- Manufacturer Part Number
- Manufacturer
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- Reach Compliance Code
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Manufacturer
Microsemi Diodes - Rectifiers - Single
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Number of Pins | Supplier Device Package | Diode Element Material | Number of Elements | Power Dissipation (Max) | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Reference Standard | JESD-30 Code | Qualification Status | Element Configuration | Speed | Diode Type | Current - Reverse Leakage @ Vr | Power Dissipation | Voltage - Forward (Vf) (Max) @ If | Case Connection | Forward Current | Max Reverse Leakage Current | Operating Temperature - Junction | Output Current-Max | Voltage - DC Reverse (Vr) (Max) | Current - Average Rectified (Io) | Forward Voltage | Max Reverse Voltage (DC) | Average Rectified Current | Zener Voltage | Number of Phases | Reverse Recovery Time | Peak Reverse Current | Max Repetitive Reverse Voltage (Vrrm) | Rep Pk Reverse Voltage-Max | JEDEC-95 Code | Capacitance @ Vr, F | Peak Non-Repetitive Surge Current | Forward Voltage-Max | Reverse Recovery Time-Max | Natural Thermal Resistance | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 DSB2810 Microsemi Corporation | In Stock | - | Datasheet | - | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 150°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | WIRE | - | - | - | - | - | - | - | - | Single | Small Signal =< 200mA (Io), Any Speed | Schottky | 100nA @ 15V | - | 410mV @ 1mA | ISOLATED | 75mA | - | -65°C~150°C | 0.075A | - | - | 1V | 20V | 75mA | - | - | - | - | 20V | - | - | 2pF @ 0V 1MHz | - | - | - | - | No | Non-RoHS Compliant | - | ||
 LSM140 MELF Microsemi Corporation | In Stock | - | Datasheet | - | - | - | - | Surface Mount | DO-213AB, MELF | - | DO-213AB | - | - | - | Bulk | 1997 | - | - | - | Active | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 1mA @ 40V | - | 580mV @ 1A | - | - | - | -65°C~150°C | - | 40V | 1A | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | RoHS Compliant | - | ||
 CDLL4150 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | DO-213AA | 2 | - | SILICON | 1 | 0.5W | Bulk | 1999 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD OVER COPPER | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | END | WRAP AROUND | 235 | - | 20 | - | 2 | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 100nA @ 50V | - | 1V @ 200mA | ISOLATED | 300mA | - | -65°C~175°C | - | - | - | 1V | 75V | 300mA | - | - | 4 ns | - | 75V | - | - | 2.5pF @ 0V 1MHz | 4A | - | - | 100 °C/W | No | Non-RoHS Compliant | - | ||
CDLL6675 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | DO-213AA | - | DO-213AA | - | - | - | Bulk | 1997 | - | - | - | Active | 1 (Unlimited) | - | - | - | 125°C | -65°C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Single | Small Signal =< 200mA (Io), Any Speed | Schottky | 5μA @ 20V | - | 500mV @ 200mA | - | 200mA | - | -65°C~125°C | - | 20V | 200mA | - | 20V | 200mA | - | - | - | 5μA | 20V | - | - | 50pF @ 0V 1MHz | - | - | - | 100 °C/W | No | Non-RoHS Compliant | - | ||
 DSB1A40 Microsemi Corporation | In Stock | - | Datasheet | - | - | - | Through Hole | Through Hole | DO-204AL, DO-41, Axial | - | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 125°C | -55°C | - | METALLURGICALLY BONDED | 8541.10.00.80 | - | - | WIRE | - | - | - | - | - | - | O-XALF-W2 | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 100μA @ 40V | - | 600mV @ 1A | ISOLATED | 1A | - | - | 1A | - | - | - | 40V | 1A | - | - | - | 100nA | 40V | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 MSC015SDA120B Microsemi Corporation | 52388 | - | Datasheet | 13 Weeks | - | - | - | Through Hole | TO-247-2 | - | TO-247 | - | - | - | Tube | - | - | - | - | Active | Not Applicable | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No Recovery Time > 500mA (Io) | Silicon Carbide Schottky | - | - | 1.5V @ 15A | - | - | - | - | - | 1200V | 15A DC | - | - | - | - | - | 0ns | - | - | - | - | - | - | - | - | - | - | RoHS Compliant | - | ||
