- Manufacturer Part Number
- Manufacturer
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- Reach Compliance Code
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- JESD-30 Code
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Manufacturer
Microsemi Diodes - Rectifiers - Single
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Number of Pins | Weight | Diode Element Material | Number of Elements | Power Dissipation (Max) | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Capacitance | Voltage - Rated DC | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Reach Compliance Code | Current Rating | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Reference Standard | JESD-30 Code | Qualification Status | Polarity | Element Configuration | Speed | Diode Type | Current - Reverse Leakage @ Vr | Output Current | Voltage - Forward (Vf) (Max) @ If | Case Connection | Forward Current | Operating Temperature - Junction | Max Surge Current | Output Current-Max | Voltage - DC Reverse (Vr) (Max) | Current - Average Rectified (Io) | Forward Voltage | Max Reverse Voltage (DC) | Average Rectified Current | Number of Phases | Reverse Recovery Time | Peak Reverse Current | Max Repetitive Reverse Voltage (Vrrm) | JEDEC-95 Code | Capacitance @ Vr, F | Peak Non-Repetitive Surge Current | Reverse Current-Max | Max Forward Surge Current (Ifsm) | Recovery Time | Reverse Voltage (DC) | Natural Thermal Resistance | Height | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 APT60DQ120BG Microsemi Corporation | 27 | - | Datasheet | 29 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | TO-247-2 | - | 6.500007g | SILICON | 1 | - | Tube | 1997 | - | e1 | yes | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 175°C | -55°C | ULTRA FAST SOFT RECOVERY | - | 8541.10.00.80 | - | 1.2kV | - | - | - | - | 60A | - | - | 3 | - | R-PSFM-T2 | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 100μA @ 1200V | 60A | 3.3V @ 60A | CATHODE | 60A | -55°C~175°C | 540A | - | 1200V | - | 3.35V | 1.2kV | 60A | 1 | 320 ns | 100μA | 1.2kV | - | - | 540A | - | - | 320 ns | 1.2kV | - | 5.31mm | 21.46mm | 16.26mm | No | RoHS Compliant | Lead Free | ||
 1N5554US Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | - | Surface Mount | Surface Mount | SQ-MELF, B | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 175°C | -65°C | POWER | HIGH RELIABILITY | 8541.10.00.80 | - | - | END | WRAP AROUND | NOT SPECIFIED | - | - | NOT SPECIFIED | - | 2 | - | - | Not Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 1μA @ 1000V | - | 1.2V @ 9A | ISOLATED | 5A | -65°C~175°C | - | 5A | 1000V | - | 1.3V | 1kV | 3A | 1 | 2 μs | 1μA | 1kV | - | - | 100A | - | - | - | - | - | - | - | - | Yes | Non-RoHS Compliant | - | ||
 APT15DQ120KG Microsemi Corporation | 12000 | - | Datasheet | 31 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tin | Through Hole | Through Hole | TO-220-2 | - | 6.000006g | SILICON | 1 | - | Tube | 1997 | - | e3 | yes | Active | 1 (Unlimited) | 2 | EAR99 | - | 175°C | -55°C | ULTRA FAST SOFT RECOVERY | - | 8541.10.00.80 | - | 1.2kV | - | - | - | - | 15A | - | - | 3 | - | R-PSFM-T2 | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 100μA @ 1200V | 15A | 3.3V @ 15A | CATHODE | 15A | -55°C~175°C | 110A | - | 1200V | - | 3.3V | 1.2kV | 15A | 1 | 240 ns | 100μA | 1.2kV | TO-220AC | - | 110A | - | - | 21 ns | 1.2kV | - | 9.19mm | 10.26mm | 4.72mm | No | RoHS Compliant | Lead Free | ||
