- Manufacturer Part Number
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Manufacturer
Microsemi Diodes - Rectifiers - Single
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Diode Element Material | Number of Elements | Operating Temperature (Max.) | Operating Temperature (Min.) | Power Dissipation (Max) | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Reference Standard | JESD-30 Code | Qualification Status | Configuration | Element Configuration | Speed | Diode Type | Current - Reverse Leakage @ Vr | Voltage - Forward (Vf) (Max) @ If | Case Connection | Forward Current | Operating Temperature - Junction | Output Current-Max | Voltage - DC Reverse (Vr) (Max) | Current - Average Rectified (Io) | Forward Voltage | Max Reverse Voltage (DC) | Average Rectified Current | Number of Phases | Reverse Recovery Time | Peak Reverse Current | Max Repetitive Reverse Voltage (Vrrm) | Rep Pk Reverse Voltage-Max | JEDEC-95 Code | Capacitance @ Vr, F | Peak Non-Repetitive Surge Current | Non-rep Pk Forward Current-Max | Forward Voltage-Max | Reverse Current-Max | Reverse Recovery Time-Max | Natural Thermal Resistance | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 1N3595UR-1 Microsemi Corporation | In Stock | - | Datasheet | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Surface Mount | DO-213AA | - | 2 | - | SILICON | 1 | - | - | 0.5W | Bulk | 1997 | - | e0 | - | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | END | WRAP AROUND | - | - | - | - | - | - | - | - | - | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 1nA @ 125V | 1V @ 200mA | ISOLATED | 150mA | -65°C~175°C | 0.15A | - | 150mA DC | 1V | 125V | 150mA | - | 3 μs | 1nA | 125V | - | - | - | 4A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTX1N5614 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Through Hole | Through Hole | A, Axial | - | 2 | - | - | - | - | - | - | Bulk | 1997 | Military, MIL-PRF-19500/427 | - | - | Active | 1 (Unlimited) | - | - | - | 200°C | -65°C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 500nA @ 200V | 1.3V @ 3A | - | 1A | -65°C~200°C | - | 200V | 1A | 1.3V | 200V | 1A | - | 2 μs | 1μA | 200V | - | - | - | 30A | - | - | - | - | - | Yes | Non-RoHS Compliant | Contains Lead | ||
 MSC010SDA120K Microsemi Corporation | 52388 | - | Datasheet | 13 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Through Hole | TO-220-2 | - | - | TO-220 [K] | - | - | - | - | - | Tube | 1999 | - | - | - | Active | Not Applicable | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No Recovery Time > 500mA (Io) | Silicon Carbide Schottky | - | 1.5V @ 10A | - | - | - | - | 1200V | 10A DC | - | - | - | - | 0ns | - | - | - | - | - | - | - | - | - | - | - | - | RoHS Compliant | - | ||
 CDLL5819 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | Surface Mount | Surface Mount | DO-213AB, MELF | - | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 125°C | -55°C | - | METALLURGICALLY BONDED | 8541.10.00.80 | AXIAL | WIRE | - | - | - | - | 2 | - | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 50μA @ 45V | 490mV @ 1A | ISOLATED | 1A | -65°C~125°C | 1A | - | - | 900mV | 45V | 1A | - | - | 100μA | 40V | - | - | 70pF @ 5V 1MHz | - | - | - | - | - | 40 °C/W | No | Non-RoHS Compliant | Contains Lead | ||
 HSM560JE3/TR13 Microsemi Corporation | In Stock | - | Datasheet | 24 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Surface Mount | DO-214AB, SMC | - | 2 | - | - | - | - | - | - | Tape & Reel (TR) | 1997 | - | - | yes | Active | 1 (Unlimited) | - | - | - | 175°C | -55°C | - | - | - | - | - | - | - | - | HSM560 | - | - | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 250μA @ 60V | 650mV @ 5A | - | - | -55°C~175°C | - | - | - | 650mV | 60V | 5A | - | - | - | - | - | - | - | 250A | - | - | - | - | - | No | RoHS Compliant | - | ||