 UPS835L/TR13 Microsemi Corporation | In Stock | - | Datasheet | 19 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | Powermite®3 | 3 | - | - | - | - | Tape & Reel (TR) | 1997 | - | - | no | Active | 1 (Unlimited) | - | - | - | 125°C | -55°C | - | - | - | - | - | - | - | - | - | UPS835 | - | - | - | - | Common Anode | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 1.4mA @ 35V | - | 510mV @ 8A | - | 8A | - | -55°C~125°C | - | - | - | 510mV | 35V | 8A | - | - | - | 1.4mA | 35V | - | - | - | 100A | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTX1N3595-1 Microsemi Corporation | In Stock | - | Datasheet | 14 Weeks | - | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/241 | e0 | - | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 150°C | -65°C | - | - | 8541.10.00.70 | - | - | WIRE | - | - | - | - | 2 | - | - | Qualified | Single | Small Signal =< 200mA (Io), Any Speed | Standard | 1nA @ 125V | 500mW | 920mV @ 100mA | ISOLATED | 200mA | - | -65°C~175°C | 0.15A | - | - | 1V | 125V | 150mA | - | - | 3 μs | 3μA | 125V | - | - | - | 4A | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
JANTX1N6638 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | - | Through Hole | Through Hole | D, Axial | 2 | - | SILICON | 1 | 0.75W | Bulk | 1997 | Military, MIL-PRF-19500/578 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | - | - | WIRE | - | - | - | 1N6638 | 2 | MIL-19500/578E | - | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 125V | - | 1.1V @ 200mA | ISOLATED | - | - | -65°C~175°C | 0.3A | - | - | 1.1V | 125V | 300mA | - | - | 20 ns | 500nA | 150V | - | DO-35 | - | 2.5A | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 1N5614 Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Through Hole | Through Hole | A, Axial | 2 | - | - | - | - | Bulk | - | - | - | - | Active | 1 (Unlimited) | - | - | - | 200°C | -65°C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 500nA @ 200V | - | 1.3V @ 3A | - | - | - | -65°C~200°C | - | 200V | 1A | 1.3V | 200V | 1A | - | - | 2 μs | 500nA | 200V | - | - | - | 30A | - | - | - | Yes | Non-RoHS Compliant | Contains Lead | ||
 1N5809US Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | SQ-MELF, B | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | 175°C | -65°C | ULTRA FAST RECOVERY | HIGH RELIABILITY, METALLURGICALLY BONDED | 8541.10.00.80 | - | END | WRAP AROUND | NOT SPECIFIED | not_compliant | NOT SPECIFIED | - | 2 | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 5μA @ 100V | - | 875mV @ 4A | ISOLATED | 6A | - | -65°C~175°C | 3A | - | - | 875mV | 100V | 3A | - | 1 | 30 ns | 5μA | 100V | - | - | 60pF @ 10V 1MHz | 125A | - | - | - | Yes | Non-RoHS Compliant | Contains Lead | ||
MSC050SDA070B Microsemi Corporation | 52388 | - | Datasheet | 13 Weeks | - | - | - | Through Hole | TO-247-2 | - | TO-247 | - | - | - | Tube | - | - | - | - | Active | Not Applicable | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No Recovery Time > 500mA (Io) | Silicon Carbide Schottky | - | - | 1.5V @ 50A | - | - | - | - | - | 700V | 50A DC | - | - | - | - | - | 0ns | - | - | - | - | - | - | - | - | - | - | RoHS Compliant | - | ||
UES1106 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | - | - | Through Hole | Through Hole | A, Axial | 2 | - | SILICON | 1 | - | Bulk | 1996 | - | e0 | no | Active | Not Applicable | 2 | - | Tin/Lead (Sn/Pb) | 150°C | -55°C | EFFICIENCY | - | 8541.10.00.80 | - | - | WIRE | - | - | - | - | - | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 10μA @ 400V | - | 1.25V @ 1A | ISOLATED | 1A | - | -55°C~150°C | 2A | - | - | 1.25V | 400V | 1A | - | 1 | 50 ns | 10μA | 400V | - | - | - | 20A | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