APT30DQ120BG Microsemi Corporation | 52 | - | Datasheet | 29 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | TO-247-2 | - | 6.500007g | SILICON | 1 | - | Tube | 1997 | - | e1 | yes | Active | 1 (Unlimited) | 2 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 175°C | -55°C | ULTRA FAST SOFT RECOVERY | FREE WHEELING DIODE, LOW LEAKAGE CURRENT, HIGH RELIABILITY, SNUBBER DIODE | - | - | 1.2kV | - | - | - | - | 30A | - | - | 3 | - | R-PSFM-T2 | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 100μA @ 1200V | 30A | 3.3V @ 30A | CATHODE | 30A | -55°C~175°C | 210A | - | 1200V | - | 3.4V | 1.2kV | 30A | 1 | 320 ns | 100μA | 1.2kV | - | - | 210A | - | - | 320 ns | 1.2kV | - | 5.31mm | 21.46mm | 16.26mm | No | RoHS Compliant | Lead Free | ||
 JAN1N5616 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | - | Through Hole | Through Hole | A, Axial | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/427 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 200°C | -55°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | - | WIRE | - | - | - | - | - | 2 | MIL-19500 | - | Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 500nA @ 400V | - | 1.3V @ 3A | ISOLATED | - | -65°C~200°C | - | 1A | - | - | 1.3V | 400V | 1A | - | 2 μs | 500nA | 400V | - | - | 30A | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
APT100S20BG Microsemi Corporation | In Stock | - | Datasheet | 25 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | TO-247-2 | - | 6.500007g | SILICON | 1 | - | Tube | - | - | e1 | yes | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 150°C | -55°C | HIGH VOLTAGE ULTRA FAST SOFT RECOVERY | - | 8541.10.00.80 | - | 200V | - | - | - | - | 120A | - | - | 3 | - | R-PSFM-T2 | - | Standard | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 2mA @ 200V | 120A | 950mV @ 100A | CATHODE | 120A | -55°C~150°C | - | - | - | - | 950mV | 200V | 120A | 1 | 70 ns | 2mA | 200V | - | - | 1kA | - | 1kA | - | 200V | - | 21.46mm | 16.26mm | 5.31mm | No | RoHS Compliant | Lead Free | ||
 APT20SCD120S Microsemi Corporation | In Stock | - | Datasheet | 22 Weeks | - | - | Surface Mount | Surface Mount | TO-268-3, D3Pak (2 Leads + Tab), TO-268AA | 3 | - | - | 1 | 208W | Tube | 1999 | - | - | - | Obsolete | 1 (Unlimited) | 2 | EAR99 | - | 150°C | -55°C | GENERAL PURPOSE | HIGH RELIABILITY, LOW LEAKAGE CURRENT, PD-CASE | 8541.10.00.80 | - | - | - | GULL WING | - | - | - | - | - | - | - | R-PSSO-G2 | - | - | Single | No Recovery Time > 500mA (Io) | Silicon Carbide Schottky | 400μA @ 1200V | - | 1.8V @ 20A | CATHODE | - | -55°C~150°C | - | - | 1200V | 68A DC | 1.8V | 1.2kV | 68A | 1 | 0 s | - | - | - | 1135pF @ 0V 1MHz | 220A | 400μA | - | - | - | - | - | - | - | No | RoHS Compliant | Lead Free | ||
APT60S20BG Microsemi Corporation | In Stock | - | Datasheet | 25 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Through Hole | Through Hole | TO-247-2 | - | 6.500007g | SILICON | 1 | - | Tube | 1997 | - | e1 | yes | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 150°C | -55°C | HIGH VOLTAGE ULTRA FAST SOFT RECOVERY | - | 8541.10.00.80 | - | 200V | - | - | - | - | 75A | - | - | 3 | - | R-PSFM-T2 | - | Standard | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 1mA @ 200V | 75A | 900mV @ 60A | CATHODE | 75A | -55°C~150°C | 600A | - | - | - | 830mV | 200V | 75A | 1 | 55 ns | 1mA | 200V | - | - | 600A | - | - | 55 ns | 200V | - | 5.31mm | 21.46mm | 16.26mm | No | RoHS Compliant | Lead Free | ||
