- Manufacturer Part Number
- Manufacturer
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- Ihs Manufacturer
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- Reach Compliance Code
- Risk Rank
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- Number of Elements
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- Diode Element Material
- JESD-30 Code
Attribute column
Manufacturer
Microsemi Diodes - Rectifiers - Single
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Number of Pins | Diode Element Material | Number of Elements | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | Reference Standard | JESD-30 Code | Qualification Status | Element Configuration | Speed | Diode Type | Current - Reverse Leakage @ Vr | Voltage - Forward (Vf) (Max) @ If | Case Connection | Forward Current | Operating Temperature - Junction | Output Current-Max | Current - Average Rectified (Io) | Forward Voltage | Max Reverse Voltage (DC) | Average Rectified Current | Number of Phases | Reverse Recovery Time | Peak Reverse Current | Max Repetitive Reverse Voltage (Vrrm) | Capacitance @ Vr, F | Peak Non-Repetitive Surge Current | Forward Voltage-Max | Reverse Recovery Time-Max | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 JAN1N5619US Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | SQ-MELF, A | 2 | SILICON | 1 | Bulk | 1997 | Military, MIL-PRF-19500/429 | - | - | Active | 1 (Unlimited) | 2 | EAR99 | - | 175°C | -65°C | - | - | 8541.10.00.80 | END | WRAP AROUND | - | - | - | 2 | - | - | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 600V | 1.6V @ 3A | ISOLATED | - | -65°C~175°C | 1A | 1A | 1.6V | - | - | - | 250 ns | 500nA | 600V | 25pF @ 12V 1MHz | 30A | - | - | No | Non-RoHS Compliant | ||
 JAN1N5615US Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | SQ-MELF, A | 2 | SILICON | 1 | Bulk | 1997 | Military, MIL-PRF-19500/429 | - | - | Active | 1 (Unlimited) | 2 | EAR99 | - | 175°C | -65°C | - | HIGH RELIABILITY | 8541.10.00.80 | END | WRAP AROUND | - | - | - | 2 | - | - | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500μA @ 200V | 800mV @ 3A | ISOLATED | - | -65°C~200°C | 1A | 1A | 1.6V | - | - | - | 150 ns | 500nA | 200V | - | 30A | - | - | No | Non-RoHS Compliant | ||
 JAN1N6642U Microsemi Corporation | In Stock | - | Datasheet | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | SQ-MELF, D | 2 | SILICON | 1 | Bulk | 1999 | Military, MIL-PRF-19500/578 | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | Tin/Lead (Sn/Pb) | 175°C | -65°C | - | METALLURGICALLY BONDED | 8541.10.00.70 | END | WRAP AROUND | NOT SPECIFIED | not_compliant | NOT SPECIFIED | 2 | MIL-19500/578E | - | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 500nA @ 75V | 1.2V @ 100mA | ISOLATED | - | -65°C~175°C | 0.3A | - | 1.2V | 75V | 300mA | - | 5 ns | - | - | - | 2.5A | - | - | - | Non-RoHS Compliant | ||
 1N5808 Microsemi Corporation | In Stock | - | - | 7 Weeks | - | - | Through Hole | - | - | 2 | SILICON | 1 | - | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | - | - | ULTRA FAST RECOVERY | METALLURGICALLY BONDED | 8541.10.00.80 | AXIAL | WIRE | - | - | - | - | - | - | - | Single | - | RECTIFIER DIODE | - | - | ISOLATED | 6A | - | 6A | - | - | - | - | 1 | 30 ns | 5μA | 75V | - | 125A | - | - | No | Non-RoHS Compliant | ||
 1N6626 Microsemi Corporation | In Stock | - | Datasheet | 17 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | Lead, Tin | Through Hole | Through Hole | A, Axial | 2 | SILICON | 1 | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | - | TIN LEAD | 150°C | -65°C | ULTRA FAST RECOVERY | METALLURGICALLY BONDED, HIGH RELIABILITY | 8541.10.00.80 | - | WIRE | NOT SPECIFIED | - | NOT SPECIFIED | 2 | - | - | Not Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 2μA @ 220V | 1.35V @ 2A | ISOLATED | 1.75A | -65°C~150°C | - | - | - | 220V | 1.75A | 1 | 30 ns | - | 220V | 40pF @ 10V 1MHz | - | - | - | - | Non-RoHS Compliant | ||
