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- Risk Rank
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- JESD-30 Code
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Manufacturer
Microsemi Diodes - Rectifiers - Single
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Weight | Diode Element Material | Number of Elements | Operating Temperature (Max.) | Power Dissipation (Max) | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Capacitance | Voltage - Rated DC | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Reach Compliance Code | Current Rating | Time@Peak Reflow Temperature-Max (s) | Pin Count | Reference Standard | JESD-30 Code | Qualification Status | Configuration | Element Configuration | Speed | Diode Type | Current - Reverse Leakage @ Vr | Output Current | Voltage - Forward (Vf) (Max) @ If | Case Connection | Forward Current | Operating Temperature - Junction | Max Surge Current | Output Current-Max | Voltage - DC Reverse (Vr) (Max) | Current - Average Rectified (Io) | Forward Voltage | Max Reverse Voltage (DC) | Average Rectified Current | Number of Phases | Reverse Recovery Time | Peak Reverse Current | Max Repetitive Reverse Voltage (Vrrm) | Rep Pk Reverse Voltage-Max | JEDEC-95 Code | Capacitance @ Vr, F | Peak Non-Repetitive Surge Current | Non-rep Pk Forward Current-Max | Forward Voltage-Max | Reverse Current-Max | Max Forward Surge Current (Ifsm) | Recovery Time | Max Junction Temperature (Tj) | Reverse Voltage (DC) | Reverse Recovery Time-Max | Natural Thermal Resistance | Height | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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![]() 1N5806US Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Tin | Surface Mount | Surface Mount | SQ-MELF, A | - | 2 | - | SILICON | 1 | - | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | 175°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | 25pF | - | END | WRAP AROUND | NOT SPECIFIED | not_compliant | - | NOT SPECIFIED | 2 | - | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 1μA @ 150V | - | 875mV @ 1A | ISOLATED | 1A | -65°C~175°C | - | 1A | - | - | 975mV | 150V | 1A | - | 25 ns | 1μA | 150V | - | - | 25pF @ 10V 1MHz | 35A | - | - | - | 35A | - | 175°C | - | - | - | 2.62mm | - | - | Yes | Non-RoHS Compliant | Contains Lead | ||
![]() 1N5184 Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | - | - | - | Through Hole | S, Axial | NO | - | - | SILICON | 1 | 175°C | 1.5W | Bulk | 1997 | - | e0 | no | Discontinued | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | - | - | - | HIGH RELIABILITY | 8541.10.00.70 | - | - | - | WIRE | - | not_compliant | - | - | - | - | O-LALF-W2 | - | SINGLE | - | Small Signal =< 200mA (Io), Any Speed | Standard | 5μA @ 10000V | - | 10V @ 100mA | ISOLATED | - | -65°C~175°C | - | 0.1A | 10000V | 100mA | - | - | - | - | - | - | - | 10000V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
![]() JAN1N5807 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | B, Axial | - | 2 | - | SILICON | 1 | - | 5W | Bulk | 1997 | Military, MIL-PRF-19500/477 | e0 | - | Discontinued | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) | 175°C | -65°C | ULTRA FAST RECOVERY | HIGH RELIABILITY, METALLURGICALLY BONDED | 8541.10.00.80 | - | - | - | WIRE | - | - | - | - | 2 | MIL-19500 | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 5μA @ 50V | - | 875mV @ 4A | ISOLATED | 6A | -65°C~175°C | - | 3A | - | - | 875mV | 50V | 6A | 1 | 30 ns | 5μA | 50V | - | - | 60pF @ 10V 1MHz | 125A | - | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
![]() 1N4449 Microsemi Corporation | In Stock | - | Datasheet | - | - | - | - | Through Hole | DO-204AH, DO-35, Axial | NO | - | - | SILICON | 1 | 150°C | - | Bulk | 1996 | - | e0 | no | Discontinued | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | - | - | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | - | WIRE | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | O-LALF-W2 | Not Qualified | SINGLE | - | Small Signal =< 200mA (Io), Any Speed | Standard | 25nA @ 20V | - | 1V @ 30mA | ISOLATED | - | -65°C~150°C | - | 0.2A | 75V | 200mA | - | - | - | - | 4ns | - | - | - | - | - | - | 0.5A | - | 0.025μA | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
![]() JANTXV1N6661US Microsemi Corporation | In Stock | - | Datasheet | - | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | SQ-MELF, A | - | 2 | - | SILICON | 1 | - | - | Bulk | 1999 | Military, MIL-PRF-19500/587 | e0 | no | Discontinued | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 125°C | -55°C | - | - | 8541.10.00.70 | - | - | AXIAL | WIRE | - | - | - | - | - | MIL-19500/587 | - | Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 50nA @ 225V | - | 1V @ 400mA | ISOLATED | 500mA | -65°C~175°C | - | - | - | - | - | - | - | - | - | 50nA | 225V | - | DO-35 | - | 5A | - | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
