- Manufacturer Part Number
- Manufacturer
- Configuration
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Diode Type
- Number of Elements
- Surface Mount
- Diode Element Material
- JESD-30 Code
Attribute column
Manufacturer
Microsemi Diodes - Rectifiers - Single
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Number of Pins | Weight | Diode Element Material | Number of Elements | Operating Temperature (Max.) | Operating Temperature (Min.) | Power Dissipation (Max) | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Voltage - Rated DC | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Reach Compliance Code | Current Rating | Time@Peak Reflow Temperature-Max (s) | Pin Count | Reference Standard | JESD-30 Code | Qualification Status | Max Supply Voltage | Element Configuration | Speed | Diode Type | Current - Reverse Leakage @ Vr | Output Current | Voltage - Forward (Vf) (Max) @ If | Case Connection | Forward Current | Operating Temperature - Junction | Max Surge Current | Output Current-Max | Voltage - DC Reverse (Vr) (Max) | Current - Average Rectified (Io) | Forward Voltage | Max Reverse Voltage (DC) | Average Rectified Current | Number of Phases | Reverse Recovery Time | Peak Reverse Current | Max Repetitive Reverse Voltage (Vrrm) | Rep Pk Reverse Voltage-Max | JEDEC-95 Code | Capacitance @ Vr, F | Peak Non-Repetitive Surge Current | Non-rep Pk Forward Current-Max | Reverse Current-Max | Recovery Time | Reverse Voltage (DC) | Natural Thermal Resistance | Regulation Current-Nom (Ireg) | Limiting Voltage-Max | Dynamic Impedance-Min | Height | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 1N4454-1 Microsemi Corporation | In Stock | - | Datasheet | 17 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | 2 | - | SILICON | 1 | - | - | 0.5W | Bulk | 1999 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 175°C | -55°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | WIRE | - | - | - | - | - | - | - | - | - | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 100nA @ 50V | - | 1V @ 10mA | ISOLATED | 200mA | -65°C~175°C | - | - | - | - | 1V | 75V | 200mA | - | 4 ns | 100nA | 50V | - | - | - | 4A | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 1N6621US Microsemi Corporation | In Stock | - | Datasheet | 17 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Tin | Surface Mount | Surface Mount | SQ-MELF, A | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 150°C | -65°C | ULTRA FAST RECOVERY | HIGH RELIABILITY | 8541.10.00.80 | - | END | WRAP AROUND | NOT SPECIFIED | - | - | NOT SPECIFIED | 2 | MIL-19500 | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 440V | - | 1.4V @ 1.2A | ISOLATED | 1.2A | -65°C~150°C | - | - | - | - | 1.6V | 440V | 1.2A | 1 | 30 ns | - | 440V | - | - | 10pF @ 10V 1MHz | 20A | - | 0.5μA | - | - | 13 °C/W | - | - | - | - | - | - | - | Non-RoHS Compliant | Contains Lead | ||
 JANTXV1N6621US Microsemi Corporation | In Stock | - | Datasheet | 18 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Lead, Tin | Surface Mount | Surface Mount | SQ-MELF, A | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | Military, MIL-PRF-19500/585 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 150°C | -65°C | ULTRA FAST RECOVERY | HIGH RELIABILITY | 8541.10.00.80 | - | END | WRAP AROUND | NOT SPECIFIED | - | - | NOT SPECIFIED | - | MIL-19500 | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 440V | - | 1.4V @ 1.2A | ISOLATED | 1.2A | -65°C~150°C | - | - | - | - | 1.6V | 440V | 1.2A | 1 | 30 ns | - | 440V | - | - | - | 20A | - | 0.5μA | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
 1N5292UR-1 Microsemi Corporation | In Stock | - | Datasheet | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | - | - | - | - | SILICON | 1 | 175°C | -65°C | 0.5W | Bulk | 1999 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | - | - | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | END | WRAP AROUND | NOT SPECIFIED | - | - | NOT SPECIFIED | 2 | - | O-LELF-R2 | Not Qualified | 100V | Single | - | CURRENT REGULATOR DIODE | - | - | - | ISOLATED | - | - | - | - | - | - | - | - | - | - | - | - | - | - | DO-213AB | - | - | - | - | - | - | - | 0.62mA | 1.13V | 1550000Ohm | - | - | - | - | Non-RoHS Compliant | - | ||