1N6078 Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Tin | Through Hole | Through Hole | A, Axial | 2 | - | SILICON | 1 | - | Bulk | - | - | e0 | no | Active | 1 (Unlimited) | 2 | - | TIN LEAD | 155°C | -65°C | ULTRA FAST RECOVERY POWER | METALLURGICALLY BONDED, HIGH RELIABILITY | 8541.10.00.80 | - | - | WIRE | NOT SPECIFIED | - | NOT SPECIFIED | - | 2 | MIL-19500/503 | - | Not Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 5μA @ 150V | - | 1.76V @ 18.8A | ISOLATED | 6A | - | -65°C~155°C | 6A | - | - | - | 150V | 1.3A | - | 1 | 30 ns | - | 150V | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
JANTXV1N649-1 Microsemi Corporation | In Stock | - | Datasheet | 13 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/240 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | 1.5W | - | WIRE | - | - | - | - | 2 | MIL-19500 | - | Qualified | Single | Standard Recovery >500ns, > 200mA (Io) | Standard | 50nA @ 600V | - | 1V @ 400mA | ISOLATED | - | 500nA | -65°C~175°C | 0.4A | 600V | 400mA | - | - | - | 5.6V | - | - | - | - | 600V | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 JANTX1N6628U Microsemi Corporation | In Stock | - | Datasheet | - | - | Lead, Tin | Surface Mount | Surface Mount | SQ-MELF, E | 2 | - | SILICON | 1 | - | Bulk | 1997 | Military, MIL-PRF-19500/590 | - | no | Active | 1 (Unlimited) | 2 | - | - | 150°C | -65°C | ULTRA FAST RECOVERY | - | 8541.10.00.80 | - | END | WRAP AROUND | NOT SPECIFIED | - | NOT SPECIFIED | - | 2 | MIL | - | Not Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 2μA @ 600V | - | 1.35V @ 2A | ISOLATED | 4A | - | -65°C~150°C | 2A | - | 1.75A | 1.5V | - | - | - | 1 | 30ns | - | 600V | - | - | - | 75A | - | - | - | - | Non-RoHS Compliant | - | ||
 S20460 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Stud | - | - | 2 | - | SILICON | 1 | - | - | 1997 | - | e0 | no | Active | - | 1 | EAR99 | TIN LEAD | 200°C | -65°C | POWER | EXCELLENT RELIABILITY | 8541.10.00.80 | - | UPPER | SOLDER LUG | - | - | - | - | 1 | - | O-MUPM-D1 | - | Single | - | RECTIFIER DIODE | - | - | - | CATHODE | 12A | - | - | - | - | - | 1.2V | - | - | - | 1 | - | 10μA | 600V | - | - | - | 250A | - | 5μs | - | No | Non-RoHS Compliant | - | ||
 S20100 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Stud | - | - | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | - | 1 | EAR99 | TIN LEAD | 200°C | -65°C | POWER | EXCELLENT RELIABILITY | 8541.10.00.80 | - | UPPER | SOLDER LUG | - | - | - | - | 1 | - | O-MUPM-D1 | - | Single | - | RECTIFIER DIODE | - | - | - | CATHODE | 16A | - | - | - | - | - | - | - | - | - | 1 | - | 10μA | 1kV | 1000V | - | - | 200A | 1.3V | 5μs | - | No | Non-RoHS Compliant | - | ||
 1N1200B Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Stud | - | - | 2 | - | SILICON | 1 | - | Bulk | 1997 | - | e0 | no | Active | - | 1 | - | TIN LEAD | 200°C | -65°C | POWER | - | 8541.10.00.80 | - | UPPER | SOLDER LUG | - | - | - | - | 1 | - | O-MUPM-D1 | - | Single | - | RECTIFIER DIODE | - | - | - | CATHODE | 12A | - | - | - | - | - | - | - | - | - | 1 | - | 10μA | 100V | - | - | - | 250A | - | 5μs | - | No | Non-RoHS Compliant | - | ||
1N3883 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Stud | - | - | 2 | - | SILICON | 1 | - | Bulk | - | - | e0 | no | Active | - | 1 | - | TIN LEAD | 150°C | -65°C | FAST RECOVERY | - | 8541.10.00.80 | - | UPPER | SOLDER LUG | - | - | - | - | 1 | - | O-MUPM-D1 | - | Single | - | RECTIFIER DIODE | - | - | - | CATHODE | 6A | - | - | 6A | - | - | - | - | - | - | 1 | 200 ns | 15μA | 400V | - | - | - | 200A | 1.4V | - | - | No | Non-RoHS Compliant | - |