APT15DQ60KG Microsemi Corporation | 917 | - | Datasheet | 27 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | TO-220-2 | - | 6.000006g | SILICON | 1 | - | Tube | 1997 | - | - | yes | Active | 1 (Unlimited) | 2 | EAR99 | Pure Matte Tin (Sn) | 175°C | -55°C | ULTRA FAST SOFT RECOVERY | - | 8541.10.00.80 | - | 600V | - | - | - | - | 15A | - | - | 3 | - | R-PSFM-T2 | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 25μA @ 600V | 15A | 2.4V @ 15A | CATHODE | 15A | -55°C~175°C | 110A | - | - | - | 2V | 600V | 15A | 1 | 19 ns | 25μA | 600V | TO-220AC | - | 110A | - | - | 15 ns | 600V | - | 9.19mm | 10.26mm | 4.72mm | No | RoHS Compliant | Lead Free | ||
APT30DQ100BG Microsemi Corporation | 6602 | - | Datasheet | 25 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | TO-247-2 | - | - | SILICON | 1 | - | Tube | 1997 | - | e1 | yes | Active | 1 (Unlimited) | 2 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 175°C | -55°C | ULTRA FAST SOFT RECOVERY | - | 8541.10.00.80 | - | 1kV | - | - | - | - | 30A | - | - | 3 | - | R-PSFM-T2 | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 100μA @ 1000V | 30A | 3V @ 30A | CATHODE | 30A | -55°C~175°C | - | - | 1000V | - | 3V | 1kV | 30A | 1 | 295 ns | 100μA | 1kV | - | - | 150A | - | - | - | - | - | - | - | - | No | RoHS Compliant | Lead Free | ||
 APT15DQ60BG Microsemi Corporation | 180 | - | Datasheet | 25 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | TO-247-3 | - | 6.500007g | SILICON | 1 | - | Tube | - | - | e1 | yes | Active | 1 (Unlimited) | 2 | - | TIN SILVER COPPER | 175°C | -55°C | ULTRA FAST SOFT RECOVERY | - | 8541.10.00.80 | - | 600V | - | - | - | - | 15A | - | - | 3 | - | R-PSFM-T2 | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 25μA @ 600V | 15A | 2.4V @ 15A | CATHODE | 15A | -55°C~175°C | 110A | - | - | - | 2V | 600V | 15A | 1 | 19 ns | 25μA | 600V | - | - | 110A | - | - | 15 ns | 600V | - | 5.31mm | 21.46mm | 16.26mm | No | RoHS Compliant | Lead Free | ||
 1N5618US Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | SQ-MELF, A | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 200°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | END | WRAP AROUND | NOT SPECIFIED | - | - | NOT SPECIFIED | - | 2 | - | - | Not Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 500nA @ 600V | - | 1.3V @ 3A | ISOLATED | - | -65°C~200°C | - | 1A | - | - | 1.3V | 600V | 1A | - | 2 μs | 500nA | 600V | - | - | 30A | - | - | - | - | - | - | - | - | Yes | Non-RoHS Compliant | - | ||
 JAN1N4454UR-1 Microsemi Corporation | In Stock | - | Datasheet | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | DO-213AA | 2 | - | SILICON | 1 | - | Bulk | 1999 | Military, MIL-PRF-19500/144 | e0 | - | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -55°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | END | WRAP AROUND | - | - | - | - | - | 2 | - | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 100nA @ 50V | - | 1V @ 10mA | ISOLATED | 200mA | -55°C~175°C | - | - | - | 200mA DC | 1V | 50V | 4A | - | 44 ns | 100nA | 50V | - | - | 4A | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 JAN1N5617 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | A, Axial | 2 | - | SILICON | 1 | - | Bulk | - | Military, MIL-PRF-19500/429 | e0 | - | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | - | 8541.10.00.80 | - | - | - | WIRE | - | - | - | - | - | 2 | - | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 400V | - | 1.6V @ 3A | ISOLATED | - | -65°C~175°C | - | 1A | - | - | 1.6V | 400V | 1A | - | 150 ns | 500nA | 400V | - | - | 30A | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTX1N5615 Microsemi Corporation | 150 | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | A, Axial | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/429 | e0 | - | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -55°C | - | - | 8541.10.00.80 | - | 200V | - | WIRE | - | - | 1A | - | 1N5615 | 2 | - | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 200V | 1A | 1.6V @ 3A | ISOLATED | - | -65°C~175°C | - | - | - | - | 1.6V | 200V | 1A | - | 150 ns | 500nA | 200V | - | 45pF @ 12V 1MHz | 30A | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 CDLL5711 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | DO-213AA | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 150°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | END | WRAP AROUND | - | - | - | - | - | 2 | - | - | - | - | Single | Small Signal =< 200mA (Io), Any Speed | Schottky | 200nA @ 50V | - | 410mV @ 1mA | ISOLATED | 33mA | -65°C~150°C | - | 0.033A | - | - | 1V | 50V | 33mA | - | - | 200nA | 70V | - | 2pF @ 0V 1MHz | - | - | - | - | - | 250 °C/W | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 UPS540E3/TR13 Microsemi Corporation | In Stock | - | Datasheet | 19 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | Powermite®3 | 3 | - | SILICON | 1 | - | Tape & Reel (TR) | 1997 | - | e3 | yes | Active | 1 (Unlimited) | 2 | EAR99 | Matte Tin (Sn) - annealed | 125°C | -55°C | EFFICIENCY | - | 8541.10.00.80 | 250pF | 40V | SINGLE | GULL WING | - | - | 5A | - | UPS540 | 2 | - | R-PSSO-G2 | - | Standard | Common Anode | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 500μA @ 40V | 5A | 540mV @ 5A | CATHODE | 5A | -55°C~125°C | - | - | - | - | 540mV | 40V | 5A | 1 | - | 500μA | 40V | - | 250pF @ 4V 1MHz | 100A | - | - | - | - | - | - | - | - | No | RoHS Compliant | Lead Free | ||
 1N5711-1 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Tin | Through Hole | Through Hole | DO-204AH, DO-35, Axial | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 150°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | - | WIRE | - | - | - | - | - | - | MIL-19500/444 | - | - | - | Single | Small Signal =< 200mA (Io), Any Speed | Schottky | 200nA @ 50V | - | 1V @ 15mA | ISOLATED | 15A | -65°C~150°C | - | 0.033A | - | - | 1V | 70V | 33mA | - | - | - | 70V | - | 2pF @ 0V 1MHz | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
APT30D30BG Microsemi Corporation | In Stock | - | Datasheet | 25 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | - | Through Hole | Through Hole | TO-247-2 | - | 6.500007g | SILICON | 1 | - | Tube | 1997 | - | e1 | yes | Active | 1 (Unlimited) | 2 | - | TIN SILVER COPPER | 175°C | -55°C | ULTRA FAST SOFT RECOVERY | - | 8541.10.00.80 | - | 300V | - | - | - | - | 30A | - | - | 3 | - | R-PSFM-T2 | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 250μA @ 300V | 30A | 1.4V @ 30A | CATHODE | 30A | -55°C~175°C | 320A | - | - | - | 1.2V | 300V | 30A | 1 | 25 ns | 250μA | 300V | TO-247AD | - | 320A | - | - | 25 ns | 300V | - | 5.31mm | 21.46mm | 16.26mm | No | RoHS Compliant | Lead Free | ||
 1N5550 Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | B, Axial | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) | 175°C | -65°C | GENERAL PURPOSE | HIGH RELIABILITY | 8541.10.00.80 | - | - | - | WIRE | NOT SPECIFIED | not_compliant | - | NOT SPECIFIED | - | 2 | - | - | - | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 1μA @ 200V | - | 1.2V @ 9A | ISOLATED | 5A | -65°C~175°C | - | 3A | - | - | 1.2V | 200V | 3A | 1 | 2 μs | 1μA | 200V | - | - | 100A | - | - | - | - | - | - | - | - | Yes | Non-RoHS Compliant | Contains Lead |