![]() 1N5617US Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | SQ-MELF, A | - | 2 | - | SILICON | 1 | - | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | END | WRAP AROUND | NOT SPECIFIED | - | - | NOT SPECIFIED | 2 | - | - | Not Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 400V | - | 1.6V @ 3A | ISOLATED | - | -65°C~175°C | - | 1A | - | - | 1.6V | 400V | 1A | - | 150 ns | 500nA | 400V | - | - | 35pF @ 12V 1MHz | 30A | - | - | - | - | - | - | - | - | 13 °C/W | - | - | - | Yes | Non-RoHS Compliant | Contains Lead | ||
![]() JAN1N3612 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | A, Axial | - | 2 | - | SILICON | 1 | - | - | Bulk | 1997 | Military, MIL-PRF-19500/228 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | - | WIRE | NOT SPECIFIED | - | - | NOT SPECIFIED | 2 | MIL-19500 | - | Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 100μA @ 300V | - | 1.1V @ 1A | ISOLATED | - | -65°C~175°C | - | 1A | - | - | 1.1V | 400V | 1A | - | - | - | - | - | - | - | 30A | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
![]() JANTX1N4247 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | A, Axial | - | 2 | - | SILICON | 1 | - | - | Bulk | 1997 | Military, MIL-PRF-19500/286 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -55°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | - | WIRE | - | - | - | - | 2 | MIL-19500 | - | Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 1μA @ 600V | - | 1.3V @ 3A | ISOLATED | - | -65°C~175°C | - | 1A | - | - | 1.3V | 600V | 1A | - | 5 μs | 1μA | 600V | - | - | - | 25A | - | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
![]() APT15D120BG Microsemi Corporation | In Stock | - | Datasheet | 25 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | TO-247-2 | - | - | - | SILICON | 1 | - | - | Tube | 1997 | - | - | - | Active | 1 (Unlimited) | 2 | EAR99 | - | 150°C | -55°C | ULTRA FAST SOFT RECOVERY | FREE WHEELING DIODE, HIGH RELIABILITY, LOW LEAKAGE CURRENT, LOW NOISE, SNUBBER DIODE | 8541.10.00.80 | - | - | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | 3 | - | R-PSFM-T2 | Not Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 250μA @ 1200V | - | 2.5V @ 15A | CATHODE | - | -55°C~150°C | - | - | 1200V | - | 2.5V | 1.2kV | 15A | 1 | 260 ns | - | - | - | - | - | 110A | - | - | - | - | - | - | - | - | - | - | - | - | - | RoHS Compliant | - | ||
![]() JANTXV1N4454UR-1 Microsemi Corporation | In Stock | - | Datasheet | 13 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | DO-213AA | - | 2 | - | SILICON | 1 | - | - | Bulk | 1999 | Military, MIL-PRF-19500/144 | e0 | - | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -55°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | END | WRAP AROUND | - | - | - | - | - | - | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 100nA @ 50V | - | 1V @ 10mA | ISOLATED | 200mA | -55°C~175°C | - | - | - | 200mA DC | 1V | - | - | - | 44 ns | 100nA | 50V | - | - | - | 4A | - | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
![]() JANTX1N4245 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | A, Axial | - | 2 | - | SILICON | 1 | - | - | Bulk | 1997 | Military, MIL-PRF-19500/286 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | - | WIRE | NOT SPECIFIED | not_compliant | - | NOT SPECIFIED | 2 | MIL-19500 | - | Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 1μA @ 200V | - | 1.3V @ 3A | ISOLATED | - | -65°C~175°C | - | 1A | - | - | 1.3V | 200V | 1A | - | 5 μs | 1μA | 200V | - | - | - | 25A | - | - | - | - | - | - | - | - | - | - | - | - | Yes | Non-RoHS Compliant | Contains Lead | ||
![]() UES702 Microsemi Corporation | In Stock | - | Datasheet | - | IN PRODUCTION (Last Updated: 1 month ago) | - | Chassis, Stud | Chassis, Stud Mount | DO-203AA, DO-4, Stud | - | 2 | - | SILICON | 1 | - | - | Bulk | 1997 | - | e0 | no | Discontinued | Not Applicable | 1 | EAR99 | TIN LEAD | 150°C | -55°C | EFFICIENCY | - | 8541.10.00.80 | - | 100V | UPPER | SOLDER LUG | - | - | 25A | - | - | - | O-MUPM-D1 | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 20μA @ 100V | 25A | 950mV @ 25A | CATHODE | 25A | -55°C~175°C | - | - | - | - | - | 100V | 25A | 1 | 35 ns | 20μA | 100V | - | - | - | 400A | - | - | - | - | - | - | - | - | - | - | - | - | No | RoHS Compliant | Lead Free | ||