 JANTX1N6643 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | Axial | 2 | - | SILICON | 1 | - | - | 0.75W | Bulk | 1997 | Military, MIL-PRF-19500/578 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | WIRE | - | - | - | - | 2 | MIL-19500/578E | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 50nA @ 20V | - | 1.2V @ 100mA | ISOLATED | - | -65°C~175°C | - | 0.3A | 125V | 300mA | 1.2V | - | - | - | 6 ns | 500nA | 75V | 50V | DO-35 | 5pF @ 0V 1MHz | 2.5A | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JAN1N4248 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | A, Axial | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | Military, MIL-PRF-19500/286 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -55°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | WIRE | - | - | - | - | 2 | MIL-19500 | - | Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 1μA @ 800V | - | 1.3V @ 3A | ISOLATED | - | -65°C~175°C | - | 1A | - | - | 1.3V | 800V | 1A | - | 5 μs | 1μA | 800V | - | - | - | 25A | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JAN1N5711-1 Microsemi Corporation | In Stock | - | Datasheet | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | Military, MIL-PRF-19500/444 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 150°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | WIRE | - | - | - | - | 2 | MIL-19500/444 | - | Qualified | - | Single | Small Signal =< 200mA (Io), Any Speed | Schottky | 200nA @ 70V | - | 1V @ 15mA | ISOLATED | 33mA | -65°C~150°C | - | 0.033A | - | - | 1V | - | - | - | - | - | 70V | - | - | 2pF @ 0V 1MHz | - | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
JAN1N4249 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | A, Axial | 2 | - | - | - | - | - | - | Bulk | 1997 | Military, MIL-PRF-19500/286 | - | - | Active | 1 (Unlimited) | - | EAR99 | - | 175°C | -65°C | - | - | - | - | - | - | - | - | - | - | 2 | - | - | Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 1μA @ 1000V | - | 1.3V @ 3A | - | - | -65°C~175°C | - | - | 1000V | - | 1.3V | 1kV | 1A | - | 5 μs | 1μA | 1kV | - | - | - | 25A | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 CDLL5817 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | DO-213AB, MELF | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 125°C | -55°C | - | METALLURGICALLY BONDED | 8541.10.00.80 | - | END | WRAP AROUND | - | - | - | - | 2 | - | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 100μA @ 20V | - | 600mV @ 1A | ISOLATED | 1A | -55°C~125°C | - | 1A | - | - | 900mV | 20V | 1A | - | - | 100μA | 20V | - | - | - | - | - | - | - | - | 40 °C/W | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 APT30D40BG Microsemi Corporation | 4320 | - | Datasheet | 25 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Through Hole | Through Hole | TO-247-2 | - | 6.500007g | SILICON | 1 | - | - | - | Tube | 1997 | - | e1 | yes | Active | 1 (Unlimited) | 2 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 175°C | -55°C | ULTRA FAST SOFT RECOVERY | - | 8541.10.00.80 | 400V | - | - | - | - | 30A | - | - | - | R-PSFM-T2 | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 250μA @ 400V | 30A | 1.5V @ 30A | CATHODE | 30A | -55°C~175°C | 320A | - | - | - | 1.5V | 400V | 30A | 1 | 32 ns | 250μA | 400V | - | - | - | 320A | - | - | 22 ns | 400V | - | - | - | - | 5.31mm | 21.46mm | 16.26mm | No | RoHS Compliant | Lead Free | ||
 CDLL2810 Microsemi Corporation | In Stock | - | Datasheet | 17 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | DO-213AA | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 150°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | END | WRAP AROUND | - | - | - | - | 2 | - | - | - | - | Single | Small Signal =< 200mA (Io), Any Speed | Schottky | 100nA @ 15V | - | 1V @ 35mA | ISOLATED | 75mA | -65°C~150°C | - | 0.075A | - | - | 1V | 20V | 75mA | - | - | - | 20V | - | - | 2pF @ 0V 1MHz | - | - | - | - | - | 250 °C/W | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 1N4247 Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | A, Axial | 2 | - | SILICON | 1 | - | - | - | Bulk | - | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | WIRE | NOT SPECIFIED | not_compliant | - | NOT SPECIFIED | 2 | MIL-19500 | - | Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 1μA @ 600V | - | 1.3V @ 3A | ISOLATED | - | -65°C~175°C | - | 1A | - | - | 1.3V | 600V | 1A | - | 5 μs | 1μA | 600V | - | - | - | 25A | - | - | - | - | - | - | - | - | - | - | - | Yes | Non-RoHS Compliant | - | ||