1N5419US Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | E-MELF | 2 | SILICON | 1 | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | - | TIN LEAD | 175°C | -65°C | - | HIGH RELIABILITY, METALLURGICALLY BONDED | 8541.10.00.80 | END | WRAP AROUND | NOT SPECIFIED | - | NOT SPECIFIED | 2 | - | - | Not Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 1μA @ 500V | 1.5V @ 9A | ISOLATED | - | -65°C~175°C | 3A | - | 1.5V | 500V | 3A | 1 | 250 ns | 1μA | 500V | - | 80A | - | - | Yes | Non-RoHS Compliant | ||
 JAN1N5416US Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Surface Mount, Through Hole | Through Hole | B, Axial | 2 | SILICON | 1 | Bulk | 1997 | Military, MIL-PRF-19500/411 | - | - | Active | 1 (Unlimited) | 2 | - | - | 175°C | -65°C | FAST RECOVERY POWER | - | 8541.10.00.80 | END | WRAP AROUND | - | - | - | 2 | MIL-19500/411L | - | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 1μA @ 100V | 1.5V @ 9A | ISOLATED | - | -65°C~175°C | 3A | - | - | 100V | 3A | 1 | 150 ns | 1μA | 100V | - | 80A | - | - | No | Non-RoHS Compliant | ||
 DSB3A30 Microsemi Corporation | In Stock | - | Datasheet | - | - | - | Through Hole | Through Hole | DO-204AH, DO-35, Axial | 2 | SILICON | 1 | Bulk | 1997 | - | e0 | no | Active | 1 (Unlimited) | 2 | EAR99 | TIN LEAD | 125°C | -65°C | GENERAL PURPOSE | METALLURGICALLY BONDED | 8541.10.00.80 | - | WIRE | - | - | - | 2 | - | - | - | Single | Fast Recovery =< 500ns, > 200mA (Io) | Schottky | 100μA @ 30V | 500mV @ 3A | ISOLATED | 3A | -65°C~125°C | 3A | - | - | 30V | 3A | 1 | - | 100μA | 30V | - | - | - | - | No | Non-RoHS Compliant | ||
 JAN1N5190 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | Through Hole | B, Axial | 2 | SILICON | 1 | Bulk | 1997 | Military, MIL-PRF-19500/420 | e0 | - | Active | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | 175°C | -65°C | FAST RECOVERY POWER | - | 8541.10.00.80 | - | WIRE | - | - | - | 2 | - | - | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 2μA @ 600V | 1.5V @ 9A | ISOLATED | 3A | -65°C~175°C | 3A | - | 1.5V | - | - | 1 | 400 ns | 2μA | 600V | - | 80A | - | - | No | Non-RoHS Compliant | ||
JANTX1N5416US Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Surface Mount | Surface Mount | SQ-MELF, B | 2 | SILICON | 1 | Bulk | - | Military, MIL-PRF-19500/411 | e0 | - | Active | 1 (Unlimited) | 2 | - | Tin/Lead (Sn/Pb) | 175°C | -65°C | FAST RECOVERY POWER | - | 8541.10.00.80 | END | WRAP AROUND | 235 | - | 20 | - | MIL-19500/411L | - | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 1μA @ 100V | 1.5V @ 9A | ISOLATED | - | -65°C~175°C | 3A | - | - | 100V | 3A | 1 | 150 ns | 1μA | 100V | - | 80A | - | - | No | Non-RoHS Compliant | ||
 JAN1N3909R Microsemi Corporation | In Stock | - | - | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Stud | Stud Mount | DO-203AB, DO-5, Stud | 2 | SILICON | 1 | Bulk | 1997 | Military, MIL-PRF-19500/308 | e0 | no | Active | 1 (Unlimited) | 1 | EAR99 | Tin/Lead (Sn/Pb) | 150°C | -65°C | - | - | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | 2 | MIL-19500/308 | O-MUPM-D1 | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 15μA @ 50V | 1.4V @ 50A | ISOLATED | 30A | -65°C~150°C | 50A | 50A | 1.4V | - | - | 1 | 200 ns | 15μA | 50V | - | 300A | - | - | No | Non-RoHS Compliant | ||
JANTX1N3911 Microsemi Corporation | In Stock | - | - | - | IN PRODUCTION (Last Updated: 1 month ago) | - | Stud | Chassis, Stud Mount | DO-203AB, DO-5, Stud | 2 | SILICON | 1 | Bulk | 1997 | Military, MIL-PRF-19500/308 | e0 | no | Active | 1 (Unlimited) | 1 | - | Tin/Lead (Sn/Pb) | 150°C | -65°C | - | - | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | 2 | MIL-19500/308 | O-MUPM-D1 | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 15μA @ 200V | 1.4V @ 50A | ISOLATED | 30A | -65°C~150°C | 50A | 50A | 1.4V | - | - | 1 | 200 ns | 15μA | 200V | - | 300A | - | - | No | Non-RoHS Compliant | ||