 JANS1N6640 Microsemi Corporation | In Stock | - | Datasheet | 20 Weeks | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | - | 2 | - | SILICON | 1 | - | - | - | Bulk | 1999 | Military, MIL-PRF-19500/609 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | WIRE | - | - | - | - | 2 | MIL-19500/609D | - | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 100nA @ 50V | 1V @ 200mA | ISOLATED | 300mA | -65°C~175°C | 0.3A | - | - | 1V | 50V | 300mA | - | 4 ns | 100nA | 75V | - | - | - | 2.5A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 UES1102SM Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | - | Surface Mount | Surface Mount | SQ-MELF, A | - | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | - | e0 | no | Active | Not Applicable | 2 | EAR99 | TIN LEAD | - | - | ULTRA FAST RECOVERY | - | 8541.10.00.80 | END | WRAP AROUND | - | - | - | - | - | - | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 2μA @ 100V | - | ISOLATED | 2.5A | 150°C Max | - | - | - | 975mV | 100V | 2.5A | 1 | 25 ns | 2μA | 100V | - | - | 3.5pF @ 6V 1MHz | 35A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 1N5619US Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | Surface Mount | Surface Mount | SQ-MELF, A | - | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | END | WRAP AROUND | NOT SPECIFIED | not_compliant | NOT SPECIFIED | - | 2 | - | - | Not Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 600V | 1.6V @ 3A | ISOLATED | - | -65°C~175°C | 1A | - | - | 1.6V | 600V | 1A | - | 250 ns | 500nA | 600V | - | - | 25pF @ 12V 1MHz | 30A | - | - | - | - | 13 °C/W | Yes | Non-RoHS Compliant | Contains Lead | ||
 1N1344A Microsemi Corporation | In Stock | - | Datasheet | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | - | - | NO | - | - | SILICON | 1 | 200°C | -65°C | - | Bulk | - | - | e0 | no | Active | - | 1 | - | TIN LEAD | - | - | POWER | - | 8541.10.00.80 | UPPER | SOLDER LUG | NOT SPECIFIED | - | NOT SPECIFIED | - | 1 | - | O-MUPM-D1 | Not Qualified | SINGLE | - | - | RECTIFIER DIODE | - | - | CATHODE | - | - | 16A | - | - | - | - | - | 1 | - | - | - | 200V | DO-203AA | - | - | 200A | 0.64V | - | 5μs | - | - | Non-RoHS Compliant | - | ||
 SBR2540 Microsemi Corporation | 593 | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Stud | - | - | - | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | - | e0 | no | Active | - | 1 | EAR99 | TIN LEAD | 150°C | -55°C | GENERAL PURPOSE | REVERSE ENERGY TESTED | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | - | 1 | - | O-MUPM-D1 | - | - | Single | - | RECTIFIER DIODE | - | - | CATHODE | 25A | - | - | - | - | 580mV | - | - | 1 | - | 2mA | 40V | - | - | - | 600A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 1N3899R Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | - | Stud | - | - | - | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | - | e0 | no | Active | - | 1 | - | TIN LEAD | 150°C | -65°C | FAST RECOVERY | - | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | - | 1 | - | O-MUPM-D1 | - | - | Single | - | RECTIFIER DIODE | - | - | - | 20A | - | - | - | - | - | - | - | 1 | 200 ns | 50μA | 50V | - | - | - | 225A | - | 1.4V | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTX1N5194 Microsemi Corporation | In Stock | - | Datasheet | 14 Weeks | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | - | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | Military, MIL-PRF-19500/118 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | - | 8541.10.00.70 | - | WIRE | - | - | - | - | - | MIL-19500/118F | - | Qualified | - | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 25nA @ 70V | 1V @ 100mA | ISOLATED | 200mA | -65°C~175°C | - | - | 50mA DC | 1V | - | - | - | - | - | 70V | - | - | - | 2A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 UFR3120R Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Stud | - | - | - | 2 | - | SILICON | 1 | - | - | - | - | 1997 | - | e0 | no | Active | - | 1 | EAR99 | TIN LEAD | 175°C | -65°C | ULTRA FAST RECOVERY | HIGH RELIABILITY | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | - | 1 | - | O-MUPM-D1 | - | - | Single | - | RECTIFIER DIODE | - | - | - | 30A | - | - | - | - | 1.25V | - | - | 1 | 50 ns | 15μA | 200V | - | - | - | 