![]() 1N1124A Microsemi Corporation | 6240 | - | Datasheet | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | - | - | - | NO | - | - | SILICON | 1 | 200°C | - | - | 1997 | - | e0 | no | Active | - | 1 | - | TIN LEAD | - | - | POWER | - | 8541.10.00.80 | - | - | UPPER | SOLDER LUG | NOT SPECIFIED | - | - | NOT SPECIFIED | 1 | MIL-19500/260G | O-MUPM-D1 | Not Qualified | SINGLE | - | - | RECTIFIER DIODE | - | - | - | CATHODE | - | - | - | 3.3A | - | - | - | - | - | 1 | - | - | - | 200V | DO-203AA | - | - | 25A | 1.2V | - | - | - | - | - | 0.5μs | - | - | - | - | - | Non-RoHS Compliant | - | ||
![]() APT30D120BG Microsemi Corporation | 9600 | - | Datasheet | 25 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | - | Through Hole | Through Hole | TO-247-2 | - | - | 6.500007g | SILICON | 1 | - | - | Tube | 1997 | - | e1 | yes | Active | 1 (Unlimited) | 2 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 175°C | -55°C | ULTRA FAST SOFT RECOVERY | - | 8541.10.00.80 | - | 1.2kV | - | - | - | - | 30A | - | 3 | - | R-PSFM-T2 | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 250μA @ 1200V | 30A | 2.5V @ 30A | CATHODE | 30A | -55°C~175°C | 210A | - | 1200V | - | 2.5V | 1.2kV | 30A | 1 | 370 ns | 250μA | 1.2kV | - | - | - | 210A | - | - | - | - | 370 ns | - | 1.2kV | - | - | 5.31mm | 21.46mm | 16.26mm | No | RoHS Compliant | Lead Free | ||
![]() 1N5822US Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | SQ-MELF, B | - | 2 | - | SILICON | 1 | - | - | Bulk | - | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 125°C | -65°C | GENERAL PURPOSE | METALLURGICALLY BONDED | 8541.10.00.80 | - | - | END | WRAP AROUND | - | - | - | - | 2 | - | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 100μA @ 40V | - | 500mV @ 3A | ISOLATED | 3A | -65°C~125°C | - | 3A | - | - | 700mV | 40V | 3A | 1 | - | 100μA | 40V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
![]() MC5616 Microsemi Corporation | In Stock | - | Datasheet | - | - | - | Through Hole | Through Hole | S, Axial | - | 2 | - | SILICON | 1 | - | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 150°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | - | WIRE | - | - | - | - | 2 | - | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 1μA @ 3000V | - | 6V @ 100mA | ISOLATED | 570mA | -65°C~150°C | - | 0.57A | 3000V | - | 6V | - | - | - | 300 ns | 1μA | 3kV | 3000V | - | - | 4A | - | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
![]() CDLL5195 Microsemi Corporation | In Stock | - | Datasheet | 17 Weeks | - | - | Surface Mount | Surface Mount | DO-213AA | - | 2 | - | SILICON | 1 | - | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.80 | - | - | END | WRAP AROUND | - | - | - | - | 2 | - | - | - | - | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 100μA @ 180V | - | 1V @ 100mA | ISOLATED | 200mA | -65°C~175°C | - | 0.65A | - | - | 1V | 180V | 200mA | - | - | 100μA | 180V | - | - | - | 2A | - | - | - | - | - | - | - | - | 100 °C/W | - | - | - | No | Non-RoHS Compliant | - | ||
![]() JANTX1N3614 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | A, Axial | - | 2 | - | SILICON | 1 | - | - | Bulk | 1997 | Military, MIL-PRF-19500/228 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | - | WIRE | - | - | - | - | 2 | MIL-19500 | - | Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 1μA @ 800V | - | 1.1V @ 1A | ISOLATED | - | -65°C~175°C | - | 1A | - | - | 1.1V | 800V | 1A | - | - | 1μA | 800V | - | DO-41 | - | 30A | - | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
![]() JANTX1N5809US Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | SQ-MELF, B | - | 2 | - | SILICON | 1 | - | 5W | Bulk | 1997 | Military, MIL-PRF-19500/477 | e0 | no | Active | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) | 175°C | -65°C | ULTRA FAST RECOVERY | HIGH RELIABILITY, METALLURGICALLY BONDED | 8541.10.00.80 | - | - | END | WRAP AROUND | - | - | - | - | 2 | MIL-19500 | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 5μA @ 100V | - | 875mV @ 4A | ISOLATED | - | -65°C~175°C | - | 3A | - | - | 875mV | 100V | 3A | 1 | 30 ns | - | - | - | - | 60pF @ 10V 1MHz | 125A | - | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
![]() 1N6622US Microsemi Corporation | In Stock | - | Datasheet | 17 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Tin | Surface Mount | Surface Mount | SQ-MELF, A | - | 2 | - | SILICON | 1 | - | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 150°C | -65°C | ULTRA FAST RECOVERY | HIGH RELIABILITY | 8541.10.00.80 | - | - | END | WRAP AROUND | NOT SPECIFIED | not_compliant | - | NOT SPECIFIED | 2 | - | - | Not Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 660V | - | 1.4V @ 1.2A | ISOLATED | 1.2A | -65°C~150°C | - | - | - | - | 1.6V | 660V | 1.2A | 1 | 30 ns | 500nA | 660V | - | - | 10pF @ 10V 1MHz | 20A | - | - | - | - | - | - | - | - | 13 °C/W | - | - | - | Yes | Non-RoHS Compliant | Contains Lead |