 JAN1N5618 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | A, Axial | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | Military, MIL-PRF-19500/427 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 200°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | WIRE | - | - | - | - | 2 | MIL-19500 | - | Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 500nA @ 600V | - | 1.3V @ 3A | ISOLATED | - | -65°C~200°C | - | 1A | - | - | 1.3V | 600V | 1A | - | 2 μs | 500nA | 600V | - | - | - | 30A | 50A | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 JANTX1N5195 Microsemi Corporation | In Stock | - | Datasheet | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | 2 | - | - | - | - | - | - | Bulk | 1997 | Military, MIL-PRF-19500/118 | e0 | no | Active | 1 (Unlimited) | - | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | - | - | - | - | - | - | - | - | - | - | - | - | Qualified | - | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 1μA @ 200V | - | 1V @ 100mA | - | 200mA | -65°C~175°C | - | - | - | - | 1V | - | - | - | - | - | 180V | - | - | - | 2A | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTXV1N6627US Microsemi Corporation | In Stock | - | Datasheet | - | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Tin | Surface Mount | Surface Mount | SQ-MELF, E | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | Military, MIL-PRF-19500/590 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 150°C | -65°C | ULTRA FAST RECOVERY POWER | METALLURGICALLY BONDED | 8541.10.00.80 | - | END | WRAP AROUND | NOT SPECIFIED | - | - | NOT SPECIFIED | 2 | MIL-19500/590F | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 2μA @ 440V | - | 1.35V @ 2A | ISOLATED | 1.75A | -65°C~150°C | - | 4A | - | - | 1.5V | 440V | 1.75A | 1 | 30 ns | - | 440V | - | - | 40pF @ 10V 1MHz | 75A | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
 UES803 Microsemi Corporation | 3250 | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Stud | - | - | 2 | - | SILICON | 1 | - | - | - | Bulk | 1996 | - | e0 | no | Active | Not Applicable | 1 | - | TIN LEAD | 175°C | -55°C | EFFICIENCY | - | 8541.10.00.80 | - | UPPER | SOLDER LUG | - | - | - | - | - | - | O-MUPM-D1 | - | - | Single | - | RECTIFIER DIODE | - | - | - | CATHODE | 70A | - | - | - | - | - | 975mV | - | - | 1 | 50 ns | 25μA | 150V | - | DO-5 | - | 800A | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 1N6536 Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | - | Lead, Tin | Through Hole | Through Hole | A, Axial | - | - | SILICON | - | - | - | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | - | - | - | - | 8541.10.00.80 | - | - | WIRE | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | O-LALF-W2 | Not Qualified | - | - | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 10μA @ 400V | - | 1.5V @ 1A | ISOLATED | 1A | - | - | 1A | - | 1A DC | - | 400V | 1A | - | 30 ns | - | 400V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
 JANTX1N5415 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | B, Axial | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | Military, MIL-PRF-19500/411 | e0 | - | Active | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) | 175°C | -65°C | FAST RECOVERY POWER | - | 8541.10.00.80 | - | - | WIRE | - | - | - | - | 2 | MIL-19500/411L | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 1μA @ 50V | - | 1.5V @ 9A | ISOLATED | - | -65°C~175°C | - | 3A | - | - | 1.5V | 50V | 3A | 1 | 150 ns | 1μA | 50V | - | - | - | 80A | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 JAN1N5819UR-1 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | - | Surface Mount | Surface Mount | DO-213AB, MELF (Glass) | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | Military, MIL-PRF-19500/586 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 125°C | -55°C | - | METALLURGICALLY BONDED | 8541.10.00.80 | - | END | WRAP AROUND | - | - | - | - | 2 | MIL-19500/586F | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 50μA @ 45V | - | 490mV @ 1A | ISOLATED | 1A | -65°C~125°C | - | 1A | - | - | 800mV | - | - | - | - | 50μA | 45V | - | - | 70pF @ 5V 1MHz | - | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
JANTXV1N4247 Microsemi Corporation | In Stock | - | Datasheet | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | A, Axial | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | Military, MIL-PRF-19500/286 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | WIRE | - | - | - | - | 2 | MIL-19500 | - | Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 1μA @ 600V | - | 1.3V @ 3A | ISOLATED | - | -65°C~175°C | - | 1A | - | - | 1.3V | 600V | 1A | - | 5 μs | 1μA | 600V | - | - | - | 25A | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - |