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Manufacturer
Microsemi Diodes - Rectifiers - Single
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Diode Element Material | Number of Elements | Operating Temperature (Max.) | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Voltage - Rated DC | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Reach Compliance Code | Current Rating | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Reference Standard | JESD-30 Code | Qualification Status | Configuration | Element Configuration | Speed | Diode Type | Current - Reverse Leakage @ Vr | Output Current | Voltage - Forward (Vf) (Max) @ If | Case Connection | Forward Current | Operating Temperature - Junction | Output Current-Max | Voltage - DC Reverse (Vr) (Max) | Current - Average Rectified (Io) | Forward Voltage | Max Reverse Voltage (DC) | Average Rectified Current | Number of Phases | Reverse Recovery Time | Peak Reverse Current | Max Repetitive Reverse Voltage (Vrrm) | Rep Pk Reverse Voltage-Max | JEDEC-95 Code | Capacitance @ Vr, F | Peak Non-Repetitive Surge Current | Non-rep Pk Forward Current-Max | Reverse Current-Max | Max Forward Surge Current (Ifsm) | Reverse Voltage (DC) | Reverse Recovery Time-Max | Natural Thermal Resistance | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 USD245C Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | - | - | Through Hole | - | TO-39 | - | 3 | - | SILICON | 2 | - | - | 1996 | - | e0 | no | Active | - | 3 | EAR99 | TIN LEAD | 175°C | -65°C | EFFICIENCY | HIGH RELIABILITY | 8541.10.00.80 | - | - | BOTTOM | WIRE | - | - | - | - | - | - | - | - | - | - | Common Cathode | - | RECTIFIER DIODE | - | - | - | - | 6A | - | 4A | - | - | 680mV | - | - | 1 | - | 2mA | 45V | - | TO-205AF | - | 80A | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 1N4150-1 Microsemi Corporation | 2581 | - | Datasheet | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | - | 2 | - | SILICON | 1 | - | Bulk | 1996 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 200°C | -65°C | - | - | 8541.10.00.70 | - | - | - | WIRE | - | - | - | - | - | 2 | - | - | Qualified | - | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 100nA @ 50V | - | 1V @ 200mA | ISOLATED | 400mA | -65°C~175°C | - | - | - | 1V | 50V | 200mA | - | 4 ns | - | 75V | - | - | - | 500mA | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 APT40DQ100BG Microsemi Corporation | In Stock | - | Datasheet | 25 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | TO-247-2 | - | - | - | SILICON | 1 | - | Tube | 1997 | - | e1 | yes | Active | 1 (Unlimited) | 2 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 175°C | -55°C | ULTRA FAST SOFT RECOVERY | - | 8541.10.00.80 | 1kV | - | - | - | - | - | 40A | - | - | 3 | - | R-PSFM-T2 | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 100μA @ 1000V | 40A | 3V @ 40A | CATHODE | 40A | -55°C~175°C | - | 1000V | - | 3V | 1kV | 40A | 1 | 250 ns | 100μA | 1kV | - | - | - | 210A | - | - | - | - | - | - | No | RoHS Compliant | Lead Free | ||
 1N5618 Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Lead, Tin | Through Hole | Through Hole | A, Axial | - | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 200°C | -65°C | - | HIGH RELIABILITY, METALLURGICALLY BONDED | 8541.10.00.80 | - | - | - | WIRE | NOT SPECIFIED | - | - | NOT SPECIFIED | - | 2 | - | - | Not Qualified | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 500nA @ 600V | - | 1.3V @ 3A | ISOLATED | - | -65°C~200°C | 1A | - | - | 1.3V | 600V | 1A | - | 2 μs | 500nA | 600V | - | - | - | 30A | - | - | - | - | - | - | Yes | Non-RoHS Compliant | Contains Lead | ||
 MSC010SDA120K Microsemi Corporation | 52388 | - | Datasheet | 13 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | - | Through Hole | TO-220-2 | - | - | TO-220 [K] | - | - | - | Tube | 1999 | - | - | - | Active | Not Applicable | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No Recovery Time > 500mA (Io) | Silicon Carbide Schottky | - | - | 1.5V @ 10A | - | - | - | - | 1200V | 10A DC | - | - | - | - | 0ns | - | - | - | - | - | - | - | - | - | - | - | - | - | RoHS Compliant | - | ||
