-10600 | 204 | - | 5.71 | - | - | - | Yes | DIM | SODIMM | Commercial | 1.35 V | 1.35 | - | - | - | - | Obsolete | - | EAR99 | - | - | - | AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX | 8542.32.00.36 | CMOS | DUAL | NO LEAD | - | 1 | - | compliant | 204 | R-XDMA-N204 | - | - | 1.45 V | - | COMMERCIAL | 1.283 V | - | - | - | 1 | - | SYNCHRONOUS | - | - | - | 512Mx72 | - | 30.15 mm | 72 | - | - | 4 | - | No | - | DDR DRAM MODULE | 8K | DUAL BANK PAGE BURST | Yes | 204SODIMM | 67.6 mm | 3.8 mm | - | Yes with exemptions | ||
MT16LSDT3264AY-13EG3 Micron Technology | In Stock | - | Datasheet | Socket | - | 168 | - | - | 2 | 16Mx8 | 128M | - | 64 | No | EAR99 | - | - | No Lead | - | - | 5.4 | 133 | 3.6 | 65 | - | 3 | 0 | DRAM Module | 256Mbyte | - | Socket | 16 | - | 16 | Dual | - | - | 1336 | - | - | - | - | - | 35.05(Max) | 133.5(Max) | - | - | 3.99(Max) | - | - | - | 168 | - | - | Compliant | - | - | - | DIM | DIMM | Commercial | - | 3.3 | - | Tray | - | - | Obsolete | - | - | - | 65 °C | 0 °C | - | - | - | - | - | - | - | - | - | 168 | - | - | 3.3 V | - | - | - | - | 3.6 V | 3 V | - | - | - | - | - | 5.4 ns | 64 b | 32Mx64 | - | - | - | - | - | - | 133 MHz | - | - | - | - | - | - | 168UDIMM | - | - | No | Yes with exemptions | ||
MT18JSF51272AZ-1G4M1 Micron Technology | In Stock | - | Datasheet | - | - | - | - | - | 9 | 256Mx8 | 2G | - | 72 | Yes | EAR99 | 8542.32.00.71 | - | No Lead | - | - | - | 1333 | 1.575 | 70 | - | 1.425 | 0 | DRAM Module | 4Gbyte | Double | Socket | - | 8 | 18 | Dual | - | - | 2133 | - | - | - | - | - | 30.5(Max) | 133.5(Max) | - | - | 4(Max) | - | - | PC3-10600 | 240 | - | - | - | - | - | Yes | DIM | UDIMM | Commercial | - | 1.5 | - | Tray | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 240 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 512Mx72 | - | - | - | - | - | - | - | No | - | - | 8K | - | Yes | 240UDIMM | - | - | - | Yes with exemptions | ||
MT4LSDT1664AG-133G1 Micron Technology | In Stock | - | Datasheet | - | NO | - | 168 | 5.4 ns | 3 | 16Mx16 | 256M | 133 MHz | 64 | No | EAR99 | - | MICRON TECHNOLOGY INC | No Lead | Micron Technology Inc | MT4LSDT1664AG-133G1 | 5.4 | 133 | 3.6 | 65 | - | 3 | 0 | DRAM Module | 128Mbyte | Single | Socket | - | 4 | 4 | Single | 16777216 words | 16000000 | 540 | 65 °C | PLASTIC/EPOXY | DIMM | DIMM, DIMM168 | DIMM168 | 25.53(Max) | 133.5(Max) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | 3.18(Max) | Active | - | PC-133 | 168 | - | 5.68 | - | Yes | - | Yes | DIM | DIMM | Commercial | 3.3 V | 3.3 | - | Tray | - | - | Unconfirmed | - | - | - | - | - | - | - | CMOS | DUAL | NO LEAD | - | - | 1.27 mm | compliant | 168 | R-PDMA-N168 | Not Qualified | - | - | 3.3 V | COMMERCIAL | - | - | - | - | - | - | - | 1.08 mA | - | - | 16Mx64 | 3-STATE | - | 64 | - | 0.008 A | 1073741824 bit | - | No | COMMON | SYNCHRONOUS DRAM MODULE | 8K | - | Yes | 168UDIMM | - | - | - | RoHS non-compliant | ||
