- Manufacturer Part Number
- Manufacturer
- Configuration
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Diode Type
- Number of Elements
- Surface Mount
- Diode Element Material
- JESD-30 Code
Attribute column
Manufacturer
Microsemi Diodes - Rectifiers - Single
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Diode Element Material | Number of Elements | Operating Temperature (Max.) | Operating Temperature (Min.) | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Reference Standard | JESD-30 Code | Qualification Status | Configuration | Element Configuration | Speed | Diode Type | Current - Reverse Leakage @ Vr | Power Dissipation | Voltage - Forward (Vf) (Max) @ If | Case Connection | Forward Current | Operating Temperature - Junction | Output Current-Max | Voltage - DC Reverse (Vr) (Max) | Current - Average Rectified (Io) | Forward Voltage | Max Reverse Voltage (DC) | Average Rectified Current | Number of Phases | Reverse Recovery Time | Peak Reverse Current | Max Repetitive Reverse Voltage (Vrrm) | Rep Pk Reverse Voltage-Max | JEDEC-95 Code | Capacitance @ Vr, F | Peak Non-Repetitive Surge Current | Non-rep Pk Forward Current-Max | Forward Voltage-Max | Reverse Current-Max | Reverse Recovery Time-Max | Natural Thermal Resistance | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 UFR7015 Microsemi Corporation | 421 | - | Datasheet | 8 Weeks | - | - | Stud | - | - | - | 2 | SILICON | 1 | - | - | Bulk | 1997 | - | e0 | no | Active | - | 1 | EAR99 | TIN LEAD | 175°C | -65°C | FAST RECOVERY | HIGH RELIABILITY | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | - | 1 | - | O-MUPM-D1 | - | - | Single | - | RECTIFIER DIODE | - | - | - | CATHODE | 70A | - | - | - | - | - | - | - | 1 | 50 ns | 25μA | 150V | - | - | - | 1kA | - | 0.975V | - | - | - | No | Non-RoHS Compliant | Lead Free | ||
 JANTX1N5552US Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | SQ-MELF, B | - | 2 | SILICON | 1 | - | - | Bulk | 1997 | Military, MIL-PRF-19500/420 | e0 | - | Active | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) | 175°C | -65°C | POWER | - | 8541.10.00.80 | END | WRAP AROUND | 235 | - | 20 | - | 2 | - | - | Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 1μA @ 600V | - | 1.2V @ 9A | ISOLATED | 5A | -65°C~175°C | 3A | - | - | 1.2V | - | - | 1 | 2 μs | 1μA | 600V | - | - | - | 100A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 1N5809 Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Tin | Through Hole | Through Hole | B, Axial | - | 2 | SILICON | 1 | - | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) | 175°C | -65°C | ULTRA FAST RECOVERY | HIGH RELIABILITY, METALLURGICALLY BONDED | 8541.10.00.80 | - | WIRE | NOT SPECIFIED | not_compliant | NOT SPECIFIED | - | 2 | - | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 5μA @ 100V | - | 875mV @ 4A | ISOLATED | 6A | -65°C~175°C | 3A | - | - | 875mV | 100V | 3A | 1 | 30 ns | 5μA | 100V | - | - | 60pF @ 10V 1MHz | 125A | - | - | - | - | - | Yes | Non-RoHS Compliant | Contains Lead | ||
 1N3903 Microsemi Corporation | In Stock | - | Datasheet | 17 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Stud | Stud Mount | DO-203AB, DO-5, Stud | - | 2 | SILICON | 1 | - | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 1 | - | TIN LEAD | 150°C | -65°C | - | - | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | - | 1 | - | O-MUPM-D1 | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 50μA @ 400V | - | 1.4V @ 63A | CATHODE | 20A | -65°C~150°C | - | - | - | 1.4V | - | - | 1 | 200 ns | 50μA | 400V | - | - | 150pF @ 10V 1MHz | 225A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 UFT3150C Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | - | - | - | - | - | NO | - | SILICON | 2 | 175°C | -65°C | - | - | - | e0 | no | Active | - | 2 | EAR99 | TIN LEAD | - | - | ULTRA FAST SOFT RECOVERY | HIGH RELIABILITY | 8541.10.00.80 | BOTTOM | PIN/PEG | NOT SPECIFIED | - | NOT SPECIFIED | - | 2 | - | O-MBFM-P2 | Not Qualified | COMMON CATHODE, 2 ELEMENTS | - | - | RECTIFIER DIODE | - | - | - | CATHODE | - | - | 30A | - | - | - | - | - | 1 | - | - | - | 400V | TO-204AA | - | - | 350A | - | - | 50μs | - | - | Non-RoHS Compliant | - | ||