 CDLL5819 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | - | Surface Mount | Surface Mount | DO-213AB, MELF | - | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 125°C | -55°C | - | METALLURGICALLY BONDED | 8541.10.00.80 | - | - | AXIAL | WIRE | - | - | - | - | - | 2 | - | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 50μA @ 45V | - | 490mV @ 1A | ISOLATED | 1A | -65°C~125°C | 1A | - | - | 900mV | 45V | 1A | - | - | 100μA | 40V | - | - | 70pF @ 5V 1MHz | - | - | - | - | - | - | 40 °C/W | No | Non-RoHS Compliant | Contains Lead | ||
 HSM560JE3/TR13 Microsemi Corporation | In Stock | - | Datasheet | 24 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Surface Mount | Surface Mount | DO-214AB, SMC | - | 2 | - | - | - | - | Tape & Reel (TR) | 1997 | - | - | yes | Active | 1 (Unlimited) | - | - | - | 175°C | -55°C | - | - | - | - | - | - | - | - | - | - | - | HSM560 | - | - | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 250μA @ 60V | - | 650mV @ 5A | - | - | -55°C~175°C | - | - | - | 650mV | 60V | 5A | - | - | - | - | - | - | - | 250A | - | - | - | - | - | - | No | RoHS Compliant | - | ||
 JANS1N6640 Microsemi Corporation | In Stock | - | Datasheet | 20 Weeks | - | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | - | 2 | - | SILICON | 1 | - | Bulk | 1999 | Military, MIL-PRF-19500/609 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | - | WIRE | - | - | - | - | - | 2 | MIL-19500/609D | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 100nA @ 50V | - | 1V @ 200mA | ISOLATED | 300mA | -65°C~175°C | 0.3A | - | - | 1V | 50V | 300mA | - | 4 ns | 100nA | 75V | - | - | - | 2.5A | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 UES1102SM Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | - | - | Surface Mount | Surface Mount | SQ-MELF, A | - | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | Not Applicable | 2 | EAR99 | TIN LEAD | - | - | ULTRA FAST RECOVERY | - | 8541.10.00.80 | - | - | END | WRAP AROUND | - | - | - | - | - | - | - | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 2μA @ 100V | - | - | ISOLATED | 2.5A | 150°C Max | - | - | - | 975mV | 100V | 2.5A | 1 | 25 ns | 2μA | 100V | - | - | 3.5pF @ 6V 1MHz | 35A | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 1N5619US Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | - | Surface Mount | Surface Mount | SQ-MELF, A | - | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | END | WRAP AROUND | NOT SPECIFIED | not_compliant | - | NOT SPECIFIED | - | 2 | - | - | Not Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 600V | - | 1.6V @ 3A | ISOLATED | - | -65°C~175°C | 1A | - | - | 1.6V | 600V | 1A | - | 250 ns | 500nA | 600V | - | - | 25pF @ 12V 1MHz | 30A | - | - | - | - | - | 13 °C/W | Yes | Non-RoHS Compliant | Contains Lead | ||
APT30SCD120B Microsemi Corporation | 9 | - | Datasheet | 22 Weeks | - | - | Through Hole | Through Hole | TO-247-2 | - | 2 | - | - | 1 | - | Tube | 1999 | - | - | - | Obsolete | 1 (Unlimited) | - | EAR99 | - | 150°C | -55°C | - | - | 8541.10.00.80 | - | 291W | - | - | - | - | - | - | - | - | - | - | - | - | Single | No Recovery Time > 500mA (Io) | Silicon Carbide Schottky | 600μA @ 1200V | - | 1.8V @ 30A | - | 30A | -55°C~150°C | - | 1200V | 99A DC | 1.8V | 1.2kV | 99A | - | 0 s | - | 1.2kV | - | - | 2100pF @ 0V 1MHz | 330A | - | - | 330A | 1.2kV | - | - | No | RoHS Compliant | Lead Free | ||
JANS1N6638 Microsemi Corporation | In Stock | - | Datasheet | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | - | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/578 | e0 | no | Discontinued | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | END | WRAP AROUND | - | - | - | - | - | 2 | MIL-19500/578E | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 125V | - | 1.1V @ 200mA | ISOLATED | - | -65°C~175°C | 0.3A | - | - | 1.1V | 125V | 300mA | - | 4.5 ns | 500nA | 150V | - | - | 2.5pF @ 0V 1MHz | 2.5A | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JAN1N5194 Microsemi Corporation | In Stock | - | Datasheet | - | IN PRODUCTION (Last Updated: 2 weeks ago) | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | - | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/118 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | - | 8541.10.00.70 | - | - | - | WIRE | - | - | - | - | - | 2 | MIL-19500/118F | - | Qualified | - | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 1.25mA @ 80V | - | 1V @ 100mA | ISOLATED | 200mA | -65°C~170°C | - | - | 200mA DC | - | - | - | - | - | - | 70V | - | - | - | 2A | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTX1N914UR