- ECCN Code
- HTS Code
- Ihs Manufacturer
- Memory IC Type
- Package Description
- Part Life Cycle Code
- Reach Compliance Code
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Micron Technology Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Ihs Manufacturer | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Memory IC Type | Mixed Memory Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 RD38F2030W0ZTQ0 Micron Technology Inc | In Stock | - | Datasheet | YES | 88 | - | MICRON TECHNOLOGY INC | - | - | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA88,8X12,32 | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | - | No | - | - | - | EAR99 | - | - | 8542.32.00.71 | BOTTOM | BALL | - | - | 0.8 mm | unknown | - | - | R-PBGA-B88 | Not Qualified | - | OTHER | - | - | 0.055 mA | - | - | - | 0.000005 A | - | MEMORY CIRCUIT | FLASH+PSRAM | - | - | ||
NAND98R3M0AZBB5E Micron Technology Inc | In Stock | - | Datasheet | YES | 107 | - | MICRON TECHNOLOGY INC | - | - | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA107,10X14,32 | BGA107,10X14,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | - | Yes | 1.8 V | - | - | EAR99 | - | - | 8542.32.00.71 | BOTTOM | BALL | - | - | 0.8 mm | compliant | - | - | R-PBGA-B107 | Not Qualified | - | OTHER | - | - | - | - | - | - | - | - | MEMORY CIRCUIT | FLASH+SDRAM | - | - | ||
 PF38F5060M0Y0B0 Micron Technology Inc | In Stock | - | Datasheet | YES | 105 | 96 ns | MICRON TECHNOLOGY INC | 33554432 words | 32000000 | 85 °C | -30 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA105,9X12,32 | BGA105,9X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | - | Yes | EAR99 | - | PSEUDO SRAM IS ORGANIZED AS 8M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 30 | 105 | R-PBGA-B105 | Not Qualified | 2 V | OTHER | 1.7 V | SYNCHRONOUS | - | 32MX16 | 1.2 mm | 16 | 0.00016 A | 536870912 bit | MEMORY CIRCUIT | FLASH+PSRAM | 11 mm | 9 mm | ||
MT42C4064-12 Micron Technology Inc | In Stock | - | Datasheet | NO | 24 | 120 ns | MICRON TECHNOLOGY INC | 65536 words | 64000 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP-24 | DIP24,.4 | RECTANGULAR | IN-LINE | Active | - | No | 5 V | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.71 | DUAL | THROUGH-HOLE | - | - | 2.54 mm | unknown | - | - | R-PDIP-T24 | Not Qualified | - | COMMERCIAL | - | - | 0.06 mA | 64KX4 | - | 4 | 0.004 A | 262144 bit | MEMORY CIRCUIT | - | - | - | ||
NAND99W3M1BZBC5E Micron Technology Inc | In Stock | - | Datasheet | YES | 137 | - | MICRON TECHNOLOGY INC | - | - | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA137,10X15,32 | BGA137,10X15,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | - | Yes | 3 V | - | - | EAR99 | - | - | 8542.32.00.71 | BOTTOM | BALL | - | - | 0.8 mm | compliant | - | - | R-PBGA-B137 | Not Qualified | - | OTHER | - | - | - | - | - | - | - | - | MEMORY CIRCUIT | FLASH+SDRAM | - | - | ||
PF38F2040W0YTQ0 Micron Technology Inc | In Stock | - | Datasheet | YES | 88 | 70 ns | MICRON TECHNOLOGY INC | - | - | - | - | PLASTIC/EPOXY | FBGA | FBGA, BGA88,8X12,32 | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | - | Yes | 1.8 V | - | - | EAR99 | - | - | 8542.32.00.71 | BOTTOM | BALL | - | - | 0.8 mm | compliant | - | - | R-PBGA-B88 | Not Qualified | - | - | - | - | 0.035 mA | - | - | - | 0.00011 A | - | MEMORY CIRCUIT | FLASH+PSRAM | - | - | ||
RD38F2040W0YTQ0 Micron Technology Inc | In Stock | - | Datasheet | YES | 88 | 70 ns | MICRON TECHNOLOGY INC | - | - | - | - | PLASTIC/EPOXY | FBGA | FBGA, BGA88,8X12,32 | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | - | No | 1.8 V | - | - | EAR99 | - | - | 8542.32.00.71 | BOTTOM | BALL | - | - | 0.8 mm | unknown | - | - | R-PBGA-B88 | Not Qualified | - | - | - | - | 0.035 mA | - | - | - | 0.00011 A | - | MEMORY CIRCUIT | FLASH+PSRAM | - | - | ||
M36L0R8060T1ZAQE Micron Technology Inc | In Stock | - | Datasheet | YES | 88 | - | MICRON TECHNOLOGY INC | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | Yes | EAR99 | TIN SILVER COPPER | PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | - | 1 | 0.8 mm | compliant | - | 88 | R-PBGA-B88 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | - | 16MX16 | 1.2 mm | 16 | - | 268435456 bit | MEMORY CIRCUIT | - | 10 mm | 8 mm | ||
