- Manufacturer Part Number
- Manufacturer
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Manufacturer
Microsemi Diodes - Rectifiers - Single
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Number of Pins | Supplier Device Package | Diode Element Material | Number of Elements | Power Dissipation (Max) | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Capacitance | Voltage - Rated DC | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Reach Compliance Code | Current Rating | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Reference Standard | Qualification Status | Element Configuration | Speed | Diode Type | Current - Reverse Leakage @ Vr | Output Current | Voltage - Forward (Vf) (Max) @ If | Case Connection | Forward Current | Operating Temperature - Junction | Output Current-Max | Voltage - DC Reverse (Vr) (Max) | Current - Average Rectified (Io) | Forward Voltage | Max Reverse Voltage (DC) | Average Rectified Current | Number of Phases | Reverse Recovery Time | Peak Reverse Current | Max Repetitive Reverse Voltage (Vrrm) | Capacitance @ Vr, F | Peak Non-Repetitive Surge Current | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 JANS1N5819-1 Microsemi Corporation | In Stock | - | Datasheet | 38 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | DO-204AL, DO-41, Axial | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/586 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 150°C | -55°C | - | METALLURGICALLY BONDED | 8541.10.00.80 | - | - | - | WIRE | - | - | - | - | - | 2 | MIL-19500/586 | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 50μA @ 45V | - | 490mV @ 1A | ISOLATED | 1A | -65°C~125°C | 1A | - | - | 800mV | - | - | - | - | 50μA | 45V | 70pF @ 5V 1MHz | - | No | Non-RoHS Compliant | - | ||
 UES1305 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | - | - | Through Hole | Through Hole | B, Axial | 2 | - | SILICON | 1 | - | Bulk | 1996 | - | e0 | no | Active | Not Applicable | 2 | - | Tin/Lead (Sn/Pb) | 150°C | -55°C | EFFICIENCY | - | 8541.10.00.80 | - | - | - | WIRE | - | - | - | - | - | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 20μA @ 300V | - | 1.25V @ 3A | ISOLATED | 3A | -55°C~150°C | 5A | - | - | 1.25V | 300V | 3A | 1 | 50 ns | 20μA | 300V | - | 70A | No | Non-RoHS Compliant | Contains Lead | ||
 1N4607 Microsemi Corporation | In Stock | - | Datasheet | - | - | Lead, Tin | Through Hole | Through Hole | DO-204AH, DO-35, Axial | 2 | - | SILICON | 1 | 0.5W | Bulk | 1998 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 200°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | - | WIRE | - | - | - | - | - | - | - | - | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 100μA @ 50V | - | 1.1V @ 400mA | ISOLATED | 200mA | -65°C~200°C | - | - | - | 1.1V | 85V | 200mA | - | 10 ns | - | 85V | - | 1A | No | Non-RoHS Compliant | - | ||
 1N6622 Microsemi Corporation | In Stock | - | Datasheet | 17 Weeks | - | Lead, Tin | Through Hole | Through Hole | A, Axial | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | - | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 150°C | -65°C | ULTRA FAST RECOVERY | HIGH RELIABILITY | 8541.10.00.80 | 10pF | 600V | - | WIRE | NOT SPECIFIED | not_compliant | 2A | NOT SPECIFIED | 1N6622 | 2 | - | Not Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 600V | 2A | 1.4V @ 1.2A | ISOLATED | 1.2A | -65°C~150°C | - | - | - | 1.6V | 600V | 1.2A | 1 | 45 ns | 500nA | 660V | - | 20A | Yes | RoHS Compliant | Contains Lead | ||
 JANS1N5615 Microsemi Corporation | In Stock | - | Datasheet | 40 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | A, Axial | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/429 | e0 | - | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | - | 8541.10.00.80 | - | - | - | WIRE | - | - | - | - | - | 2 | - | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 200V | - | 1.6V @ 3A | ISOLATED | - | -65°C~175°C | 1A | - | - | 1.6V | 200V | 1A | - | 150 ns | 500nA | 200V | 45pF @ 12V 1MHz | 30A | No | Non-RoHS Compliant | - | ||
 UFS310JE3/TR13 Microsemi Corporation | In Stock | - | Datasheet | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | DO-214AB, SMC | - | DO-214AB | - | - | - | Tape & Reel (TR) | 1997 | - | - | - | Active | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | UFS310 | - | - | - | - | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 10μA @ 100V | - | 950mV @ 3A | - | - | -55°C~175°C | - | 100V | 3A | - | 100V | 3A | - | 30 ns | - | - | - | - | No | RoHS Compliant | - | ||
 JANTX1N6761UR-1 Microsemi Corporation | In Stock | - | Datasheet | 14 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Surface Mount | Surface Mount | DO-213AB, MELF (Glass) | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/586 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 125°C | -55°C | - | METALLURGICALLY BONDED | 8541.10.00.80 | - | - | END | WRAP AROUND | - | - | - | - | - | 2 | MIL-19500/586F | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 100μA @ 100V | - | 380mV @ 100mA | ISOLATED | 1A | -65°C~125°C | 1A | - | - | 690mV | - | - | - | - | 100μA | 100V | - | - | No | Non-RoHS Compliant | - | ||
 JANTX1N5807US Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | - | Surface Mount | Surface Mount | SQ-MELF, B | 2 | - | SILICON | 1 | 5W | Bulk | 1997 | Military, MIL-PRF-19500/477 | e0 | no | Active | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) | 175°C | -65°C | ULTRA FAST RECOVERY | HIGH RELIABILITY, METALLURGICALLY BONDED | 8541.10.00.80 | - | - | END | WRAP AROUND | - | - | - | - | - | 2 | MIL-19500 | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 5μA @ 50V | - | 875mV @ 4A | ISOLATED | 6A | -65°C~175°C | 3A | - | - | 875mV | 50V | 3A | 1 | 30 ns | 5μA | 50V | 60pF @ 10V 1MHz | 125A | No | Non-RoHS Compliant | Contains Lead | ||
1N6075 Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Lead, Tin | Through Hole | Through Hole | A, Axial | 2 | - | SILICON | 1 | - | Bulk | - | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 155°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | - | WIRE | NOT SPECIFIED | - | - | NOT SPECIFIED | - | 2 | MIL-19500/503 | Not Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 1μA @ 150V | - | 2.04V @ 9.4A | ISOLATED | 3A | -65°C~155°C | 0.85A | - | - | 2.04V | 150V | 850mA | - | 30 ns | - | 150V | - | 35A | - | Non-RoHS Compliant | - | ||
 1N5416US Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | - | - | Surface Mount | Surface Mount | E-MELF | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | - | TIN LEAD | 175°C | -65°C | - | HIGH RELIABILITY, METALLURGICALLY BONDED | 8541.10.00.80 | - | - | END | WRAP AROUND | NOT SPECIFIED | - | - | NOT SPECIFIED | - | 2 | - | Not Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 1μA @ 100V | - | 1.5V @ 9A | ISOLATED | - | -65°C~175°C | 3A | - | - | 1.5V | 100V | 3A | 1 | 150 ns | 1μA | 100V | - | 80A | Yes | Non-RoHS Compliant | Contains Lead | ||
 JANS1N6642 Microsemi Corporation | In Stock | - | Datasheet | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/578 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | - | WIRE | - | - | - | - | - | 2 | MIL-19500/578E | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 75V | - | 1.2V @ 100mA | ISOLATED | - | -65°C~175°C | 0.3A | - | - | 1.2V | 75V | 300mA | - | 5 ns | 500nA | 100V | 5pF @ 0V 1MHz | 2.5A | No | Non-RoHS Compliant | - | ||
 JANS1N5806US Microsemi Corporation | In Stock | - | Datasheet | 24 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | SQ-MELF, A | 2 | - | SILICON | 1 | 3W | Bulk | 1997 | Military, MIL-PRF-19500/477 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | END | WRAP AROUND | - | - | - | - | - | - | MIL-19500 | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 1μA @ 150V | - | 875mV @ 1A | ISOLATED | - | -65°C~175°C | 1A | - | - | 975mV | 150V | 1A | - | 25 ns | 1μA | 150V | 25pF @ 10V 1MHz | 35A | No | Non-RoHS Compliant | - | ||
JANS1N5806 Microsemi Corporation | In Stock | - | Datasheet | 24 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Through Hole | Through Hole | A, Axial | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/477 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | - | WIRE | - | - | - | - | - | 2 | MIL-19500 | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 1μA @ 150V | - | 875mV @ 1A | ISOLATED | - | -65°C~175°C | 1A | - | - | 975mV | 150V | 1A | 1 | 25 ns | 1μA | 150V | 25pF @ 10V 1MHz | 35A | No | Non-RoHS Compliant | - | ||