 JAN1N5419 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | B, Axial | - | 2 | SILICON | 1 | - | - | Bulk | 1997 | Military, MIL-PRF-19500/411 | - | - | Active | 1 (Unlimited) | 2 | - | - | 175°C | -65°C | FAST RECOVERY POWER | - | 8541.10.00.80 | - | WIRE | - | - | - | - | 2 | MIL-19500/411L | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 1μA @ 500V | - | 1.5V @ 9A | ISOLATED | - | -65°C~175°C | 3A | - | - | 1.5V | 500V | 3A | 1 | 250 ns | 1μA | 500V | - | - | - | 80A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTXV1N5619 Microsemi Corporation | 11 | - | Datasheet | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | A, Axial | - | 2 | SILICON | 1 | - | - | Bulk | 1997 | Military, MIL-PRF-19500/429 | e0 | - | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | - | 8541.10.00.80 | - | WIRE | - | - | - | - | 2 | - | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 600V | - | 1.6V @ 3A | ISOLATED | - | -65°C~175°C | 1A | - | - | 1.6V | 600V | 1A | - | 250 ns | 500nA | 600V | - | DO-7 | 25pF @ 12V 1MHz | 30A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTX1N5619US Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | SQ-MELF, A | - | 2 | SILICON | 1 | - | - | Bulk | 1997 | Military, MIL-PRF-19500/429 | e0 | - | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | - | 8541.10.00.80 | END | WRAP AROUND | - | - | - | - | 2 | - | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 600V | - | 1.6V @ 3A | ISOLATED | - | -65°C~175°C | 1A | - | 1A | 1.6V | - | - | - | 250 ns | 500nA | 600V | - | - | 25pF @ 12V 1MHz | 30A | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 JANTXV1N5551 Microsemi Corporation | In Stock | - | Datasheet | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | B, Axial | - | 2 | SILICON | 1 | - | - | Bulk | 1997 | Military, MIL-PRF-19500/420 | e0 | - | Active | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) | 175°C | -65°C | POWER | - | 8541.10.00.80 | - | WIRE | - | - | - | - | 2 | - | - | Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 1μA @ 400V | - | 1.2V @ 9A | ISOLATED | 5A | -65°C~175°C | 5A | - | - | 1.2V | 400V | 5A | 1 | 2 μs | 1μA | 400V | - | - | - | 100A | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 JANTX1N6639US Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | - | Lead, Tin | Surface Mount | Surface Mount | SQ-MELF, D | - | 2 | SILICON | 1 | - | - | Bulk | 1999 | Military, MIL-PRF-19500/609 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | END | WRAP AROUND | NOT SPECIFIED | - | NOT SPECIFIED | - | 2 | MIL-19500/609D | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 100nA @ 75V | - | 1.2V @ 300mA | ISOLATED | 300mA | -65°C~175°C | 0.3A | - | 300mA DC | 1.2V | - | - | - | 4ns | - | 75V | - | - | - | 2.5A | - | - | 0.1μA | - | - | - | Non-RoHS Compliant | Contains Lead | ||
 JANTX1N6642US Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Tin | Surface Mount | Surface Mount | SQ-MELF, D | - | 2 | SILICON | 1 | - | - | Bulk | 1997 | Military, MIL-PRF-19500/578 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | END | WRAP AROUND | - | - | - | 1N6642 | 2 | MIL-19500/578E | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 75V | - | 1.2V @ 100mA | ISOLATED | 300mA | -65°C~175°C | 0.3A | - | - | 1.2V | 75V | 300mA | - | 5 ns | - | 75V | - | - | 5pF @ 0V 1MHz | 2.5A | - | - | 0.5μA | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 JANTXV1N6492 Microsemi Corporation | In Stock | - | Datasheet | - | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Through Hole | Through Hole | TO-205AF Metal Can | - | 3 | SILICON | 1 | - | - | Bulk | 1997 | Military, MIL-PRF-19500/567 | e0 | no | Active | 1 (Unlimited) | - | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | - | - | - | - | - | - | - | - | - | - | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 2mA @ 45V | - | 560mV @ 2A | - | 1.2A | -65°C~175°C | - | - | 3.6A | 680mV | - | - | - | - | 2mA | 45V | - | - | 450pF @ 5V 1MHz | 80A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 1N3293R Microsemi Corporation | In Stock | - | Datasheet | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | - | - | - | NO | - | SILICON | 1 | 200°C | -65°C | Bulk | 1997 | - | e0 | no | Active | - | 1 | - | TIN LEAD | - | - | POWER | - | 8541.10.00.80 | UPPER | HIGH CURRENT CABLE | NOT SPECIFIED | - | NOT SPECIFIED | - | 1 | - | O-MUPM-H1 | Not Qualified | SINGLE | - | - | RECTIFIER DIODE | - | - | - | ANODE | - | - | 100A | - | - | - | - | - | 1 | - | - | - | 600V | DO-205AA | - | - | 1600A | 1.2V | - | - | - | - | Non-RoHS Compliant | - | ||