Microsemi Corporation | In Stock | - | Datasheet | 14 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Surface Mount | Surface Mount | DO-213AA | - | 2 | - | SILICON | 1 | - | Bulk | - | Military, MIL-PRF-19500/116 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | - | 8541.10.00.70 | - | - | END | WRAP AROUND | - | - | - | - | 1N914 | - | MIL-19500/116L | - | Qualified | - | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 500nA @ 75V | - | 1.2V @ 50mA | ISOLATED | - | -65°C~175°C | 0.075A | - | - | 1.2V | 75V | 200mA | - | 5 ns | 500nA | 75V | - | - | 4pF @ 0V 1MHz | 2A | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTX1N6626 Microsemi Corporation | In Stock | - | Datasheet | - | - | Lead, Tin | Through Hole | Through Hole | E, Axial | - | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/590 | e0 | no | Active | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) | 150°C | -65°C | ULTRA FAST RECOVERY | METALLURGICALLY BONDED, HIGH RELIABILITY | 8541.10.00.80 | - | - | - | WIRE | NOT SPECIFIED | - | - | NOT SPECIFIED | - | 2 | MIL-19500/590 | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 2μA @ 220V | - | 1.35V @ 2A | ISOLATED | 1.75A | -65°C~150°C | - | - | - | 1.5V | 220V | 1.75A | 1 | 30 ns | - | 220V | - | - | 40pF @ 10V 1MHz | 75A | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
JANTX1N4150-1 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | - | 2 | - | SILICON | 1 | - | Bulk | 1999 | Military, MIL-PRF-19500/231 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | - | 8541.10.00.70 | - | - | - | WIRE | - | - | - | - | - | 2 | - | - | Qualified | - | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 100nA @ 50V | - | 1V @ 200mA | ISOLATED | 300mA | -65°C~175°C | - | - | - | 1V | 50V | 200mA | - | 4 ns | 100nA | 50V | - | - | - | 4A | - | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 JANTX1N5617 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | - | Through Hole | Through Hole | A, Axial | - | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/429 | e0 | - | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | - | 8541.10.00.80 | - | - | - | WIRE | - | - | - | - | - | 2 | - | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 400V | - | 1.6V @ 3A | ISOLATED | 1A | -65°C~175°C | 1A | - | - | 1.6V | 400V | 1A | - | 150 ns | 500nA | 400V | - | - | 35pF @ 12V 1MHz | 30A | - | - | - | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 S3480 Microsemi Corporation | 322 | - | Datasheet | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | - | Stud Mount | DO-203AB, DO-5, Stud | NO | - | - | SILICON | 1 | 200°C | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 1 | EAR99 | TIN LEAD | - | - | POWER | EXCELLENT RELIABILITY | 8541.10.00.80 | - | - | UPPER | SOLDER LUG | NOT SPECIFIED | - | - | NOT SPECIFIED | - | 1 | - | O-MUPM-D1 | Not Qualified | SINGLE | - | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 10μA @ 800V | - | 1.15V @ 90A | CATHODE | - | -65°C~200°C | 45A | 800V | 45A | - | - | - | 1 | - | - | - | 800V | - | - | - | 800A | 40μA | - | - | 5μs | - | - | Non-RoHS Compliant | - | ||
 JANS1N5617US Microsemi Corporation | In Stock | - | Datasheet | 40 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Surface Mount | Surface Mount | SQ-MELF, A | - | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/427 | e0 | - | Discontinued | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | - | 8541.10.00.80 | - | - | END | WRAP AROUND | - | - | - | - | - | 2 | - | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500μA @ 400V | - | 1.6V @ 3A | ISOLATED | - | -65°C~200°C | 1A | - | 1A | 1.6V | - | - | - | 150 ns | 500nA | 400V | - | - | 35pF @ 12V 1MHz | 30A | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTX1N5621US Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | - | Surface Mount | Surface Mount | SQ-MELF, A | - | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/429 | - | - | Active | 1 (Unlimited) | 2 | EAR99 | - | 175°C | -65°C | - | - | 8541.10.00.80 | - | - | END | WRAP AROUND | - | - | - | - | - | 2 | - | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 800V | - | 1.6V @ 3A | ISOLATED | - | -65°C~175°C | 1A | - | - | 1.6V | 800V | 1A | - | 150 ns | 500nA | 800V | - | - | 20pF @ 12V 1MHz | 30A | - | - | - | - | - | - | No | Non-RoHS Compliant | - |