 JANS1N5552 Microsemi Corporation | In Stock | - | Datasheet | 40 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | - | Through Hole | Through Hole | B, Axial | 2 | - | SILICON | - | - | Bulk | 1997 | Military, MIL-PRF-19500/420 | e0 | - | Active | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) | 175°C | -65°C | GENERAL PURPOSE | - | 8541.10.00.80 | - | - | - | WIRE | - | - | - | - | - | 2 | MIL | Qualified | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 1μA @ 600V | - | 1.2V @ 9A | ISOLATED | 5A | -65°C~175°C | 5A | - | - | 1.2V | 600V | 3A | 1 | 2 μs | 1μA | 600V | - | 100A | No | Non-RoHS Compliant | - | ||
JANTX1N6761-1 Microsemi Corporation | In Stock | - | Datasheet | - | - | - | Through Hole | Through Hole | DO-204AL, DO-41, Axial | 2 | - | SILICON | 1 | - | Bulk | - | Military, MIL-PRF-19500/586 | e0 | no | Discontinued | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 125°C | -55°C | - | METALLURGICALLY BONDED | 8541.10.00.80 | - | - | - | WIRE | - | - | - | - | - | 2 | MIL-19500/586 | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 100μA @ 100V | - | 690mV @ 1A | ISOLATED | 1A | -65°C~150°C | 1A | - | - | 690mV | - | - | - | - | 100μA | 100V | 70pF @ 5V 1MHz | - | No | Non-RoHS Compliant | - | ||
 MSC020SDA120B Microsemi Corporation | 52388 | - | Datasheet | 20 Weeks | - | - | - | Through Hole | TO-247-2 | - | TO-247 | - | - | - | Tube | 1999 | - | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No Recovery Time > 500mA (Io) | Silicon Carbide Schottky | 200μA @ 1200V | - | 1.8V @ 20A | - | - | -55°C~175°C | - | 1200V | 43A DC | - | - | - | - | 0ns | - | - | 104pF @ 400V 1MHz | - | - | RoHS Compliant | - | ||
 1N4153UR-1 Microsemi Corporation | In Stock | - | Datasheet | 6 Weeks | - | - | Surface Mount | Surface Mount | DO-213AA | 2 | - | SILICON | 1 | - | Bulk | 1999 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | END | WRAP AROUND | - | - | - | - | - | 2 | - | - | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 50nA @ 50V | - | - | ISOLATED | 150mA | -65°C~175°C | 0.15A | - | - | 880mV | 50V | 150mA | - | 4 ns | 50nA | 50V | 2pF @ 0V 1MHz | 2A | No | Non-RoHS Compliant | - | ||
 JANTXV1N5553 Microsemi Corporation | In Stock | - | Datasheet | 14 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Through Hole | Through Hole | B, Axial | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/420 | e0 | - | Active | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) | 175°C | -65°C | POWER | - | 8541.10.00.80 | - | - | - | WIRE | - | - | - | - | - | 2 | - | Qualified | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 1μA @ 800V | - | 1.3V @ 9A | ISOLATED | 5A | -65°C~175°C | 5A | - | - | 1.3V | 800V | 5A | 1 | 2 μs | 1μA | 800V | - | 100A | No | Non-RoHS Compliant | - | ||
JANTX1N5622US Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | - | Surface Mount | Surface Mount | SQ-MELF, A | 2 | - | SILICON | 1 | - | Bulk | - | Military, MIL-PRF-19500/427 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 200°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | - | - | END | WRAP AROUND | - | - | - | - | - | 2 | - | Qualified | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 500nA @ 1000V | - | 1.3V @ 3A | ISOLATED | - | -65°C~200°C | 1A | 1000V | - | 1.3V | 1kV | 1A | - | 2 μs | 500nA | 100V | - | 30A | No | Non-RoHS Compliant | - | ||
 1N6630US Microsemi Corporation | In Stock | - | Datasheet | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Lead, Tin | Surface Mount | Surface Mount | E-MELF | 2 | - | SILICON | 1 | - | Bulk | - | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 150°C | -65°C | HIGH VOLTAGE ULTRA FAST RECOVERY | METALLURGICALLY BONDED | 8541.10.00.80 | - | - | END | WRAP AROUND | NOT SPECIFIED | - | - | NOT SPECIFIED | - | 2 | - | Not Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 4μA @ 100V | - | 1.7V @ 3A | ISOLATED | 1.4A | -65°C~150°C | 3A | - | - | 1.7V | 900V | 1.4A | 1 | 50 ns | - | 990V | - | 75A | - | Non-RoHS Compliant | - |