 JAN1N4247 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Through Hole | Through Hole | A, Axial | - | 2 | SILICON | 1 | - | - | Bulk | 1997 | Military, MIL-PRF-19500/286 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | WIRE | - | - | - | - | 2 | MIL-19500 | - | Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 1μA @ 600V | - | 1.3V @ 3A | ISOLATED | - | -65°C~175°C | 1A | - | - | 1.3V | 600V | 1A | - | 5 μs | 1μA | 600V | - | - | - | 25A | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 JAN1N4148UR-1 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | DO-213AA | - | 2 | SILICON | 1 | - | - | Bulk | 1999 | Military, MIL-PRF-19500/241 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | - | 8541.10.00.70 | END | WRAP AROUND | - | - | - | - | - | MIL-19500/116L | - | Qualified | - | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 25nA @ 20V | - | 800mV @ 10mA | ISOLATED | - | -65°C~175°C | - | 100V | 200mA | 1.2V | - | - | - | 5 ns | 500nA | 75V | - | - | 2.8pF @ 1.5V 1MHz | 2A | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 1N5623US Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Surface Mount | Surface Mount | SQ-MELF, A | - | 2 | SILICON | 1 | - | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 175°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | END | WRAP AROUND | NOT SPECIFIED | - | NOT SPECIFIED | - | 2 | - | - | Not Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 1000V | - | 1.6V @ 3A | ISOLATED | - | -65°C~175°C | 1A | 1000V | - | 1.6V | 1kV | 1A | - | 500 ns | 500nA | 1kV | - | - | 15pF @ 12V 1MHz | 30A | - | - | - | - | 13 °C/W | Yes | Non-RoHS Compliant | - | ||
 JAN1N4454-1 Microsemi Corporation | 2222 | - | Datasheet | 14 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | - | 2 | SILICON | 1 | - | - | Bulk | 1998 | Military, MIL-PRF-19500/144 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 125°C | -55°C | - | HIGH RELIABILITY | 8541.10.00.70 | - | WIRE | - | - | - | - | - | MIL-19500/144 | - | Qualified | - | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 100nA @ 50V | 500mW | 1V @ 10mA | ISOLATED | 200mA | -55°C~175°C | - | - | - | 1V | 50V | 200mA | - | 4 ns | 100nA | 50V | - | - | - | 4A | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 JANTXV1N6628 Microsemi Corporation | In Stock | - | Datasheet | 18 Weeks | - | - | Through Hole | Through Hole | E, Axial | - | 2 | SILICON | 1 | - | - | Bulk | 1997 | Military, MIL-PRF-19500/590 | e0 | no | Active | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) | 150°C | -65°C | ULTRA FAST RECOVERY | METALLURGICALLY BONDED, HIGH RELIABILITY | 8541.10.00.80 | - | WIRE | - | - | - | - | 2 | MIL-19500/590 | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 2μA @ 660V | - | 1.35V @ 2A | ISOLATED | 1.75A | -65°C~150°C | - | - | - | 1.5V | 660V | 1.75A | 1 | 30 ns | 2μA | 660V | - | - | 40pF @ 10V 1MHz | 75A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTXV1N6627 Microsemi Corporation | In Stock | - | Datasheet | - | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | E, Axial | - | 2 | SILICON | 1 | - | - | Bulk | 1997 | Military, MIL-PRF-19500/590 | e0 | no | Discontinued | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) | 150°C | -65°C | ULTRA FAST RECOVERY | METALLURGICALLY BONDED, HIGH RELIABILITY | 8541.10.00.80 | - | WIRE | - | - | - | - | 2 | MIL-19500/590 | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 2μA @ 440V | - | 1.35V @ 2A | ISOLATED | 1.75A | -65°C~150°C | - | - | - | 1.5V | 440V | 1.75A | 1 | 30 ns | 2μA | 440V | - | - | 40pF @ 10V 1MHz | 75A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTXV1N914 Microsemi Corporation | In Stock | - | Datasheet | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | - | 2 | SILICON | 1 | - | - | Bulk | 1998 | Military, MIL-PRF-19500/116 | e0 | no | Discontinued | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | WIRE | - | - | - | - | - | MIL-19500/116 | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 75V | - | 1.2V @ 50mA | ISOLATED | - | -65°C~175°C | 0.075A | - | 200mA | - | - | - | - | 5 ns | 500nA | 75V | - | - | 2.8pF @ 1.5V 1MHz | 2A | 1A | - | - | - | - | No | Non-RoHS Compliant | - |