MT18JDF51272PDZ-1G6D1 Micron Technology | In Stock | - | Datasheet | - | - | - | - | - | 11 | 256Mx8 | 2G | - | 72 | Yes | EAR99 | - | - | No Lead | - | - | - | 1600 | 1.575 | 70 | - | 1.425 | 0 | DRAM Module | 4Gbyte | Double | Socket | - | 8 | 18 | Dual | - | - | 1773 | - | - | - | - | - | 18.9(Max) | 133.5(Max) | - | - | 4(Max) | - | - | PC3-12800 | 240 | - | - | - | - | - | Yes | DIM | VLP RDIMM | Commercial | - | 1.5 | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 240 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 512Mx72 | - | - | - | - | - | - | - | - | - | - | 8K | - | Yes | 240RDIMM | - | - | - | Yes with exemptions | ||
MT36JDZS51272PZ-1G4F1 Micron Technology | In Stock | - | Datasheet | - | - | - | - | - | 9 | 256Mx4 | 1G | - | 72 | Yes | 4A994.a | - | - | No Lead | - | - | - | 1333 | - | 95 | - | - | 0 | DRAM Module | 4Gbyte | - | Socket | - | - | 36 | Dual | - | - | - | - | - | - | - | - | 18.9(Max) | 133.5(Max) | - | - | 8.61(Max) | - | - | PC3-10600 | 240 | - | - | - | - | - | - | DIM | VLP RDIMM | - | - | 1.5 | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 240 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 512Mx72 | - | - | - | - | - | - | - | - | - | - | - | - | - | 240RDIMM | - | - | - | Yes with exemptions | ||
MT4LSDT864AG-10EG2 Micron Technology | In Stock | - | Datasheet | - | - | - | - | - | 2 | 8Mx16 | 128M | - | 64 | No | EAR99 | - | - | No Lead | - | - | 6 | 100 | 3.6 | 65 | - | 3 | 0 | DRAM Module | 64Mbyte | - | Socket | - | - | 4 | Single | - | - | 560 | - | - | - | - | - | 25.53(Max) | 133.5(Max) | - | - | 3.18(Max) | - | - | - | 168 | - | - | - | - | - | - | DIM | DIMM | Commercial | - | 3.3 | - | Tray | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 168 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8Mx64 | - | - | - | - | - | - | - | - | - | - | - | - | - | 168UDIMM | - | - | - | RoHS non-compliant | ||
MTA18ADF4G72PZ-3G2B1.001 Micron Technology | In Stock | - | Datasheet | - | - | - | - | - | 22 | 4Gx4 | 16G | - | 72 | Yes | 4A994.a | 8473.30.11.40 | - | - | - | - | - | 3200 | 1.26 | 95 | - | 1.14 | 0 | DRAM Module | 32Gbyte | Double | Socket | - | 16 | - | Single | - | - | 3096 | - | - | - | - | - | 18.9(Max) | 133.48(Max) | - | - | 3.9(Max) | - | - | PC4-3200 | 288 | - | - | - | - | - | Yes | - | VLP RDIMM | Commercial | - | 1.2 | - | - | - | - | NRND | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 288 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 4Gx72 | - | - | - | - | - | - | - | Yes | - | - | - | - | Yes | 288VLP RDIMM | - | - | - | - | ||
MT8VDDT3264AY-40BGB Micron Technology | In Stock | - | Datasheet | - | - | - | - | - | 3 | 32Mx8 | 256M | - | 64 | No | EAR99 | - | - | No Lead | - | - | - | 400 | 2.7 | 70 | - | 2.5 | 0 | DRAM Module | 256Mbyte | - | Socket | - | - | 8 | Single | - | - | 1600 | - | - | - | - | - | 28.7(Max) | 133.5(Max) | - | - | 3.18(Max) | - | - | - | 184 | - | - | - | - | - | - | DIM | UDIMM | Commercial | - | 2.6 | - | Tray | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 184 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 32Mx64 | - | - | - | - | - | - | - | - | - | - | - | - | - | 184UDIMM | - | - | - | Yes with exemptions |