JANTXV1N3911 Microsemi Corporation | In Stock | - | - | - | IN PRODUCTION (Last Updated: 1 month ago) | - | Stud | Chassis, Stud Mount | DO-203AB, DO-5, Stud | 2 | SILICON | 1 | Bulk | 1997 | Military, MIL-PRF-19500/308 | e0 | no | Active | 1 (Unlimited) | 1 | - | Tin/Lead (Sn/Pb) | 150°C | -65°C | - | - | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | 2 | MIL-19500/308 | O-MUPM-D1 | Qualified | Single | Fast Recovery =< 500ns, > 200mA (Io) | Standard | 15μA @ 200V | 1.4V @ 50A | ISOLATED | 30A | -65°C~150°C | 50A | 50A | 1.4V | - | - | 1 | 200 ns | 15μA | 200V | - | 300A | - | - | No | Non-RoHS Compliant | ||
1N3766R Microsemi Corporation | In Stock | - | Datasheet | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Stud | - | - | 2 | SILICON | 1 | Bulk | 1997 | - | e0 | no | Active | - | 1 | - | TIN LEAD | 175°C | -65°C | POWER | - | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | 1 | - | O-MUPM-D1 | - | Single | - | RECTIFIER DIODE | - | - | - | 35A | - | - | - | - | - | - | 1 | - | 10μA | 800V | - | 500A | 1.8V | 10μs | No | Non-RoHS Compliant | ||
UFR8515R Microsemi Corporation | 2935 |
| Datasheet | - | - | - | Stud | - | - | 2 | SILICON | 1 | Bulk | 1997 | - | e0 | no | Active | - | 1 | EAR99 | TIN LEAD | 175°C | -65°C | ULTRA FAST RECOVERY | - | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | 1 | - | O-MUPM-D1 | - | Single | - | RECTIFIER DIODE | - | - | - | 85A | - | - | - | - | - | - | 1 | 50 ns | 50μA | 150V | - | 1.5kA | 0.975V | - | No | Non-RoHS Compliant | ||
UFR3140R Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Stud | - | - | 2 | SILICON | 1 | Bulk | 1997 | - | e0 | no | Active | - | 1 | EAR99 | TIN LEAD | 175°C | -65°C | ULTRA FAST RECOVERY | HIGH RELIABILITY | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | 1 | - | O-MUPM-D1 | - | Single | - | RECTIFIER DIODE | - | - | - | 30A | - | - | - | - | - | - | 1 | 50 ns | 15μA | 400V | - | 400A | - | - | No | Non-RoHS Compliant | ||
JANTX1N1186R Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Stud | - | - | 2 | SILICON | 1 | Bulk | - | - | e0 | no | Active | - | 1 | - | Tin/Lead (Sn/Pb) - hot dipped | 175°C | -65°C | POWER | - | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | 1 | - | O-MUPM-D1 | Qualified | Single | - | RECTIFIER DIODE | - | - | - | 35A | - | - | - | - | - | - | 1 | - | 10μA | 200V | - | 500A | - | - | No | Non-RoHS Compliant | ||
JANTX1N1616R Microsemi Corporation | In Stock | - | Datasheet | 18 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Stud | Chassis, Stud Mount | DO-203AA, DO-4, Stud | 2 | SILICON | 1 | Bulk | 1997 | Military, MIL-PRF-19500/162 | e0 | no | Active | 1 (Unlimited) | 1 | - | Tin/Lead (Sn/Pb) | 175°C | -65°C | POWER | - | 8541.10.00.80 | UPPER | SOLDER LUG | - | - | - | 1 | - | O-MUPM-D1 | Qualified | Single | Standard Recovery >500ns, > 200mA (Io) | Standard, Reverse Polarity | 50μA @ 600V | 1.5V @ 15A | CATHODE | 15A | -65°C~175°C | - | - | - | - | - | 1 | - | 50μA | 600V | - | 100A | - | - | No | Non-RoHS Compliant | ||
1N1196A Microsemi Corporation | In Stock | - | Datasheet | 20 Weeks | - | - | - | - | - | - | - | - | - | 1997 | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | ||
 UES2604 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | Through Hole | - | TO-3 | - | SILICON | 2 | Bulk | 1997 | - | e0 | no | Active | Not Applicable | 2 | - | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | 150°C | -55°C | EFFICIENCY | - | 8541.10.00.80 | BOTTOM | PIN/PEG | - | - | - | 2 | - | O-MBFM-P2 | - | Common Cathode | - | RECTIFIER DIODE | - | - | - | 30A | - | - | - | 1.25V | - | - | 1 | 50 ns | 50μA | 200V | - | 300A | - | - | No | Non-RoHS Compliant |