400A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTXV1N4153-1 Microsemi Corporation | In Stock | - | Datasheet | 14 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | Through Hole | Through Hole | DO-204AH, DO-35, Axial | - | 2 | - | SILICON | 1 | - | - | - | Bulk | 1996 | Military, MIL-PRF-19500/337 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | WIRE | - | - | - | - | 2 | MIL-19500/337 | - | Qualified | - | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 50nA @ 50V | 880mV @ 20mA | ISOLATED | 150mA | -65°C~175°C | 0.15A | - | - | 880mV | - | - | - | 4 ns | 50nA | 50V | - | - | 2pF @ 0V 1MHz | 2A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
1N3210 Microsemi Corporation | In Stock | - | Datasheet | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | - | - | NO | - | - | SILICON | 1 | 200°C | -65°C | - | Bulk | - | - | e0 | no | Active | - | 1 | - | TIN LEAD | - | - | POWER | - | 8541.10.00.80 | UPPER | SOLDER LUG | NOT SPECIFIED | - | NOT SPECIFIED | - | 1 | - | O-MUPM-D1 | Not Qualified | SINGLE | - | - | RECTIFIER DIODE | - | - | CATHODE | - | - | 40A | - | - | - | - | - | 1 | - | - | - | 200V | DO-203AB | - | - | 800A | - | - | 5μs | - | - | Non-RoHS Compliant | - | ||
1N3208R Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | - | Stud | - | - | - | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | - | e0 | no | Active | - | 1 | - | TIN LEAD | 200°C | -65°C | POWER | - | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | - | 1 | - | O-MUPM-D1 | - | - | Single | - | RECTIFIER DIODE | - | - | - | 40A | - | - | - | - | - | - | - | 1 | - | 10μA | 50V | - | - | - | 800A | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTX1N3671A Microsemi Corporation | In Stock | - | Datasheet | - | IN PRODUCTION (Last Updated: 3 weeks ago) | Stud | Stud Mount | DO-203AA, DO-4, Stud | - | 2 | - | SILICON | 1 | - | - | - | Bulk | 1997 | Military, MIL-PRF-19500/260 | e0 | no | Active | 1 (Unlimited) | 1 | - | Tin/Lead (Sn/Pb) | 200°C | -65°C | POWER | - | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | - | 1 | - | O-MUPM-D1 | Qualified | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 5μA @ 800V | 2.3V @ 240A | CATHODE | 22A | -65°C~150°C | - | - | 12A | 1.2V | - | - | 1 | - | 10μA | 800V | - | - | - | 250A | - | - | - | 5μs | - | No | Non-RoHS Compliant | - | ||
 1N4446 Microsemi Corporation | In Stock | - | Datasheet | 6 Weeks | - | - | Through Hole | DO-204AH, DO-35, Axial | NO | - | - | SILICON | 1 | 150°C | - | - | Bulk | 1996 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | - | - | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | WIRE | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | O-LALF-W2 | Not Qualified | SINGLE | - | Small Signal =< 200mA (Io), Any Speed | Standard | 25nA @ 20V | 1V @ 20mA | ISOLATED | - | -65°C~150°C | 0.2A | 75V | 200mA | - | - | - | - | 4ns | - | - | - | - | - | - | 0.5A | - | 0.025μA | - | - | - | Non-RoHS Compliant | - | ||
1N1188R Microsemi Corporation | In Stock | - | Datasheet | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | - | - | NO | 2 | - | SILICON | 1 | 175°C | -65°C | - | - | 1997 | - | e0 | no | Active | - | 1 | - | TIN LEAD | - | - | POWER | - | 8541.10.00.80 | UPPER | SOLDER LUG | NOT SPECIFIED | - | NOT SPECIFIED | - | 1 | - | O-MUPM-D1 | Not Qualified | SINGLE | - | - | RECTIFIER DIODE | - | - | ANODE | - | - | 35A | - | - | - | - | - | 1 | - | - | - | 400V | - | - | - | 500A | - | - | - | - | - | Non-RoHS Compliant | - | ||
 1N1187AR Microsemi Corporation | In Stock | - | Datasheet | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Stud | - | - | - | 2 | - | SILICON | 1 | - | - | - | Tape and Reel | 1997 | - | e0 | no | Active | - | 1 | - | TIN LEAD | 200°C | -65°C | POWER | - | 8541.10.00.80 | UPPER | SOLDER LUG | NOT SPECIFIED | - | NOT SPECIFIED | - | 1 | - | O-MUPM-D1 | Not Qualified | - | Single | - | RECTIFIER DIODE | - | - | ANODE | 40A | - | - | - | - | - | - | - | 1 | - | 10μA | 300V | - | - | - | 800A | - | 1.19V | - | - | - | - | Non-RoHS Compliant | - |