MT42L2DALG-DC Micron Technology Inc | In Stock | - | - | - | - | - | MICRON TECHNOLOGY INC | - | - | - | - | - | - | , | - | - | - | Contact Manufacturer | - | - | - | - | - | EAR99 | - | - | 8542.32.00.71 | - | - | - | - | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MEMORY CIRCUIT | - | - | - | ||
NAND98R3M2AZBB5E Micron Technology Inc | In Stock | - | Datasheet | YES | 107 | - | MICRON TECHNOLOGY INC | - | - | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA107,10X14,32 | BGA107,10X14,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | - | Yes | 1.8 V | - | - | EAR99 | - | - | 8542.32.00.71 | BOTTOM | BALL | - | - | 0.8 mm | compliant | - | - | R-PBGA-B107 | Not Qualified | - | OTHER | - | - | - | - | - | - | - | - | MEMORY CIRCUIT | FLASH+SDRAM | - | - | ||
NAND98W3M1AZBC5E Micron Technology Inc | In Stock | - | Datasheet | YES | 137 | - | MICRON TECHNOLOGY INC | - | - | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA137,10X15,32 | BGA137,10X15,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | - | Yes | 3 V | - | - | EAR99 | - | - | 8542.32.00.71 | BOTTOM | BALL | - | - | 0.8 mm | compliant | - | - | R-PBGA-B137 | Not Qualified | - | OTHER | - | - | - | - | - | - | - | - | MEMORY CIRCUIT | FLASH+SDRAM | - | - | ||
PF38F5070M0Y0V0 Micron Technology Inc | In Stock | - | Datasheet | YES | 165 | 96 ns | MICRON TECHNOLOGY INC | - | - | - | - | PLASTIC/EPOXY | FBGA | FBGA, BGA165,12X15,25 | BGA165,12X15,25 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | - | Yes | 1.8 V | - | - | EAR99 | - | - | 8542.32.00.71 | BOTTOM | BALL | - | - | 0.635 mm | compliant | - | - | R-PBGA-B165 | Not Qualified | - | - | - | - | - | - | - | - | 0.00016 A | - | MEMORY CIRCUIT | FLASH+PSRAM | - | - | ||
RD38F3040L0YTQ0 Micron Technology Inc | In Stock | - | Datasheet | YES | 88 | 88 ns | MICRON TECHNOLOGY INC | - | - | - | - | PLASTIC/EPOXY | FBGA | FBGA, BGA88,8X12,32 | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | - | No | 1.8 V | - | - | EAR99 | - | - | 8542.32.00.71 | BOTTOM | BALL | - | - | 0.8 mm | unknown | - | - | R-PBGA-B88 | Not Qualified | - | - | - | - | 0.035 mA | - | - | - | - | - | MEMORY CIRCUIT | FLASH+PSRAM | - | - | ||
M36W0R6050B1ZAQF Micron Technology Inc | In Stock | - | Datasheet | YES | 88 | 70 ns | MICRON TECHNOLOGY INC | 4194304 words | 4000000 | 85 °C | -30 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA88,8X12,32 | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | Yes | EAR99 | TIN SILVER COPPER | PSRAM IS ORGANIZED AS 2M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | - | 1 | 0.8 mm | compliant | - | 88 | R-PBGA-B88 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | - | 4MX16 | 1.2 mm | 16 | - | 67108864 bit | MEMORY CIRCUIT | FLASH+PSRAM | 10 mm | 8 mm | ||
RD38F3352LLZDQ0 Micron Technology Inc | In Stock | - | Datasheet | YES | 88 | 88 ns | MICRON TECHNOLOGY INC | - | - | - | - | PLASTIC/EPOXY | FBGA | FBGA, BGA88,8X12,32 | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | - | No | 1.8 V | - | - | EAR99 | - | - | 8542.32.00.71 | BOTTOM | BALL | - | - | 0.8 mm | unknown | - | - | R-PBGA-B88 | Not Qualified | - | - | - | - | 0.035 mA | - | - | - | - | - | MEMORY CIRCUIT | FLASH+PSRAM | - | - | ||
PF38F1030W0YBQF Micron Technology Inc | In Stock | - | Datasheet | YES | 88 | - | MICRON TECHNOLOGY INC | - | - | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA88,8X12,32 | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | - | Yes | - | - | - | EAR99 | - | - | 8542.32.00.71 | BOTTOM | BALL | - | - | 0.8 mm | compliant | - | - | R-PBGA-B88 | Not Qualified | - | OTHER | - | - | 0.055 mA | - | - | - | 0.000005 A | - | MEMORY CIRCUIT | FLASH+PSRAM | - | - | ||
MT28C3212P2FL-11TET Micron Technology Inc | In Stock | - | Datasheet | YES | 66 | 110 ns | MICRON TECHNOLOGY INC | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | FBGA-66 | BGA66,8X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | No | - | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | SRAM ORGANISATION IS 128K X 16 | 8542.32.00.71 | BOTTOM | BALL | - | 1 | 0.8 mm | not_compliant | - | 66 | R-PBGA-B66 | Not Qualified | 2.2 V | INDUSTRIAL | 1.65 V | ASYNCHRONOUS | 0.025 mA | 2MX16 | 1.4 mm | 16 | 0.00006 A | 33554432 bit | MEMORY CIRCUIT | FLASH+SRAM | 12 mm | 8 mm |