- Architecture
- Connectivity
- Core Processor
- Flash Size
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
Attribute column
Manufacturer
Microsemi Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Core Architecture | Number of Gates | Number of Logic Blocks (LABs) | Primary Attributes | Number of Logic Cells | Flash Size | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S060T-FCSG325I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | - | - | 325-CSPBGA (11x11) | 200 | -40°C~100°C TJ | Tray | - | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | FPGA - 60K Logic Modules | - | 256KB | - | - | - | - | RoHS Compliant | Lead Free | ||
 M2S150-FCVG484I Microsemi Corporation | 26 | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BFBGA | YES | - | - | 273 | -40°C~100°C TJ | Tray | - | SmartFusion®2 | e3 | Active | 4 (72 Hours) | 484 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | 273 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | - | RoHS Compliant | - | ||
 M2S025T-VFG256 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 256-LBGA | YES | - | - | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | - | - | LG-MIN, WD-MIN | - | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B256 | 138 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | - | RoHS Compliant | - | ||
 M2S005-TQG144I Microsemi Corporation | 2468 | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 144-LQFP | YES | 144 | - | 84 | -40°C~100°C TJ | Tray | 2000 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 144 | MATTE TIN | - | - | - | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | - | 84 | Not Qualified | 1.2V | 1.26V | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | - | RoHS Compliant | Lead Free | ||
M2S005S-FGG484I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | - | - | 209 | -40°C~100°C TJ | Tray | 2010 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | 209 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 209 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 5K Logic Modules | 6060 | 128KB | 2.44mm | 23mm | 23mm | - | RoHS Compliant | - | ||
A2F200M3F-1FG256 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | 256-LBGA | YES | 256 | - | MCU - 25, FPGA - 66 | 0°C~85°C TJ | Tray | 2009 | SmartFusion® | - | Active | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | - | - | - | - | BOTTOM | BALL | 225 | 1.5V | 1mm | - | 100MHz | 30 | A2F200 | - | 66 | - | - | 1.575V | - | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | - | - | 3mA | - | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | - | FIELD PROGRAMMABLE GATE ARRAY | ARM | 200000 | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | 256KB | 1.7mm | 17mm | 17mm | No | Non-RoHS Compliant | - | ||
M2S010-1TQG144 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 144-LQFP | YES | - | - | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 144 | MATTE TIN | - | - | - | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | S-PQFP-G144 | 84 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 10K Logic Modules | - | 256KB | 1.6mm | 20mm | 20mm | - | RoHS Compliant | - | ||
M2S010TS-VFG256I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | 256-LBGA | YES | - | - | 138 | -40°C~100°C TJ | Tray | - | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B256 | 138 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | - | RoHS Compliant | - | ||
M2S005-1TQG144 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 144-LQFP | YES | - | - | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 144 | MATTE TIN | - | - | - | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | S-PQFP-G144 | 84 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | - | RoHS Compliant | - | ||
A2F200M3F-1FGG484I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | 484-BGA | YES | 484 | - | MCU - 41, FPGA - 94 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | e1 | Active | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | BOTTOM | BALL | 250 | 1.5V | 1mm | - | 100MHz | 30 | A2F200 | - | 94 | Not Qualified | 1.5V | - | - | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 1mA | - | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | - | FIELD PROGRAMMABLE GATE ARRAY | ARM | 200000 | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | 256KB | 2.44mm | 23mm | 23mm | - | RoHS Compliant | - | ||
M2S025TS-1VF256 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 256-LFBGA | YES | - | - | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B256 | 138 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | - | Non-RoHS Compliant | - | ||
M2S025TS-1VFG256 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 256-LBGA | YES | - | - | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B256 | 138 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | - | RoHS Compliant | - | ||
M2S010TS-VFG256 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | 256-LBGA | YES | - | - | 138 | 0°C~85°C TJ | Tray | - | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B256 | 138 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | - | RoHS Compliant | - | ||
M2S025TS-FGG484 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | YES | - | - | 267 | 0°C~85°C TJ | Tray | - | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Modules | 27696 | 256KB | 2.44mm | 23mm | 23mm | - | RoHS Compliant | - | ||
M2S010-1FGG484I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | - | - | 484-FPBGA (23x23) | 233 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S010 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | ARM | - | - | FPGA - 10K Logic Modules | - | 256KB | - | - | - | - | RoHS Compliant | - | ||
M2S060-1FCSG325I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | - | - | 200 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 60K Logic Modules | 56520 | 256KB | 1.01mm | 11mm | 11mm | - | RoHS Compliant | - | ||
M2S025-1VF256 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | 256-LFBGA | YES | - | - | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B256 | 138 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | - | Non-RoHS Compliant | - | ||
 M2S060-FG676I Microsemi Corporation | In Stock | - | Datasheet | 6 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 676-BGA | YES | - | - | 387 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B676 | 387 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | - | Non-RoHS Compliant | - | ||
M2S090TS-FG484 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | - | - | 267 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | - | Non-RoHS Compliant | - | ||
 M2S150-FCSG536 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 536-LFBGA, CSPBGA | YES | - | - | 293 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | - | - | - | NOT SPECIFIED | - | S-PBGA-B536 | 293 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 150K Logic Modules | 146124 | 512KB | - | - | - | - | RoHS Compliant | - |